JPS58135960U - Hybrid integrated circuit unit - Google Patents

Hybrid integrated circuit unit

Info

Publication number
JPS58135960U
JPS58135960U JP3357782U JP3357782U JPS58135960U JP S58135960 U JPS58135960 U JP S58135960U JP 3357782 U JP3357782 U JP 3357782U JP 3357782 U JP3357782 U JP 3357782U JP S58135960 U JPS58135960 U JP S58135960U
Authority
JP
Japan
Prior art keywords
integrated circuit
circuit unit
hybrid integrated
lead
unit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP3357782U
Other languages
Japanese (ja)
Inventor
越　一峰
Original Assignee
松下電器産業株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 松下電器産業株式会社 filed Critical 松下電器産業株式会社
Priority to JP3357782U priority Critical patent/JPS58135960U/en
Publication of JPS58135960U publication Critical patent/JPS58135960U/en
Pending legal-status Critical Current

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  • Lead Frames For Integrated Circuits (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of drawings]

第１図は本考案による混成集積回路ユニットの′斜視図
、第２図は同底面図、第３図は同側面図、第４図は従来
例を示す斜視図、第５図は同底面図、第６図は同側面図
である。Fig. 1 is a perspective view of a hybrid integrated circuit unit according to the present invention, Fig. 2 is a bottom view thereof, Fig. 3 is a side view thereof, Fig. 4 is a perspective view showing a conventional example, and Fig. 5 is a bottom view thereof. , FIG. 6 is a side view of the same.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] プリント基板に挿入して使用するリードを、混成集積回
路ユニットの厚み方向に対して直角に延出し、かつ、前
記リードを補強するための別のリードを前記ユニット内
に独立して設は外部へ延出して成形した混成集積回路ユ
ニット。A lead inserted into a printed circuit board for use extends perpendicularly to the thickness direction of the hybrid integrated circuit unit, and another lead for reinforcing the lead is provided independently within the unit and externally. A hybrid integrated circuit unit that is extended and molded.
JP3357782U 1982-03-09 1982-03-09 Hybrid integrated circuit unit Pending JPS58135960U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3357782U JPS58135960U (en) 1982-03-09 1982-03-09 Hybrid integrated circuit unit

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3357782U JPS58135960U (en) 1982-03-09 1982-03-09 Hybrid integrated circuit unit

Publications (1)

Publication Number Publication Date
JPS58135960U true JPS58135960U (en) 1983-09-13

Family

ID=30045125

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3357782U Pending JPS58135960U (en) 1982-03-09 1982-03-09 Hybrid integrated circuit unit

Country Status (1)

Country Link
JP (1) JPS58135960U (en)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54150836A (en) * 1978-05-19 1979-11-27 Takasago Thermal Eng Co Lts Hot air temperature controller for air conditioner
JPS5522046B2 (en) * 1977-12-30 1980-06-14

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5522046B2 (en) * 1977-12-30 1980-06-14
JPS54150836A (en) * 1978-05-19 1979-11-27 Takasago Thermal Eng Co Lts Hot air temperature controller for air conditioner

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