JPH02138467U - - Google Patents
Info
- Publication number
- JPH02138467U JPH02138467U JP4768489U JP4768489U JPH02138467U JP H02138467 U JPH02138467 U JP H02138467U JP 4768489 U JP4768489 U JP 4768489U JP 4768489 U JP4768489 U JP 4768489U JP H02138467 U JPH02138467 U JP H02138467U
- Authority
- JP
- Japan
- Prior art keywords
- package
- terminals
- circuit board
- printed circuit
- connection structure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 claims description 2
- 238000010586 diagram Methods 0.000 description 2
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Description
第１図は実施例に係るＩＳパツケージの端子接
続構造を示す図、第２図は従来のＬＳＩパツケー
ジとプリント基板の接続状態を示す図である。
１……ＬＳＩパツケージ．２……プリント基板
、３……ＬＳＩパツケージのパツド、４……プリ
ント基板のパツド、５……半田、６，７……接続
線。
FIG. 1 is a diagram showing a terminal connection structure of an IS package according to an embodiment, and FIG. 2 is a diagram showing a connection state between a conventional LSI package and a printed circuit board. 1...LSI package. 2... Printed circuit board, 3... LSI package pad, 4... Printed circuit board pad, 5... Solder, 6, 7... Connection wire.
Claims (1)
半田にて表面実装するＩＣパツケージの端子接続
構造において、ＩＣパツケージまたはプリント基
板の少なくとも一方の端子間を一つの信号に対し
少なくとも二個の端子が割り当てられるように接
続したことを特徴とするＩＣパツケージの端子接
続構造。 In an IC package terminal connection structure in which the terminals of the IC package and the terminals of the printed circuit board are surface-mounted with solder, at least two terminals are assigned for one signal between the terminals of at least one of the IC package or the printed circuit board. A terminal connection structure for an IC package, characterized in that it is connected to.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4768489U JPH02138467U (en) | 1989-04-25 | 1989-04-25 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4768489U JPH02138467U (en) | 1989-04-25 | 1989-04-25 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02138467U true JPH02138467U (en) | 1990-11-19 |
Family
ID=31563831
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4768489U Pending JPH02138467U (en) | 1989-04-25 | 1989-04-25 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02138467U (en) |
-
1989
- 1989-04-25 JP JP4768489U patent/JPH02138467U/ja active Pending
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