JPS5858374U - printed circuit board - Google Patents

printed circuit board

Info

Publication number
JPS5858374U
JPS5858374U JP15274381U JP15274381U JPS5858374U JP S5858374 U JPS5858374 U JP S5858374U JP 15274381 U JP15274381 U JP 15274381U JP 15274381 U JP15274381 U JP 15274381U JP S5858374 U JPS5858374 U JP S5858374U
Authority
JP
Japan
Prior art keywords
circuit board
printed circuit
electronic component
land
bonding land
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP15274381U
Other languages
Japanese (ja)
Other versions
JPH0225251Y2 (en
Inventor
志熊　孝夫
Original Assignee
日本電気株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日本電気株式会社 filed Critical 日本電気株式会社
Priority to JP15274381U priority Critical patent/JPS5858374U/en
Publication of JPS5858374U publication Critical patent/JPS5858374U/en
Application granted granted Critical
Publication of JPH0225251Y2 publication Critical patent/JPH0225251Y2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図ａ、　　ｂは従来の厚膜印刷基板の一例の平面図
とそのＡ−Ａ’断面図、第２図ａ、　　ｂは来者　　　
　′案の一実施例の平面図、とそのＢ−Ｂ’断面図であ
る。 １．１１・・・・・・セラミック絶縁基板、２．１２・
・・・・・導体ランド、３，１３・・・・・・金線、４
．１４・・曲ソルダー、５，１５・・・・・・ＩＣペレ
ット、１６・・・・・・ガラス保護膜。Figures 1a and b are a plan view of an example of a conventional thick-film printed circuit board and its AA' cross-sectional view, and Figures 2a and b are views of visitors.
FIG. 2 is a plan view of an embodiment of the 'plan' and a BB' cross-sectional view thereof. 1.11...Ceramic insulating substrate, 2.12.
...Conductor land, 3, 13...Gold wire, 4
．． 14... Curved solder, 5, 15... IC pellet, 16... Glass protective film.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] セラくツク等の絶縁体の基板上に、電子部品が搭載され
るマウント用ランドと金属細線が接続されるボンディン
グ用ランドとを有する導体層が形成された印刷基板にお
いて、上記マウント用ランドと上記ボンディング用ラン
ドとの間に、上記電子部品を接着するためのロー材の流
出を防止するための防止層が形成されていることを特徴
とする印刷基板。A printed circuit board in which a conductor layer is formed on a substrate made of an insulator such as ceramics, and has a mounting land on which an electronic component is mounted and a bonding land to which a thin metal wire is connected. A printed circuit board characterized in that a prevention layer is formed between the bonding land and the soldering material used to bond the electronic component from flowing out.
JP15274381U 1981-10-14 1981-10-14 printed circuit board Granted JPS5858374U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15274381U JPS5858374U (en) 1981-10-14 1981-10-14 printed circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15274381U JPS5858374U (en) 1981-10-14 1981-10-14 printed circuit board

Publications (2)

Publication Number Publication Date
JPS5858374U true JPS5858374U (en) 1983-04-20
JPH0225251Y2 JPH0225251Y2 (en) 1990-07-11

Family

ID=29945385

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15274381U Granted JPS5858374U (en) 1981-10-14 1981-10-14 printed circuit board

Country Status (1)

Country Link
JP (1) JPS5858374U (en)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS49100566A (en) * 1973-01-30 1974-09-24
JPS5077862A (en) * 1973-11-14 1975-06-25
JPS5520285U (en) * 1978-07-26 1980-02-08

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5520285B2 (en) * 1974-06-10 1980-06-02

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS49100566A (en) * 1973-01-30 1974-09-24
JPS5077862A (en) * 1973-11-14 1975-06-25
JPS5520285U (en) * 1978-07-26 1980-02-08

Also Published As

Publication number Publication date
JPH0225251Y2 (en) 1990-07-11

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