JPS6127272U - Mold flat package - Google Patents

Mold flat package

Info

Publication number
JPS6127272U
JPS6127272U JP10930684U JP10930684U JPS6127272U JP S6127272 U JPS6127272 U JP S6127272U JP 10930684 U JP10930684 U JP 10930684U JP 10930684 U JP10930684 U JP 10930684U JP S6127272 U JPS6127272 U JP S6127272U
Authority
JP
Japan
Prior art keywords
flat package
mold flat
mold
recorded
package
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP10930684U
Other languages
Japanese (ja)
Inventor
肇 田中
秀允 高橋
Original Assignee
日本電気株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日本電気株式会社 filed Critical 日本電気株式会社
Priority to JP10930684U priority Critical patent/JPS6127272U/en
Publication of JPS6127272U publication Critical patent/JPS6127272U/en
Pending legal-status Critical Current

Links

Landscapes

  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】 第１区、第３図は従来例を示す側面図。 第２図、第４図は本考案の一実施例を示す側面図。 １・・・・・・パッケージング、２・・・・・・リニド
、３・・・・・・位置決め用ボス、４・・・・・・プリ
ント配線板、５・・・・・・パッド。[Brief Description of the Drawings] Section 1 and Figure 3 are side views showing a conventional example. FIGS. 2 and 4 are side views showing one embodiment of the present invention. 1...Packaging, 2...Linide, 3...Positioning boss, 4...Printed wiring board, 5...Pad.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] フラットパッケージの裏面に２ケ所以上の位置決め用の
突起を有したことを特徴とするモールドフラットパッケ
ージ。A molded flat package characterized by having two or more positioning protrusions on the back surface of the flat package.
JP10930684U 1984-07-19 1984-07-19 Mold flat package Pending JPS6127272U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10930684U JPS6127272U (en) 1984-07-19 1984-07-19 Mold flat package

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10930684U JPS6127272U (en) 1984-07-19 1984-07-19 Mold flat package

Publications (1)

Publication Number Publication Date
JPS6127272U true JPS6127272U (en) 1986-02-18

Family

ID=30668461

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10930684U Pending JPS6127272U (en) 1984-07-19 1984-07-19 Mold flat package

Country Status (1)

Country Link
JP (1) JPS6127272U (en)

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