JPH0298674U - - Google Patents
Info
- Publication number
- JPH0298674U JPH0298674U JP788689U JP788689U JPH0298674U JP H0298674 U JPH0298674 U JP H0298674U JP 788689 U JP788689 U JP 788689U JP 788689 U JP788689 U JP 788689U JP H0298674 U JPH0298674 U JP H0298674U
- Authority
- JP
- Japan
- Prior art keywords
- lead
- circuit board
- semiconductor module
- tip
- fitting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims 3
- 230000005489 elastic deformation Effects 0.000 claims 1
- 230000002093 peripheral effect Effects 0.000 claims 1
- 239000012858 resilient material Substances 0.000 claims 1
- 229910000679 solder Inorganic materials 0.000 description 1
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Description
第１図は本考案の一実施例の縦断面図、第２図
ａ及びｂは接続金具の一例の正面図及び側面図、
第３図ａ及びｂは接続金具の他の例の正面図及び
側面図、第４図及び第５図は従来の接続構造の異
なる例を示す縦断面図である。
１……ＨＩＣモジユール、２……リード、３…
…プレート、４……回路基板、５……接続金具、
５ａ，５ｃ……穴、５ｂ……スリツト、６……半
田、７……リボン。
Fig. 1 is a longitudinal sectional view of an embodiment of the present invention, Fig. 2 a and b are a front view and a side view of an example of a connecting fitting,
FIGS. 3a and 3b are a front view and a side view of another example of the connecting fitting, and FIGS. 4 and 5 are longitudinal sectional views showing different examples of the conventional connecting structure. 1...HIC module, 2...lead, 3...
...Plate, 4...Circuit board, 5...Connection fittings,
5a, 5c...hole, 5b...slit, 6...solder, 7...ribbon.
Claims (1)
穴に挿通させ、該リードの先端部を回路基板と電
気的に接続する構造において、前記リードの先端
部を導電性の接続金具を介して回路基板に接続し
、この接続金具はばね性のある材料を皿状に形成
し、その中央部には前記リードを圧入させる穴を
有し、その側面には自身の弾性変形を容易にする
スリツトや穴を有し、その周辺部において回路基
板に半田付けするように構成したことを特徴とす
る半導体モジユールの接続構造。 In a structure in which the lead of a semiconductor module is inserted into a hole provided in a circuit board and the tip of the lead is electrically connected to the circuit board, the tip of the lead is connected to the circuit board via a conductive connecting fitting. However, this connection fitting is made of a resilient material formed into a dish shape, and has a hole in the center into which the lead is press-fitted, and slits and holes on the sides to facilitate elastic deformation of the connection fitting. A connection structure for a semiconductor module, characterized in that the semiconductor module is configured to be soldered to a circuit board at its peripheral portion.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP788689U JPH0298674U (en) | 1989-01-26 | 1989-01-26 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP788689U JPH0298674U (en) | 1989-01-26 | 1989-01-26 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0298674U true JPH0298674U (en) | 1990-08-06 |
Family
ID=31213287
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP788689U Pending JPH0298674U (en) | 1989-01-26 | 1989-01-26 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0298674U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07183639A (en) * | 1993-12-22 | 1995-07-21 | Nec Corp | Terminal for electronic part for adjustment |
| JP2012147037A (en) * | 2005-05-11 | 2012-08-02 | Sonceboz Societe Anonym | Connection method to printed circuit not using soldering of electric drive unit |
-
1989
- 1989-01-26 JP JP788689U patent/JPH0298674U/ja active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07183639A (en) * | 1993-12-22 | 1995-07-21 | Nec Corp | Terminal for electronic part for adjustment |
| JP2012147037A (en) * | 2005-05-11 | 2012-08-02 | Sonceboz Societe Anonym | Connection method to printed circuit not using soldering of electric drive unit |
| JP2014053630A (en) * | 2005-05-11 | 2014-03-20 | Sonceboz Societe Anonym | Connection method to printed circuit not using soldering of electric drive unit |