JPS62168678U - - Google Patents
Info
- Publication number
- JPS62168678U JPS62168678U JP5692386U JP5692386U JPS62168678U JP S62168678 U JPS62168678 U JP S62168678U JP 5692386 U JP5692386 U JP 5692386U JP 5692386 U JP5692386 U JP 5692386U JP S62168678 U JPS62168678 U JP S62168678U
- Authority
- JP
- Japan
- Prior art keywords
- metal substrate
- conductive path
- integrated circuit
- film
- bent
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002184 metal Substances 0.000 claims description 5
- 239000000758 substrate Substances 0.000 claims description 5
Landscapes
- Insulated Metal Substrates For Printed Circuits (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Structure Of Printed Boards (AREA)
Description
第1図は本考案の実施例を示す断面図、第2図
は従来例を示す断面図である。
1…金属基板、2…剥離膜、3…絶縁フイルム
、4…導電路、5…回路素子。
FIG. 1 is a sectional view showing an embodiment of the present invention, and FIG. 2 is a sectional view showing a conventional example. DESCRIPTION OF SYMBOLS 1... Metal substrate, 2... Peeling film, 3... Insulating film, 4... Conductive path, 5... Circuit element.
Claims (1)
と、該フイルム上に設けた所望の導電路と、該導
電路上に固着された複数の回路素子とを具備し、
前記金属基板を折曲げる混成集積回路において、
前記金属基板の折曲げ部に剥離膜を配置すること
を特徴とする混合集積回路。 A metal substrate, an insulating film provided on the metal substrate, a desired conductive path provided on the film, and a plurality of circuit elements fixed on the conductive path,
In the hybrid integrated circuit in which the metal substrate is bent,
A mixed integrated circuit characterized in that a release film is disposed on the bent portion of the metal substrate.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP5692386U JPS62168678U (en) | 1986-04-16 | 1986-04-16 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP5692386U JPS62168678U (en) | 1986-04-16 | 1986-04-16 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS62168678U true JPS62168678U (en) | 1987-10-26 |
Family
ID=30886165
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP5692386U Pending JPS62168678U (en) | 1986-04-16 | 1986-04-16 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS62168678U (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6386491A (en) * | 1986-09-29 | 1988-04-16 | イビデン株式会社 | Metallic core printed wiring board |
-
1986
- 1986-04-16 JP JP5692386U patent/JPS62168678U/ja active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6386491A (en) * | 1986-09-29 | 1988-04-16 | イビデン株式会社 | Metallic core printed wiring board |