JPS61122580U - - Google Patents
Info
- Publication number
- JPS61122580U JPS61122580U JP444785U JP444785U JPS61122580U JP S61122580 U JPS61122580 U JP S61122580U JP 444785 U JP444785 U JP 444785U JP 444785 U JP444785 U JP 444785U JP S61122580 U JPS61122580 U JP S61122580U
- Authority
- JP
- Japan
- Prior art keywords
- socket
- metal electrode
- integrated circuit
- semiconductor integrated
- circuit device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002184 metal Substances 0.000 claims description 3
- 239000004065 semiconductor Substances 0.000 claims 2
- 230000009977 dual effect Effects 0.000 claims 1
- 239000011347 resin Substances 0.000 claims 1
- 229920005989 resin Polymers 0.000 claims 1
- 229910000679 solder Inorganic materials 0.000 description 1
Landscapes
- Testing Of Individual Semiconductor Devices (AREA)
- Connecting Device With Holders (AREA)
Description
第１図は本考案の一実施例によるソケツトの斜
視図、第２図は第１図のソケツトにＩＣが装着さ
れた状態のＡ―Ａ線断面図、第３図は従来のソケ
ツトの斜視図、第４図は第３図のソケツトにＩＣ
が装着された状態のＢ―Ｂ線断面図である。
１…ソケツト本体、２…ソケツトに設けられた
金属電極、３…ソケツトに設けられた穴、４…Ｉ
Ｃ本体、５…ＩＣ外部リード、６…プリント基板
、７…外部素子、８…半田、９…中継端子。
Fig. 1 is a perspective view of a socket according to an embodiment of the present invention, Fig. 2 is a sectional view taken along the line A-A of the socket shown in Fig. 1 with an IC installed, and Fig. 3 is a perspective view of a conventional socket. , Figure 4 shows the IC in the socket of Figure 3.
It is a sectional view taken along the line BB in a state where the holder is attached. 1... Socket body, 2... Metal electrode provided in the socket, 3... Hole provided in the socket, 4... I
C main body, 5...IC external lead, 6...printed circuit board, 7...external element, 8...solder, 9...relay terminal.
Claims (1)
トの金属電極が配置された側面の樹脂部に、金属
電極が露出すべく穴が設けられた構造を有する事
を特徴とするデユアルインライン型半導体集積回
路装置用ソケツト。 A dual in-line type semiconductor integrated circuit device characterized in that the socket of the semiconductor integrated circuit device has a structure in which a hole is provided in a resin part of the side surface of the socket where the metal electrode is arranged to expose the metal electrode. socket.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP444785U JPS61122580U (en) | 1985-01-17 | 1985-01-17 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP444785U JPS61122580U (en) | 1985-01-17 | 1985-01-17 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS61122580U true JPS61122580U (en) | 1986-08-01 |
Family
ID=30480030
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP444785U Pending JPS61122580U (en) | 1985-01-17 | 1985-01-17 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61122580U (en) |
-
1985
- 1985-01-17 JP JP444785U patent/JPS61122580U/ja active Pending