JPS62104458U - - Google Patents
Info
- Publication number
- JPS62104458U JPS62104458U JP19667985U JP19667985U JPS62104458U JP S62104458 U JPS62104458 U JP S62104458U JP 19667985 U JP19667985 U JP 19667985U JP 19667985 U JP19667985 U JP 19667985U JP S62104458 U JPS62104458 U JP S62104458U
- Authority
- JP
- Japan
- Prior art keywords
- integrated circuit
- hybrid integrated
- insulating film
- pad
- external lead
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims 1
- 239000011889 copper foil Substances 0.000 claims 1
Landscapes
- Lead Frames For Integrated Circuits (AREA)
- Insulated Metal Substrates For Printed Circuits (AREA)
Description
第１図は本考案の実施例を示す断面図、第２図
は本実施例を示す平面図、第３図は従来例を示す
断面図である。
１……混成集積回路、２……絶縁フイルム、３
……舌片部、４……導電路、５……導電パツド、
６……回路素子、７……外部リード。
FIG. 1 is a sectional view showing an embodiment of the present invention, FIG. 2 is a plan view showing this embodiment, and FIG. 3 is a sectional view showing a conventional example. 1... Hybrid integrated circuit, 2... Insulating film, 3
... tongue piece part, 4 ... conductive path, 5 ... conductive pad,
6...Circuit element, 7...External lead.
Claims (1)
イルムと、該絶縁フイルム上貼着した銅箔を所望
形状に形成した導電路と、該導電路が延在された
端部に設けたパツドと、前記導電路上に設けた複
数の回路素子と、前記パツド上に固着された外部
リードとを具備して成る混成集積回路に於いて、
前記混成集積回路基板の外部リードが設けられる
側辺に前記絶縁フイルムから成る舌片部を有する
ことを特徴とした混成集積回路。 A hybrid integrated circuit board, an insulating film provided on the board, a conductive path formed of a copper foil stuck on the insulating film into a desired shape, and a pad provided at the end of the conductive path. , in a hybrid integrated circuit comprising a plurality of circuit elements provided on the conductive surface and an external lead fixed on the pad,
A hybrid integrated circuit characterized in that a tongue portion made of the insulating film is provided on a side of the hybrid integrated circuit board where an external lead is provided.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19667985U JPS62104458U (en) | 1985-12-20 | 1985-12-20 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19667985U JPS62104458U (en) | 1985-12-20 | 1985-12-20 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62104458U true JPS62104458U (en) | 1987-07-03 |
Family
ID=31155720
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP19667985U Pending JPS62104458U (en) | 1985-12-20 | 1985-12-20 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62104458U (en) |
-
1985
- 1985-12-20 JP JP19667985U patent/JPS62104458U/ja active Pending