JPS60129159U - semiconductor pressure sensor - Google Patents

semiconductor pressure sensor

Info

Publication number
JPS60129159U
JPS60129159U JP1699684U JP1699684U JPS60129159U JP S60129159 U JPS60129159 U JP S60129159U JP 1699684 U JP1699684 U JP 1699684U JP 1699684 U JP1699684 U JP 1699684U JP S60129159 U JPS60129159 U JP S60129159U
Authority
JP
Japan
Prior art keywords
ceramic substrate
pressure sensor
semiconductor pressure
pedestal
integrated circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1699684U
Other languages
Japanese (ja)
Inventor
松田　典朗
寛 岡田
Original Assignee
株式会社デンソー
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式会社デンソー filed Critical 株式会社デンソー
Priority to JP1699684U priority Critical patent/JPS60129159U/en
Publication of JPS60129159U publication Critical patent/JPS60129159U/en
Pending legal-status Critical Current

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  • Measuring Fluid Pressure (AREA)
  • Pressure Sensors (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of drawings]

第１図および第２図は本考案の実棒例を示す断１．１１
・・・セラミック基板、２・・・フリップチップ型集積
回路素子、３．１３・・・台座、４，１４・・・−シリ
コンダイヤフラム、５・・・リード、１５・・・ボン　
　−−、ディングワイヤ、７・□・・チップコンデンサ
、８ａ８ｂ・・・圧力導入孔。　　、０．−Figures 1 and 2 are section 1.11 showing an example of the actual rod of the present invention.
... Ceramic substrate, 2... Flip chip integrated circuit element, 3.13... Pedestal, 4, 14...-Silicon diaphragm, 5... Lead, 15... Bond
--, ding wire, 7, □, chip capacitor, 8a8b, pressure introduction hole. , 0. −

Claims (1)

【実用新案登録請求の範囲】 □　所定の導体配線パターンが印刷さ杆たセラミック基
板、どのセラミック基板上の一部に半田接着されシリコ
ンダイヤフラムを搭載する台座、及び前記セラミック基
板上の一部に半田接着−されるフリップチップ型集積回
路素子及びチップ素子を有−し、前記台座、前記集積回
路素子、及びチップ素子が同時に前記セラミック基板上
に半田接着され。 る構成にしたことを特徴と子る半−門圧力センサ。　　
　　　　　　−[Scope of Claim for Utility Model Registration] □ A ceramic substrate on which a predetermined conductor wiring pattern is printed, a pedestal on which a silicon diaphragm is mounted by soldering on a part of the ceramic substrate, and a part of the ceramic substrate on which a silicon diaphragm is mounted. A flip-chip type integrated circuit element and a chip element are bonded together, and the pedestal, the integrated circuit element, and the chip element are simultaneously soldered and bonded onto the ceramic substrate. This semi-portal pressure sensor is characterized by its configuration.
−
JP1699684U 1984-02-08 1984-02-08 semiconductor pressure sensor Pending JPS60129159U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1699684U JPS60129159U (en) 1984-02-08 1984-02-08 semiconductor pressure sensor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1699684U JPS60129159U (en) 1984-02-08 1984-02-08 semiconductor pressure sensor

Publications (1)

Publication Number Publication Date
JPS60129159U true JPS60129159U (en) 1985-08-30

Family

ID=30504290

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1699684U Pending JPS60129159U (en) 1984-02-08 1984-02-08 semiconductor pressure sensor

Country Status (1)

Country Link
JP (1) JPS60129159U (en)

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