JPS60158763U - Flexible metal-based circuit board - Google Patents
Flexible metal-based circuit boardInfo
- Publication number
- JPS60158763U JPS60158763U JP4721584U JP4721584U JPS60158763U JP S60158763 U JPS60158763 U JP S60158763U JP 4721584 U JP4721584 U JP 4721584U JP 4721584 U JP4721584 U JP 4721584U JP S60158763 U JPS60158763 U JP S60158763U
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- flexible metal
- based circuit
- metal base
- flexible
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Structure Of Printed Boards (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
図面は本考案に係るフレキシブル金属ベース回路基板の
一実施例を概念的に示す断面構成図である。
１．６．１１・・・金属ベース材、３，８．１３・・・
導電パターン、４，９．１４・・・回路基板要素、５．
１０・・・積層用接着層。The drawing is a cross-sectional configuration diagram conceptually showing an embodiment of a flexible metal base circuit board according to the present invention. 1.6.11...Metal base material, 3,8.13...
Conductive pattern, 4, 9.14... circuit board element, 5.
10... Adhesive layer for lamination.
Claims (1)
電パターンを形成したフレキシブル回路基板要素を複数
組接着剤を介して相互に積層成形し、上記導電パターン
の所要間にスルーホー／Ｕ導通を設けるように構成した
ことを特徴とするフレキシブル金属ベース回路基板。A plurality of sets of flexible circuit board elements each having a conductive pattern formed on at least one surface of a metal base material via an insulating layer are laminated together using an adhesive, and through-hole/U continuity is provided between the conductive patterns. A flexible metal base circuit board characterized by being configured as follows.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4721584U JPS60158763U (en) | 1984-03-31 | 1984-03-31 | Flexible metal-based circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4721584U JPS60158763U (en) | 1984-03-31 | 1984-03-31 | Flexible metal-based circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS60158763U true JPS60158763U (en) | 1985-10-22 |
Family
ID=30562340
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4721584U Pending JPS60158763U (en) | 1984-03-31 | 1984-03-31 | Flexible metal-based circuit board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60158763U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2022077489A (en) * | 2020-11-11 | 2022-05-23 | 宸寰科技有限公司 | Heat-dissipating conductive flexible substrate |
-
1984
- 1984-03-31 JP JP4721584U patent/JPS60158763U/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2022077489A (en) * | 2020-11-11 | 2022-05-23 | 宸寰科技有限公司 | Heat-dissipating conductive flexible substrate |
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