JPS60111064U - Circuit board for hybrid IC - Google Patents
Circuit board for hybrid ICInfo
- Publication number
- JPS60111064U JPS60111064U JP20390883U JP20390883U JPS60111064U JP S60111064 U JPS60111064 U JP S60111064U JP 20390883 U JP20390883 U JP 20390883U JP 20390883 U JP20390883 U JP 20390883U JP S60111064 U JPS60111064 U JP S60111064U
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- hybrid
- ceramic substrate
- conductive pads
- wiring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第1図は従来のハイブリッドICの構造を示す斜視図、
第2図は第1図の回路基板のパターン例 、を示す斜視
図、第3図は本考案のハイブリッドICに用いる回路基
板の断面図、第4図は第3図のIV−IV線から見た正
面図である。
1・・・電子部品チップ、7・・・セラミック基板(回
路基板)、8・・・導電パッド、9,9a、9b・・・
アース部分、10・・・配線、12・・・GNDパター
ン。Figure 1 is a perspective view showing the structure of a conventional hybrid IC;
2 is a perspective view showing an example of the pattern of the circuit board in FIG. 1, FIG. 3 is a sectional view of the circuit board used in the hybrid IC of the present invention, and FIG. FIG. DESCRIPTION OF SYMBOLS 1... Electronic component chip, 7... Ceramic board (circuit board), 8... Conductive pad, 9, 9a, 9b...
Earth part, 10... Wiring, 12... GND pattern.
Claims (1)
これらの導電パッド間を接続する配線とをセラミック基
板の一方の面に形成するものに於いて前記セラミック基
板の他方の面に前記配線のうちアース部分と接続子るG
NDパターンを略全面に形成したことを特徴とするハイ
ブリッドIC用回路基板。In a device in which conductive pads on which a large number of electronic component chips are mounted and wiring connecting these conductive pads are formed on one side of a ceramic substrate, the ground of the wiring is formed on the other side of the ceramic substrate. Part and connector G
A circuit board for a hybrid IC characterized in that an ND pattern is formed almost on the entire surface.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP20390883U JPS60111064U (en) | 1983-12-28 | 1983-12-28 | Circuit board for hybrid IC |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP20390883U JPS60111064U (en) | 1983-12-28 | 1983-12-28 | Circuit board for hybrid IC |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS60111064U true JPS60111064U (en) | 1985-07-27 |
Family
ID=30766312
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP20390883U Pending JPS60111064U (en) | 1983-12-28 | 1983-12-28 | Circuit board for hybrid IC |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS60111064U (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63163698A (en) * | 1986-12-26 | 1988-07-07 | ホーチキ株式会社 | Scattered light type smoke sensor |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4119947Y1 (en) * | 1964-01-18 | 1966-09-20 | ||
JPS4947154B1 (en) * | 1967-12-05 | 1974-12-13 | ||
JPS56140689A (en) * | 1980-04-01 | 1981-11-04 | Matsushita Electric Ind Co Ltd | Cirucuit unit using printed circuit board |
-
1983
- 1983-12-28 JP JP20390883U patent/JPS60111064U/en active Pending
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4119947Y1 (en) * | 1964-01-18 | 1966-09-20 | ||
JPS4947154B1 (en) * | 1967-12-05 | 1974-12-13 | ||
JPS56140689A (en) * | 1980-04-01 | 1981-11-04 | Matsushita Electric Ind Co Ltd | Cirucuit unit using printed circuit board |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63163698A (en) * | 1986-12-26 | 1988-07-07 | ホーチキ株式会社 | Scattered light type smoke sensor |
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