JPH01163334U - - Google Patents

Info

Publication number
JPH01163334U
JPH01163334U JP6019988U JP6019988U JPH01163334U JP H01163334 U JPH01163334 U JP H01163334U JP 6019988 U JP6019988 U JP 6019988U JP 6019988 U JP6019988 U JP 6019988U JP H01163334 U JPH01163334 U JP H01163334U
Authority
JP
Japan
Prior art keywords
integrated circuit
hybrid integrated
chip
electronic component
type electronic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP6019988U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP6019988U priority Critical patent/JPH01163334U/ja
Publication of JPH01163334U publication Critical patent/JPH01163334U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/191—Disposition
    • H01L2924/19101—Disposition of discrete passive components
    • H01L2924/19105—Disposition of discrete passive components in a side-by-side arrangement on a common die mounting substrate

Landscapes

  • Wire Bonding (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は本考案の一実施例を示す断面図、第２
図は従来の混成集積回路装置を示す断面図である
。 １１，２１……セラミツク基板、１２，２２…
…Ａｇ―Ｐｄ厚膜パターン、１３，２３……Ａｇ
ペースト、１４，２４……半導体チツプ、１５，
２５……セラミツクチツプコンデンサ、１５ｅ１
，１５ｅ２……電極、１６，２６……ボンデイン
グ線、１７，２７……シリコーン樹脂、１８，２
８……外部リード端子、１９，２９……エポキシ
樹脂、３０……はんだ。 Fig. 1 is a sectional view showing one embodiment of the present invention;
The figure is a sectional view showing a conventional hybrid integrated circuit device. 11, 21... Ceramic substrate, 12, 22...
...Ag-Pd thick film pattern, 13,23...Ag
Paste, 14, 24...Semiconductor chip, 15,
25... Ceramic chip capacitor, 15e1
, 15e2... Electrode, 16, 26... Bonding wire, 17, 27... Silicone resin, 18, 2
8...External lead terminal, 19, 29...Epoxy resin, 30...Solder.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 混成集積回路基板に半導体チツプ及びチツプ型
電子部品が搭載されてなる混成集積回路装置にお
いて、前記チツプ型電子部品の少なくとも一つの
電極は前記混成集積回路基板から離れた方の表面
に亘つて導電体を有し、その導電体と半導体チツ
プの外部端子とがボンデイング線で接続されてい
ることを特徴とする混成集積回路装置。 In a hybrid integrated circuit device in which a semiconductor chip and a chip-type electronic component are mounted on a hybrid integrated circuit board, at least one electrode of the chip-type electronic component is a conductor over a surface remote from the hybrid integrated circuit board. 1. A hybrid integrated circuit device having a conductor and an external terminal of a semiconductor chip connected by a bonding wire.
JP6019988U 1988-05-06 1988-05-06 Pending JPH01163334U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6019988U JPH01163334U (en) 1988-05-06 1988-05-06

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6019988U JPH01163334U (en) 1988-05-06 1988-05-06

Publications (1)

Publication Number Publication Date
JPH01163334U true JPH01163334U (en) 1989-11-14

Family

ID=31285918

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6019988U Pending JPH01163334U (en) 1988-05-06 1988-05-06

Country Status (1)

Country Link
JP (1) JPH01163334U (en)

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