JPS58105162U - flexible circuit board - Google Patents
flexible circuit boardInfo
- Publication number
- JPS58105162U JPS58105162U JP75382U JP75382U JPS58105162U JP S58105162 U JPS58105162 U JP S58105162U JP 75382 U JP75382 U JP 75382U JP 75382 U JP75382 U JP 75382U JP S58105162 U JPS58105162 U JP S58105162U
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- flexible circuit
- conductive pattern
- flexible
- flexible substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000463 material Substances 0.000 claims description 5
- 239000000758 substrate Substances 0.000 claims description 3
- 239000011248 coating agent Substances 0.000 claims description 2
- 238000000576 coating method Methods 0.000 claims description 2
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図は従来のフレキシブル基板を示す平面図、・ 第
２図は同組立状態を示す斜視図、第３図はこの考案によ
るフレキシブル基板を示す一部平面図、第４図は第′３
図ＩＶ−ＩＶ線に沿う拡大断面図、第５図は組立状態を
示す斜面図、第６図は他の実施例によるプリント基板の
断面図、第７図は同組立状態を示す斜視図である。
１０・・・フレキシブル基板、１１・・・ベース材、１
２・・・導電パターン、１３．１５・・・コーテイング
材、１４・・・保形材、１６．１７・・・プリント基板
。Fig. 1 is a plan view showing a conventional flexible board, Fig. 2 is a perspective view showing the assembled state, Fig. 3 is a partial plan view showing a flexible board according to this invention, and Fig. 4 is a
FIG. 5 is an enlarged sectional view taken along the line IV-IV, FIG. 5 is a perspective view showing an assembled state, FIG. 6 is a sectional view of a printed circuit board according to another embodiment, and FIG. 7 is a perspective view showing the same assembled state. . 10...Flexible substrate, 11...Base material, 1
2... Conductive pattern, 13.15... Coating material, 14... Shape retaining material, 16.17... Printed circuit board.
Claims (1)
け、この導電パターンをコーテイング材で被覆して構成
したフレキシブル基板において、ベース材に塑性のある
金属材による保形材を添設し、フレキシブル基板を任意
にフォーミングできるように構成したことを特徴とする
フレキシブル基板。A flexible substrate is constructed by providing a conductive pattern on a flexible, insulating base material and covering this conductive pattern with a coating material. A flexible substrate characterized by being configured so that it can be formed arbitrarily.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP75382U JPS58105162U (en) | 1982-01-07 | 1982-01-07 | flexible circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP75382U JPS58105162U (en) | 1982-01-07 | 1982-01-07 | flexible circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS58105162U true JPS58105162U (en) | 1983-07-18 |
Family
ID=30013812
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP75382U Pending JPS58105162U (en) | 1982-01-07 | 1982-01-07 | flexible circuit board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58105162U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2006080298A1 (en) * | 2005-01-25 | 2006-08-03 | The Furukawa Electric Co., Ltd. | Three-dimensional wiring body for mounting electronic component and electronic component mounting structure |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5591895A (en) * | 1978-12-29 | 1980-07-11 | Matsushita Electric Works Ltd | Flexible circuit copper coated plate |
-
1982
- 1982-01-07 JP JP75382U patent/JPS58105162U/en active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5591895A (en) * | 1978-12-29 | 1980-07-11 | Matsushita Electric Works Ltd | Flexible circuit copper coated plate |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2006080298A1 (en) * | 2005-01-25 | 2006-08-03 | The Furukawa Electric Co., Ltd. | Three-dimensional wiring body for mounting electronic component and electronic component mounting structure |
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