JPH0348242U - - Google Patents
Info
- Publication number
- JPH0348242U JPH0348242U JP10828389U JP10828389U JPH0348242U JP H0348242 U JPH0348242 U JP H0348242U JP 10828389 U JP10828389 U JP 10828389U JP 10828389 U JP10828389 U JP 10828389U JP H0348242 U JPH0348242 U JP H0348242U
- Authority
- JP
- Japan
- Prior art keywords
- lsi
- substrate
- electrically connected
- relay
- board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims 2
- 238000010586 diagram Methods 0.000 description 2
Description
第１図は、本考案の実施例を示す図であり、第
２図は、第１図の要部拡大図であり、第３図は、
中継板拡大図である。
図において、１……基板、２……ＬＳＩ、３…
…バンプ、４……ランド、５……ワイヤ、６……
中継ピン、７……中継板（フレキシブルプリント
板）、１０……部材、をそれぞれ示す。
Fig. 1 is a diagram showing an embodiment of the present invention, Fig. 2 is an enlarged view of the main part of Fig. 1, and Fig. 3 is a diagram showing an embodiment of the present invention.
It is an enlarged view of a relay board. In the figure, 1...board, 2...LSI, 3...
...Bump, 4...Land, 5...Wire, 6...
A relay pin, 7...a relay board (flexible printed board), and 10...a member are shown, respectively.
Claims (1)
と対応し、且つＬＳＩ２に設けられたバンプ３を
電気的に接続してなるＬＳＩ実装構造に於いて、 前記基板１表面から適宜の間隔を有して位置す
る中継板７と、該中継板７を貫通し、一端は前記
バンプ３と電気的に接続し他端は前記ランド４と
電気的に接続される中継ピン６とからなる部材１
０を、 該ＬＳＩ２と該基板１間に設けたことを特徴と
するＬＳＩの実装構造。[Claims for Utility Model Registration] The lands 4 formed on the substrate 1 are
In an LSI mounting structure formed by electrically connecting bumps 3 provided on the LSI 2, a relay plate 7 located at an appropriate distance from the surface of the board 1; A member 1 consisting of a relay pin 6 that penetrates through and is electrically connected to the bump 3 at one end and electrically connected to the land 4 at the other end.
0 between the LSI 2 and the substrate 1.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10828389U JPH0348242U (en) | 1989-09-18 | 1989-09-18 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10828389U JPH0348242U (en) | 1989-09-18 | 1989-09-18 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0348242U true JPH0348242U (en) | 1991-05-08 |
Family
ID=31656927
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10828389U Pending JPH0348242U (en) | 1989-09-18 | 1989-09-18 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0348242U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2003001119A1 (en) * | 2001-06-22 | 2003-01-03 | Jeong-Hoi Koo | A binding structure of a purifier accomplishing a plant purification |
| JPWO2009110355A1 (en) * | 2008-03-05 | 2011-07-14 | 日本電気株式会社 | Mounting structure and manufacturing method thereof |
-
1989
- 1989-09-18 JP JP10828389U patent/JPH0348242U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2003001119A1 (en) * | 2001-06-22 | 2003-01-03 | Jeong-Hoi Koo | A binding structure of a purifier accomplishing a plant purification |
| JPWO2009110355A1 (en) * | 2008-03-05 | 2011-07-14 | 日本電気株式会社 | Mounting structure and manufacturing method thereof |