JPH0316357U - - Google Patents
Info
- Publication number
- JPH0316357U JPH0316357U JP7663689U JP7663689U JPH0316357U JP H0316357 U JPH0316357 U JP H0316357U JP 7663689 U JP7663689 U JP 7663689U JP 7663689 U JP7663689 U JP 7663689U JP H0316357 U JPH0316357 U JP H0316357U
- Authority
- JP
- Japan
- Prior art keywords
- signal line
- electrically connected
- package
- terminator
- chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims 1
- 229910000679 solder Inorganic materials 0.000 description 1
Landscapes
- Multi-Conductor Connections (AREA)
- Lead Frames For Integrated Circuits (AREA)
Description
第１図は本考案の一実施例のＩＣパツケージを
プリント基板に実装した状態を示す断面図、第２
図は第１図のＩＣパツケージにおけるＩＣチツプ
の近傍を示す拡大斜視図、第３図は従来のＩＣパ
ツケージの実装状態を示す平面図、第４図は第３
図における−断面図である。
１……プリント基板、２……ＩＣパツケージ、
５……信号ライン、６……終端抵抗、７……ＩＣ
チツプ、８……ボンデイングワイヤ、１０……信
号ライン接続用リード、１１……終端器接続用リ
ード、１２……終端器接続用リードの基端部、１
４……信号ライン接続用リードの基端部、１５…
…半田。
Fig. 1 is a sectional view showing an IC package according to an embodiment of the present invention mounted on a printed circuit board;
The figure is an enlarged perspective view showing the vicinity of the IC chip in the IC package of Fig. 1, Fig. 3 is a plan view showing the mounting state of the conventional IC package, and Fig. 4 is the
It is a - sectional view in the figure. 1...Printed circuit board, 2...IC package,
5...Signal line, 6...Terminal resistor, 7...IC
Chip, 8... Bonding wire, 10... Lead for signal line connection, 11... Lead for connecting terminator, 12... Base end of lead for connecting terminator, 1
4...Proximal end of signal line connection lead, 15...
…solder.
Claims (1)
ツプをＩＣパツケージにより封止してなるＩＣパ
ツケージ構造において、前記終端器に電気接続さ
れる終端器接続用リードを前記ＩＣパツケージの
基板への実装面から突設すると共に、前記信号ラ
インに電気接続される信号ライン接続用リードを
前記ＩＣパツケージから突設する一方、前記終端
器接続用リードと前記信号ライン接続用リードと
を前記ＩＣチツプの近傍で相互に電気接続し前記
終端器接続用リードと信号ライン接続用リードと
を前記ＩＣチツプに電気接続してあることを特徴
とするＩＣパツケージ構造。 In an IC package structure in which an IC chip electrically connected to a signal line and a terminator is sealed in an IC package, a terminator connection lead electrically connected to the terminator is attached to the mounting surface of the IC package on the substrate. A signal line connection lead electrically connected to the signal line is provided protruding from the IC package, while the terminator connection lead and the signal line connection lead are provided near the IC chip. An IC package structure characterized in that the terminal device connecting lead and the signal line connecting lead are electrically connected to each other and are electrically connected to the IC chip.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7663689U JPH0316357U (en) | 1989-06-29 | 1989-06-29 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7663689U JPH0316357U (en) | 1989-06-29 | 1989-06-29 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0316357U true JPH0316357U (en) | 1991-02-19 |
Family
ID=31618283
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7663689U Pending JPH0316357U (en) | 1989-06-29 | 1989-06-29 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0316357U (en) |
-
1989
- 1989-06-29 JP JP7663689U patent/JPH0316357U/ja active Pending
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