JPS58133979U - Board mounting device - Google Patents

Board mounting device

Info

Publication number
JPS58133979U
JPS58133979U JP3021482U JP3021482U JPS58133979U JP S58133979 U JPS58133979 U JP S58133979U JP 3021482 U JP3021482 U JP 3021482U JP 3021482 U JP3021482 U JP 3021482U JP S58133979 U JPS58133979 U JP S58133979U
Authority
JP
Japan
Prior art keywords
mounting device
board mounting
printed wiring
plastic resin
base material
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP3021482U
Other languages
Japanese (ja)
Inventor
藤原　幸市
Original Assignee
株式会社日立製作所
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式会社日立製作所 filed Critical 株式会社日立製作所
Priority to JP3021482U priority Critical patent/JPS58133979U/en
Publication of JPS58133979U publication Critical patent/JPS58133979U/en
Pending legal-status Critical Current

Links

Landscapes

  • Mounting Of Printed Circuit Boards And The Like (AREA)
  • Details Of Measuring And Other Instruments (AREA)
  • Jigs For Machine Tools (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は本考案の実施例を示す斜視図、第２図は第１図
のＡ−Ａ線断面図である。 １・・・硬質プリント配線板、２・・・プラスチック樹
脂。FIG. 1 is a perspective view showing an embodiment of the present invention, and FIG. 2 is a sectional view taken along the line A--A in FIG. 1. 1... Rigid printed wiring board, 2... Plastic resin.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 硬質基材を用いたプリント配線板の外周囲にプラスチッ
ク樹脂を額縁状に一体的に形成したことを特徴とする基
板の取付装置。A board mounting device characterized in that a frame-shaped plastic resin is integrally formed around the outer periphery of a printed wiring board using a hard base material.
JP3021482U 1982-03-05 1982-03-05 Board mounting device Pending JPS58133979U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3021482U JPS58133979U (en) 1982-03-05 1982-03-05 Board mounting device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3021482U JPS58133979U (en) 1982-03-05 1982-03-05 Board mounting device

Publications (1)

Publication Number Publication Date
JPS58133979U true JPS58133979U (en) 1983-09-09

Family

ID=30041961

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3021482U Pending JPS58133979U (en) 1982-03-05 1982-03-05 Board mounting device

Country Status (1)

Country Link
JP (1) JPS58133979U (en)

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