JPS63131171U - - Google Patents
Info
- Publication number
- JPS63131171U JPS63131171U JP2232887U JP2232887U JPS63131171U JP S63131171 U JPS63131171 U JP S63131171U JP 2232887 U JP2232887 U JP 2232887U JP 2232887 U JP2232887 U JP 2232887U JP S63131171 U JPS63131171 U JP S63131171U
- Authority
- JP
- Japan
- Prior art keywords
- metal substrate
- conductive
- tip
- extending
- thin layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002184 metal Substances 0.000 claims description 6
- 239000000758 substrate Substances 0.000 claims 5
- 239000011347 resin Substances 0.000 claims 1
- 229920005989 resin Polymers 0.000 claims 1
- 239000000463 material Substances 0.000 description 1
Landscapes
- Combinations Of Printed Boards (AREA)
Description
第１図及び第２図は本考案の実施例を示す断面
図、第３図は他の実施例を示す断面図、第４図乃
至第６図は従来例を示す断面図である。
１……金属基板、２……ケース材、３……外部
リード、４……回路素子、５……密封空間、６…
…突出部、７……取付け板、８……ソケツト空間
、９……コネクタ部、１０……電極。
1 and 2 are sectional views showing an embodiment of the present invention, FIG. 3 is a sectional view showing another embodiment, and FIGS. 4 to 6 are sectional views showing a conventional example. DESCRIPTION OF SYMBOLS 1...Metal board, 2...Case material, 3...External lead, 4...Circuit element, 5...Sealed space, 6...
...Protruding portion, 7...Mounting plate, 8...Socket space, 9...Connector portion, 10...Electrode.
Claims (1)
薄層と、前記絶縁薄層上に形成された所望形状の
導電路と、前記導電路とに固着された複数の回路
素子と、前記金属基板の少なくとも一周端部に形
成された複数の導電パツドと、絶縁樹脂から構成
され前記導電パツドが形成された前記金属基板の
少なくとも一周端部より外方に突出する突出部を
有するケース材と、前記導電パツドに一端が固着
され前記突出部の略先端部まで当接延在されると
共に前記先端部付近で湾曲配置された外部リード
とを備えたことを特徴とする混成集積回路。 A metal substrate, an insulating thin layer provided on the metal substrate, a conductive path having a desired shape formed on the insulating thin layer, a plurality of circuit elements fixed to the conductive path, and the metal substrate. a plurality of conductive pads formed on at least one circumferential edge of the metal substrate, and a case member having a protruding portion that is made of an insulating resin and protrudes outward from at least one circumferential edge of the metal substrate on which the conductive pads are formed; What is claimed is: 1. A hybrid integrated circuit comprising: an external lead having one end fixed to a conductive pad, extending into contact with and extending to approximately the tip of the protrusion, and curved near the tip.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2232887U JPS63131171U (en) | 1987-02-18 | 1987-02-18 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2232887U JPS63131171U (en) | 1987-02-18 | 1987-02-18 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63131171U true JPS63131171U (en) | 1988-08-26 |
Family
ID=30819611
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2232887U Pending JPS63131171U (en) | 1987-02-18 | 1987-02-18 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63131171U (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6365245B2 (en) * | 1982-03-31 | 1988-12-15 |
-
1987
- 1987-02-18 JP JP2232887U patent/JPS63131171U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6365245B2 (en) * | 1982-03-31 | 1988-12-15 |
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