JPS59180463U - Ceramic multilayer wiring board - Google Patents
Ceramic multilayer wiring boardInfo
- Publication number
- JPS59180463U JPS59180463U JP7414083U JP7414083U JPS59180463U JP S59180463 U JPS59180463 U JP S59180463U JP 7414083 U JP7414083 U JP 7414083U JP 7414083 U JP7414083 U JP 7414083U JP S59180463 U JPS59180463 U JP S59180463U
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- multilayer wiring
- ceramic multilayer
- separated
- conductive pattern
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Parts Printed On Printed Circuit Boards (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第1図は従来のトリマーコンデンサを使用した基準発振
器の回路図、第2図は本考案に係るトリマーコンデンサ
の構成を説明するための断面図、第3図はそのトリマー
コンデンサの等−回路図、第4図は本考案の一実施例の
平面図、第5図はその実施例の等価回路図、第6図及び
第7図は他の実施例の平面図、第8図は第7図の実施例
の等価回路図である。
10は第1導電パターン、12. 13. 14゜15
.16は第2導電パターン、17.1B。
19.20.21は一方の接続用パッド、23゜24.
25,26.27は他方の接続用パッド、28.30.
32は導電層、29は端子である。Fig. 1 is a circuit diagram of a reference oscillator using a conventional trimmer capacitor, Fig. 2 is a sectional view for explaining the configuration of the trimmer capacitor according to the present invention, and Fig. 3 is a circuit diagram of the trimmer capacitor. 4 is a plan view of one embodiment of the present invention, FIG. 5 is an equivalent circuit diagram of that embodiment, FIGS. 6 and 7 are plan views of other embodiments, and FIG. 8 is a plan view of the embodiment of the present invention. It is an equivalent circuit diagram of an example. 10 is a first conductive pattern; 12. 13. 14°15
.. 16 is a second conductive pattern, 17.1B. 19.20.21 is one connection pad, 23°24.
25, 26.27 are the other connection pads, 28.30.
32 is a conductive layer, and 29 is a terminal.
Claims (1)
の導電パターンと、上記第1の導電パターンとセラミッ
ク層を介して分離され、且つ上記第1の導電パ′ ター
ンに対向する互いに分離された複数の第2の導電パター
ンと、上記複数の第2の導電パターンが相互に電気的に
接続又は分離が可能に形成され、上記第1の導電パター
ンと上記複数の導電パターンにより形成されたトリマー
コンデンサを有するセラミック多層配線基板。, a first layer formed on the first surface of the ceramic layer.
a plurality of mutually separated second conductive patterns that are separated from the first conductive pattern via a ceramic layer and opposite to the first conductive pattern; A ceramic multilayer wiring board having a trimmer capacitor formed by the first conductive pattern and the plurality of conductive patterns, the conductive patterns being electrically connected or separated from each other.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7414083U JPS59180463U (en) | 1983-05-18 | 1983-05-18 | Ceramic multilayer wiring board |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7414083U JPS59180463U (en) | 1983-05-18 | 1983-05-18 | Ceramic multilayer wiring board |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS59180463U true JPS59180463U (en) | 1984-12-01 |
JPH027483Y2 JPH027483Y2 (en) | 1990-02-22 |
Family
ID=30204237
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP7414083U Granted JPS59180463U (en) | 1983-05-18 | 1983-05-18 | Ceramic multilayer wiring board |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS59180463U (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6416670U (en) * | 1987-07-21 | 1989-01-27 | ||
WO2007125839A1 (en) * | 2006-04-25 | 2007-11-08 | Sumida Corporation | Inverter circuit |
WO2013108555A1 (en) * | 2012-01-17 | 2013-07-25 | ローム株式会社 | Chip capacitor and method for manufacturing same |
EP3929947A1 (en) * | 2020-06-26 | 2021-12-29 | Murata Manufacturing Co., Ltd. | Method of fabricating a device comprising an electrical component with sub components connected using a plate to control an electrical parameter |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3231776B2 (en) * | 1993-03-19 | 2001-11-26 | 富士通株式会社 | Laminated circuit board |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4957363A (en) * | 1972-10-04 | 1974-06-04 | ||
JPS50119815A (en) * | 1974-03-08 | 1975-09-19 | ||
JPS51874U (en) * | 1974-06-18 | 1976-01-06 | ||
JPS549867U (en) * | 1977-06-24 | 1979-01-23 | ||
JPS5562721A (en) * | 1978-11-02 | 1980-05-12 | Tdk Electronics Co Ltd | Laminated capacitor |
JPS59132611A (en) * | 1983-01-20 | 1984-07-30 | 日本電気株式会社 | Capacitor composite substrate |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS549867B2 (en) * | 1972-09-20 | 1979-04-27 |
-
1983
- 1983-05-18 JP JP7414083U patent/JPS59180463U/en active Granted
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4957363A (en) * | 1972-10-04 | 1974-06-04 | ||
JPS50119815A (en) * | 1974-03-08 | 1975-09-19 | ||
JPS51874U (en) * | 1974-06-18 | 1976-01-06 | ||
JPS549867U (en) * | 1977-06-24 | 1979-01-23 | ||
JPS5562721A (en) * | 1978-11-02 | 1980-05-12 | Tdk Electronics Co Ltd | Laminated capacitor |
JPS59132611A (en) * | 1983-01-20 | 1984-07-30 | 日本電気株式会社 | Capacitor composite substrate |
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6416670U (en) * | 1987-07-21 | 1989-01-27 | ||
WO2007125839A1 (en) * | 2006-04-25 | 2007-11-08 | Sumida Corporation | Inverter circuit |
WO2013108555A1 (en) * | 2012-01-17 | 2013-07-25 | ローム株式会社 | Chip capacitor and method for manufacturing same |
JP2013168633A (en) * | 2012-01-17 | 2013-08-29 | Rohm Co Ltd | Chip capacitor and manufacturing method of the same |
US9859061B2 (en) | 2012-01-17 | 2018-01-02 | Rohm Co., Ltd. | Chip capacitor and method for manufacturing the same |
US10304633B2 (en) | 2012-01-17 | 2019-05-28 | Rohm Co., Ltd. | Chip capacitor and method for manufacturing the same |
US10777360B2 (en) | 2012-01-17 | 2020-09-15 | Rohm Co., Ltd. | Chip capacitor and method for manufacturing the same |
EP3929947A1 (en) * | 2020-06-26 | 2021-12-29 | Murata Manufacturing Co., Ltd. | Method of fabricating a device comprising an electrical component with sub components connected using a plate to control an electrical parameter |
Also Published As
Publication number | Publication date |
---|---|
JPH027483Y2 (en) | 1990-02-22 |
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