JPH02141124U - - Google Patents
Info
- Publication number
- JPH02141124U JPH02141124U JP5041989U JP5041989U JPH02141124U JP H02141124 U JPH02141124 U JP H02141124U JP 5041989 U JP5041989 U JP 5041989U JP 5041989 U JP5041989 U JP 5041989U JP H02141124 U JPH02141124 U JP H02141124U
- Authority
- JP
- Japan
- Prior art keywords
- acoustic wave
- surface acoustic
- substrate
- wave device
- conductor pattern
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000010897 surface acoustic wave method Methods 0.000 claims description 8
- 239000002184 metal Substances 0.000 claims description 2
- 239000000758 substrate Substances 0.000 claims 6
- 239000004020 conductor Substances 0.000 claims 4
- 239000000919 ceramic Substances 0.000 claims 1
Landscapes
- Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)
Description
第１図は本考案の実施例を示す正面図、第２図
は従来の表面弾性波素子の一例を示す正面図であ
る。
１０……金属キヤツプ、１１，２１……ステム
、１２，２２……端子ピン、１５……基板。
FIG. 1 is a front view showing an embodiment of the present invention, and FIG. 2 is a front view showing an example of a conventional surface acoustic wave element. 10... Metal cap, 11, 21... Stem, 12, 22... Terminal pin, 15... Board.
Claims (1)
該搭載基板に植設され、該搭載基板に垂直な方向
に伸びる端子ピンを具えた表面弾性波素子におい
て、該搭載基板の下面に接して取り付けられ、該
端子ピンを挿通する貫通孔を形成した基板を具え
たことを特徴とする表面弾性波素子。 (2) 該基板がプリント配線板であり、少なくと
も片面に導体パターンが形成された請求項第１項
記載の表面弾性波素子。 (3) 該基板がプリント配線板であり、少なくと
も片面に導体パターンが形成され、該端子ピンの
少なくとも一つと該導体パターンが接続された請
求項第１項記載の表面弾性波素子。 (4) 該基板がプリント配線板であり、少なくと
も片面に導体パターンが形成され、該導体パター
ンにチツプ部品が搭載された請求項第１項記載の
表面弾性波素子。 (5) 該基板がセラミツク基板である請求項第１
項記載の表面弾性波素子。[Scope of claims for utility model registration] (1) Sealed by a mounting board and a metal case,
In a surface acoustic wave element having a terminal pin implanted in the mounting board and extending in a direction perpendicular to the mounting board, the surface acoustic wave element is attached in contact with the lower surface of the mounting board and has a through hole through which the terminal pin is inserted. A surface acoustic wave device characterized by comprising a substrate. (2) The surface acoustic wave device according to claim 1, wherein the substrate is a printed wiring board, and a conductive pattern is formed on at least one side. (3) The surface acoustic wave device according to claim 1, wherein the substrate is a printed wiring board, a conductor pattern is formed on at least one side, and at least one of the terminal pins is connected to the conductor pattern. (4) The surface acoustic wave device according to claim 1, wherein the substrate is a printed wiring board, a conductor pattern is formed on at least one side, and a chip component is mounted on the conductor pattern. (5) Claim 1, wherein the substrate is a ceramic substrate.
The surface acoustic wave device described in Section 1.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5041989U JPH02141124U (en) | 1989-04-28 | 1989-04-28 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5041989U JPH02141124U (en) | 1989-04-28 | 1989-04-28 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02141124U true JPH02141124U (en) | 1990-11-27 |
Family
ID=31568945
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5041989U Pending JPH02141124U (en) | 1989-04-28 | 1989-04-28 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02141124U (en) |
Citations (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57160211A (en) * | 1981-03-27 | 1982-10-02 | Fujitsu Ltd | Quartz oscillator |
| JPS57167557A (en) * | 1981-04-08 | 1982-10-15 | Mazda Motor Corp | Vacuum modulator for diesel engine |
| JPS59165467A (en) * | 1983-03-10 | 1984-09-18 | Matsushita Electric Ind Co Ltd | Semiconductor device and manufacture thereof |
| JPS60193923A (en) * | 1984-03-13 | 1985-10-02 | Morimitsu Miyagi | Preparation of highly deodorized vitamin oil with high unit |
| JPS6171867A (en) * | 1984-09-17 | 1986-04-12 | Konishiroku Photo Ind Co Ltd | Coating method |
| JPS6190652A (en) * | 1984-10-11 | 1986-05-08 | 松下電器産業株式会社 | Apparatus for forknowing and detecting ovulation |
| JPS61116204A (en) * | 1984-11-12 | 1986-06-03 | バブコツク日立株式会社 | Boiler device preventing corrosion at high temperature of superheater |
| JPS6232864A (en) * | 1985-08-06 | 1987-02-12 | Ajinomoto Co Inc | Production of essence of sea tangle |
| JPS62132977A (en) * | 1985-12-04 | 1987-06-16 | Mitsubishi Cable Ind Ltd | Concentration of water-dispersible varnish |
| JPS63131712A (en) * | 1986-11-21 | 1988-06-03 | Nec Corp | Surface acoustic wave device |
| JPS63177448A (en) * | 1987-01-17 | 1988-07-21 | Nippon Dempa Kogyo Co Ltd | Metallic base and piezoelectric oscillator using this base |
-
1989
- 1989-04-28 JP JP5041989U patent/JPH02141124U/ja active Pending
Patent Citations (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57160211A (en) * | 1981-03-27 | 1982-10-02 | Fujitsu Ltd | Quartz oscillator |
| JPS57167557A (en) * | 1981-04-08 | 1982-10-15 | Mazda Motor Corp | Vacuum modulator for diesel engine |
| JPS59165467A (en) * | 1983-03-10 | 1984-09-18 | Matsushita Electric Ind Co Ltd | Semiconductor device and manufacture thereof |
| JPS60193923A (en) * | 1984-03-13 | 1985-10-02 | Morimitsu Miyagi | Preparation of highly deodorized vitamin oil with high unit |
| JPS6171867A (en) * | 1984-09-17 | 1986-04-12 | Konishiroku Photo Ind Co Ltd | Coating method |
| JPS6190652A (en) * | 1984-10-11 | 1986-05-08 | 松下電器産業株式会社 | Apparatus for forknowing and detecting ovulation |
| JPS61116204A (en) * | 1984-11-12 | 1986-06-03 | バブコツク日立株式会社 | Boiler device preventing corrosion at high temperature of superheater |
| JPS6232864A (en) * | 1985-08-06 | 1987-02-12 | Ajinomoto Co Inc | Production of essence of sea tangle |
| JPS62132977A (en) * | 1985-12-04 | 1987-06-16 | Mitsubishi Cable Ind Ltd | Concentration of water-dispersible varnish |
| JPS63131712A (en) * | 1986-11-21 | 1988-06-03 | Nec Corp | Surface acoustic wave device |
| JPS63177448A (en) * | 1987-01-17 | 1988-07-21 | Nippon Dempa Kogyo Co Ltd | Metallic base and piezoelectric oscillator using this base |