JPH0236476U - - Google Patents

Info

Publication number
JPH0236476U
JPH0236476U JP11429888U JP11429888U JPH0236476U JP H0236476 U JPH0236476 U JP H0236476U JP 11429888 U JP11429888 U JP 11429888U JP 11429888 U JP11429888 U JP 11429888U JP H0236476 U JPH0236476 U JP H0236476U
Authority
JP
Japan
Prior art keywords
wiring pattern
protruding electrodes
view
wiring
showing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP11429888U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP11429888U priority Critical patent/JPH0236476U/ja
Publication of JPH0236476U publication Critical patent/JPH0236476U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73201—Location after the connecting process on the same surface
    • H01L2224/73203—Bump and layer connectors
    • H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector

Landscapes

  • Wire Bonding (AREA)
  • Radar Systems Or Details Thereof (AREA)
  • Credit Cards Or The Like (AREA)
  • Calculators And Similar Devices (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)

Description

【図面の簡単な説明】[Brief explanation of drawings]

第１図は本考案の一実施例による半導体チツプ
の実装を示す断面図、第２図はその配線基板を示
す斜視図、第３図はバンプの形成の説明に供する
断面図、第４図は他の実施例を示す斜視図、第５
図は情報カードを示す斜視図、第６図はワイヤボ
ンデイング法による半導体チツプの実装を示す断
面図、第７図はバンプ法による半導体チツプの実
装を示す断面図である。 １…情報カード、２，２０，４１，４２…配線
基板、４，４０…配線パターン、８…半導体チツ
プ、９…電極、１１，２５…バンプ、２６，４３
…熱硬化性接着剤。 FIG. 1 is a cross-sectional view showing the mounting of a semiconductor chip according to an embodiment of the present invention, FIG. 2 is a perspective view showing the wiring board, FIG. 3 is a cross-sectional view for explaining the formation of bumps, and FIG. Perspective view showing another embodiment, No. 5
6 is a perspective view showing an information card, FIG. 6 is a cross-sectional view showing mounting of a semiconductor chip by the wire bonding method, and FIG. 7 is a cross-sectional view showing mounting of a semiconductor chip by the bump method. 1... Information card, 2, 20, 41, 42... Wiring board, 4, 40... Wiring pattern, 8... Semiconductor chip, 9... Electrode, 11, 25... Bump, 26, 43
...thermosetting adhesive.

Claims (1)

【実用新案登録請求の範囲】 配線パターン上にスクリーン印刷で突起電極を
形成した配線基板と、 上記突起電極を介して、上記配線パターンに接
続されるようになされた電子部品と を具えることを特徴とするプリント基板回路。[Claims for Utility Model Registration] A wiring board having protruding electrodes formed on the wiring pattern by screen printing, and an electronic component connected to the wiring pattern via the protruding electrodes. Characteristic printed circuit board circuit.
JP11429888U 1988-08-31 1988-08-31 Pending JPH0236476U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11429888U JPH0236476U (en) 1988-08-31 1988-08-31

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11429888U JPH0236476U (en) 1988-08-31 1988-08-31

Publications (1)

Publication Number Publication Date
JPH0236476U true JPH0236476U (en) 1990-03-09

Family

ID=31354914

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11429888U Pending JPH0236476U (en) 1988-08-31 1988-08-31

Country Status (1)

Country Link
JP (1) JPH0236476U (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06123773A (en) * 1992-06-17 1994-05-06 Micron Technol Inc Radio-frequency identifying device, manufacture thereof and detecting system using device thereof
JPH08321671A (en) * 1995-05-26 1996-12-03 Nec Corp Bump electrode structure and manufacture thereof
WO2021106471A1 (en) * 2019-11-29 2021-06-03 株式会社デンソー Radar device
WO2022113186A1 (en) * 2020-11-25 2022-06-02 株式会社Fuji Electric circuit forming method

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS51139775A (en) * 1975-05-28 1976-12-02 Seiko Epson Corp Method of forming projection electrode
JPS594196A (en) * 1982-06-30 1984-01-10 富士通株式会社 Method of forming solder bump for mounting semiconductor part
JPS63119288A (en) * 1986-11-06 1988-05-23 株式会社村田製作所 Circuit board

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS51139775A (en) * 1975-05-28 1976-12-02 Seiko Epson Corp Method of forming projection electrode
JPS594196A (en) * 1982-06-30 1984-01-10 富士通株式会社 Method of forming solder bump for mounting semiconductor part
JPS63119288A (en) * 1986-11-06 1988-05-23 株式会社村田製作所 Circuit board

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06123773A (en) * 1992-06-17 1994-05-06 Micron Technol Inc Radio-frequency identifying device, manufacture thereof and detecting system using device thereof
JPH08321671A (en) * 1995-05-26 1996-12-03 Nec Corp Bump electrode structure and manufacture thereof
WO2021106471A1 (en) * 2019-11-29 2021-06-03 株式会社デンソー Radar device
JP2021085795A (en) * 2019-11-29 2021-06-03 株式会社デンソー Radar device
WO2022113186A1 (en) * 2020-11-25 2022-06-02 株式会社Fuji Electric circuit forming method

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