JPH0325222U - - Google Patents
Info
- Publication number
- JPH0325222U JPH0325222U JP8502289U JP8502289U JPH0325222U JP H0325222 U JPH0325222 U JP H0325222U JP 8502289 U JP8502289 U JP 8502289U JP 8502289 U JP8502289 U JP 8502289U JP H0325222 U JPH0325222 U JP H0325222U
- Authority
- JP
- Japan
- Prior art keywords
- small
- board
- electronic component
- lead pin
- small board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims 1
- 239000004020 conductor Substances 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Landscapes
- Multi-Conductor Connections (AREA)
Description
第１図は、本考案による小型組立電子部品の一
例を示す断面図である。第２図は、本考案の小型
組立電子部品の他の一例を示す断面図である。第
３図は、本考案の小型組立電子部品のまた他の例
を示す断面図である。第４図は、本考案による小
型組立電子部品と基板との接続構造を示す断面図
である。第５図は、本考案の小型組立電子部品の
従来製品を示す断面図である。
主要部分の符号の説明、１……ピン、２……基
板、３……部品、４……接続部パターン、５……
樹脂コート部、６……孔、７……接続部、８……
導体接続部、９……スルーホール、１１……基板
Ｂ、１３……ハンダ。
FIG. 1 is a sectional view showing an example of a small assembled electronic component according to the present invention. FIG. 2 is a sectional view showing another example of the small assembled electronic component of the present invention. FIG. 3 is a sectional view showing another example of the small assembled electronic component of the present invention. FIG. 4 is a sectional view showing a connection structure between a small assembled electronic component and a board according to the present invention. FIG. 5 is a sectional view showing a conventional product of the small assembled electronic component of the present invention. Explanation of symbols of main parts, 1... Pin, 2... Board, 3... Parts, 4... Connection pattern, 5...
Resin coated part, 6...hole, 7...connection part, 8...
Conductor connection portion, 9... Through hole, 11... Board B, 13... Solder.
Claims (1)
に接続している電子部品を、リードピンにより組
立てられた小型組立電子部品において、 該リードピンは、該小基板の長さ方向と平行に
、該ピンと該小基板との接合部まで、延びており
、 該リードピンと該小基板との接合部の位置は、
該小型組立電子部品小基板の上半部分にあり、そ
して、該リードピンと該小基板との接合は、該基
板上面部での接合、該基板に設けた孔へ挿入し、
接合或いは、該基板に設けた導電スルーホールへ
の接合のいずれかにより、接続されていることを
特徴とする小型組立電子部品。[Claim for Utility Model Registration] A small assembled electronic component in which an electronic component is mounted on a small board and the electronic component connected to the circuit of the small board is assembled by a lead pin, the lead pin is attached to the small board. extends parallel to the length direction of the lead pin to the joint between the lead pin and the small board, and the position of the joint between the lead pin and the small board is
The small assembled electronic component is located in the upper half of the small board, and the lead pin and the small board are joined at the top surface of the board, inserted into a hole provided in the board,
A small assembled electronic component characterized in that it is connected either by bonding or by bonding to a conductive through hole provided in the substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8502289U JPH0325222U (en) | 1989-07-21 | 1989-07-21 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8502289U JPH0325222U (en) | 1989-07-21 | 1989-07-21 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0325222U true JPH0325222U (en) | 1991-03-15 |
Family
ID=31633899
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8502289U Pending JPH0325222U (en) | 1989-07-21 | 1989-07-21 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0325222U (en) |
-
1989
- 1989-07-21 JP JP8502289U patent/JPH0325222U/ja active Pending