JPS6365245U - - Google Patents

Info

Publication number
JPS6365245U
JPS6365245U JP1986159714U JP15971486U JPS6365245U JP S6365245 U JPS6365245 U JP S6365245U JP 1986159714 U JP1986159714 U JP 1986159714U JP 15971486 U JP15971486 U JP 15971486U JP S6365245 U JPS6365245 U JP S6365245U
Authority
JP
Japan
Prior art keywords
metal substrate
conductive path
connector portion
conductive
sealing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1986159714U
Other languages
Japanese (ja)
Other versions
JPH0715141Y2 (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP15971486U priority Critical patent/JPH0715141Y2/en
Priority to DE8787114938T priority patent/DE3777324D1/en
Priority to EP87114938A priority patent/EP0264780B1/en
Priority to US07/107,990 priority patent/US4884125A/en
Priority to KR1019870011409A priority patent/KR900007232B1/en
Publication of JPS6365245U publication Critical patent/JPS6365245U/ja
Application granted granted Critical
Publication of JPH0715141Y2 publication Critical patent/JPH0715141Y2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Landscapes

  • Insulated Metal Substrates For Printed Circuits (AREA)
  • Combinations Of Printed Boards (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は本考案の一実施例を示す断面図、第２
図はその平面図、第３図は本実施例の混成集積回
路をプリント基板に挿入した際の断面図、第４図
乃至第６図は他の実施例を示す図、第７図乃至第
１１図は従来例を示す図である。 １は金属基板、２はケース材、３は外部リード
、６はコネクタ部。 Fig. 1 is a sectional view showing one embodiment of the present invention;
The figure is a plan view, FIG. 3 is a sectional view when the hybrid integrated circuit of this embodiment is inserted into a printed circuit board, FIGS. 4 to 6 are views showing other embodiments, and FIGS. 7 to 11. The figure shows a conventional example. 1 is a metal board, 2 is a case material, 3 is an external lead, and 6 is a connector part.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 金属基板と、該金属基板上に設けられた絶縁膜
と、該絶縁膜上に形成された所望形状の導電路と
、該導電路上に固着された複数の回路素子と、前
記導電路の延在される前記金属基板の周端部に形
成される複数の導電パツドと、絶縁樹脂よりなり
前記回路素子を密封する封止部と前記封止部より
前記金属基板の端部より突出するコネクタ部とを
有するケース材と、前記導電パツドに一端を固着
され前記ケース材のコネクタ部に当接し該コネク
タ部の反主面まで延在される外部リードとを備え
たことを特徴とする混成集積回路。 A metal substrate, an insulating film provided on the metal substrate, a conductive path of a desired shape formed on the insulating film, a plurality of circuit elements fixed on the conductive path, and an extension of the conductive path. a plurality of conductive pads formed on the peripheral edge of the metal substrate; a sealing portion made of insulating resin and sealing the circuit element; and a connector portion protruding from the sealing portion from the edge of the metal substrate. and an external lead having one end fixed to the conductive pad, coming into contact with a connector portion of the case material, and extending to the opposite main surface of the connector portion.
JP15971486U 1986-10-15 1986-10-17 Hybrid integrated circuit Expired - Lifetime JPH0715141Y2 (en)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP15971486U JPH0715141Y2 (en) 1986-10-17 1986-10-17 Hybrid integrated circuit
DE8787114938T DE3777324D1 (en) 1986-10-15 1987-10-13 INTEGRATED HYBRID CIRCUIT ARRANGEMENT THAT CAN BE INSERTED INTO A BASE.
EP87114938A EP0264780B1 (en) 1986-10-15 1987-10-13 Hybrid integrated circuit device capable of being inserted into socket
US07/107,990 US4884125A (en) 1986-10-15 1987-10-13 Hybrid integrated circuit device capable of being inserted into socket
KR1019870011409A KR900007232B1 (en) 1986-10-15 1987-10-14 Hybrid intergrated circuit device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15971486U JPH0715141Y2 (en) 1986-10-17 1986-10-17 Hybrid integrated circuit

Publications (2)

Publication Number Publication Date
JPS6365245U true JPS6365245U (en) 1988-04-30
JPH0715141Y2 JPH0715141Y2 (en) 1995-04-10

Family

ID=31084401

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15971486U Expired - Lifetime JPH0715141Y2 (en) 1986-10-15 1986-10-17 Hybrid integrated circuit

Country Status (1)

Country Link
JP (1) JPH0715141Y2 (en)

Also Published As

Publication number Publication date
JPH0715141Y2 (en) 1995-04-10

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