JPS6448068U - - Google Patents
Info
- Publication number
- JPS6448068U JPS6448068U JP14343287U JP14343287U JPS6448068U JP S6448068 U JPS6448068 U JP S6448068U JP 14343287 U JP14343287 U JP 14343287U JP 14343287 U JP14343287 U JP 14343287U JP S6448068 U JPS6448068 U JP S6448068U
- Authority
- JP
- Japan
- Prior art keywords
- metal substrates
- conductive path
- wiring board
- printed wiring
- insulating film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000002184 metal Substances 0.000 claims description 5
- 239000000758 substrate Substances 0.000 claims description 5
- 239000000463 material Substances 0.000 claims description 3
- 230000002093 peripheral effect Effects 0.000 claims 1
Landscapes
- Multi-Conductor Connections (AREA)
- Combinations Of Printed Boards (AREA)
Description
第１図は本考案の実施例を示す断面図、第２図
は他の実施例を示す断面図、第３図及び第４図は
従来例を示す断面図である。
１，２は金属基板、４はケース材、５は溝部、
６は導電路、８はプリント配線板、９は回路素子
、１０は外部リード、１２は端子。
FIG. 1 is a sectional view showing an embodiment of the present invention, FIG. 2 is a sectional view showing another embodiment, and FIGS. 3 and 4 are sectional views showing a conventional example. 1 and 2 are metal substrates, 4 is a case material, 5 is a groove part,
6 is a conductive path, 8 is a printed wiring board, 9 is a circuit element, 10 is an external lead, and 12 is a terminal.
Claims (1)
けられた絶縁膜と、前記絶縁膜上に形成された所
望の導電路と、前記導電路上に固着された複数の
回路素子と、前記導電路の延在される前記夫々の
金属基板の少なくとも一側辺周端部に外部回路と
接続するために形成された導電パツドと、前記二
枚の金属基板を離間する枠状の枠部を有するケー
ス材とを備えた混成集積回路において、前記枠部
の略中央部にプリント配線板が挿入される溝部を
設け、前記溝部が前記プリント配線板の側面に挿
入一体化されたことを特徴とする混成集積回路。 two metal substrates, an insulating film provided on the two metal substrates, a desired conductive path formed on the insulating film, a plurality of circuit elements fixed on the conductive path, and the A conductive pad formed for connection to an external circuit at the peripheral edge of at least one side of each of the metal substrates on which a conductive path extends, and a frame-shaped frame portion separating the two metal substrates. A hybrid integrated circuit comprising a case material having a case material, wherein a groove portion into which a printed wiring board is inserted is provided approximately at the center of the frame portion, and the groove portion is inserted and integrated into a side surface of the printed wiring board. hybrid integrated circuit.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14343287U JPH0519974Y2 (en) | 1987-09-18 | 1987-09-18 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14343287U JPH0519974Y2 (en) | 1987-09-18 | 1987-09-18 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6448068U true JPS6448068U (en) | 1989-03-24 |
| JPH0519974Y2 JPH0519974Y2 (en) | 1993-05-25 |
Family
ID=31410253
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14343287U Expired - Lifetime JPH0519974Y2 (en) | 1987-09-18 | 1987-09-18 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0519974Y2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101008607B1 (en) | 2002-05-31 | 2011-01-17 | 톰슨 라이센싱 | Screening device for printed circuit cards |
-
1987
- 1987-09-18 JP JP14343287U patent/JPH0519974Y2/ja not_active Expired - Lifetime
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101008607B1 (en) | 2002-05-31 | 2011-01-17 | 톰슨 라이센싱 | Screening device for printed circuit cards |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0519974Y2 (en) | 1993-05-25 |
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