JPS60192472U - flexible circuit board - Google Patents

flexible circuit board

Info

Publication number
JPS60192472U
JPS60192472U JP8073384U JP8073384U JPS60192472U JP S60192472 U JPS60192472 U JP S60192472U JP 8073384 U JP8073384 U JP 8073384U JP 8073384 U JP8073384 U JP 8073384U JP S60192472 U JPS60192472 U JP S60192472U
Authority
JP
Japan
Prior art keywords
circuit board
flexible circuit
circuit pattern
adhesive
flexible
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP8073384U
Other languages
Japanese (ja)
Inventor
塚原 利幸
水子 務
Original Assignee
日本メクトロン株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日本メクトロン株式会社 filed Critical 日本メクトロン株式会社
Priority to JP8073384U priority Critical patent/JPS60192472U/en
Publication of JPS60192472U publication Critical patent/JPS60192472U/en
Pending legal-status Critical Current

Links

Landscapes

  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Structure Of Printed Boards (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of drawings]

第1図は本考案に係るフレキシブル回路基板の一実施例
を概念的に示す断面図、第2図は従来のフレキシブル回
路基板の一般的構成を概念的に示す断面図である。 1・・・ベース部材、2・・・接着剤、3・・・回路パ
ターン、4・・・回路パターン形成部、5・・・回路パ
ターン非形晟部、6・・・表面被覆材。
FIG. 1 is a sectional view conceptually showing an embodiment of a flexible circuit board according to the present invention, and FIG. 2 is a sectional view conceptually showing the general structure of a conventional flexible circuit board. DESCRIPTION OF SYMBOLS 1... Base member, 2... Adhesive, 3... Circuit pattern, 4... Circuit pattern forming part, 5... Circuit pattern non-shaped part, 6... Surface covering material.

Claims (1)

【実用新案登録請求の範囲】 ベース部材の少なくとも一方の面に接着剤を介・  し
て回路パターンを形成したフレキシブル回路基板におい
て、表面被覆材を前記回路パターンの表面、及び、回路
パターンカセ形成されずに露出している接着剤の表面の
双方にわたって被着させて成るフレキシブル回路基板。    ゛
[Claims for Utility Model Registration] In a flexible circuit board in which a circuit pattern is formed on at least one surface of a base member through an adhesive, a surface covering material is applied to the surface of the circuit pattern and the circuit pattern casing formed on the flexible circuit board. A flexible circuit board formed by applying adhesive to both exposed surfaces.゛
JP8073384U 1984-05-31 1984-05-31 flexible circuit board Pending JPS60192472U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8073384U JPS60192472U (en) 1984-05-31 1984-05-31 flexible circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8073384U JPS60192472U (en) 1984-05-31 1984-05-31 flexible circuit board

Publications (1)

Publication Number Publication Date
JPS60192472U true JPS60192472U (en) 1985-12-20

Family

ID=30626864

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8073384U Pending JPS60192472U (en) 1984-05-31 1984-05-31 flexible circuit board

Country Status (1)

Country Link
JP (1) JPS60192472U (en)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS556834A (en) * 1978-06-29 1980-01-18 Nippon Mektron Kk Surface coated structure for circuit board and method of producing same
JPS58132996A (en) * 1982-02-02 1983-08-08 松下電器産業株式会社 Method of producing flexible printed circuit board

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS556834A (en) * 1978-06-29 1980-01-18 Nippon Mektron Kk Surface coated structure for circuit board and method of producing same
JPS58132996A (en) * 1982-02-02 1983-08-08 松下電器産業株式会社 Method of producing flexible printed circuit board

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