JPH036831U - - Google Patents
Info
- Publication number
- JPH036831U JPH036831U JP6493889U JP6493889U JPH036831U JP H036831 U JPH036831 U JP H036831U JP 6493889 U JP6493889 U JP 6493889U JP 6493889 U JP6493889 U JP 6493889U JP H036831 U JPH036831 U JP H036831U
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- lsi element
- pad
- mounting structure
- bump
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 1
Description
第１図は本考案によるＬＳＩ素子の実装構造を
示す断面図、第２図、第３図は本考案に使用する
フイルムキヤリアの表面、裏面の構成をそれぞれ
示す説明図、第４図はＥＣを考慮したフイルムキ
ヤリアの変形実施例を示す説明図、第５図は同実
施例のＥＣ態様を示す断面図、第６図ないし第８
図は従来のタブ方式によるＬＳＩ素子の実装構造
を示すもので、第６図はフイルムキヤリアの斜視
図、第７図、第８図はＩＬＢ工程、ＯＬＢ工程を
それぞれ示す断面図である。
図において、１０……回路基板、１１……ＬＳ
Ｉ素子、１２……フイルムキヤリア、１３……リ
ード、１４……バンプパツド、１５……ウ゛イア
、１７……接続パツド、１８……半田バンプ、２
０……ＥＣパツド、２１……カツト部、２２……
ウ゛イアパツドである。
Fig. 1 is a cross-sectional view showing the mounting structure of an LSI element according to the present invention, Figs. 2 and 3 are explanatory diagrams showing the structure of the front and back sides of the film carrier used in the present invention, respectively, and Fig. 4 is an EC. An explanatory diagram showing a modified example of the film carrier considered, FIG. 5 is a sectional view showing an EC mode of the same example, and FIGS. 6 to 8 are
The figures show the mounting structure of an LSI element using the conventional tab method, and FIG. 6 is a perspective view of a film carrier, and FIGS. 7 and 8 are cross-sectional views showing the ILB process and OLB process, respectively. In the figure, 10...circuit board, 11...LS
I element, 12...Film carrier, 13...Lead, 14...Bump pad, 15...Wire, 17...Connection pad, 18...Solder bump, 2
0...EC pad, 21...Cut part, 22...
It's wear-proof.
Claims (1)
１１の実装構造において、 前記ＬＳＩ素子１１の周縁を支持し、ＬＳＩ素
子１１側端子と半田接合されるリード１３が表面
側に形成され、回路基板１０の端子パツド１７と
バンプ接合されるバンプパツド１４が裏面側に形
成され、上記リード１３とバンプパツド１４とが
ウ゛イア１５により接続されているフイルムキヤ
リア１２を介して、ＬＳＩ素子１１が回路基板１
０上に実装されることを特徴とするＬＳＩ素子の
実装構造。[Claims for Utility Model Registration] In a mounting structure for an LSI element 11 mounted on the surface of a circuit board 10, a lead 13 that supports the periphery of the LSI element 11 and is soldered to a terminal on the LSI element 11 side is mounted on the surface of the circuit board 10. A bump pad 14 is formed on the side and bump-bonded to the terminal pad 17 of the circuit board 10, and the lead 13 and the bump pad 14 are connected to each other by a wire 15. 11 is circuit board 1
1. A mounting structure for an LSI element, characterized in that it is mounted on an LSI element.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6493889U JPH036831U (en) | 1989-06-05 | 1989-06-05 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6493889U JPH036831U (en) | 1989-06-05 | 1989-06-05 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH036831U true JPH036831U (en) | 1991-01-23 |
Family
ID=31596319
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6493889U Pending JPH036831U (en) | 1989-06-05 | 1989-06-05 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH036831U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1054147A2 (en) | 1999-05-20 | 2000-11-22 | Honda Giken Kogyo Kabushiki Kaisha | Engine generator unit |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6334936A (en) * | 1986-07-29 | 1988-02-15 | Nec Corp | Mounting structure of tape carrier |
| JPS63137442A (en) * | 1986-11-28 | 1988-06-09 | Rohm Co Ltd | Semiconductor device |
-
1989
- 1989-06-05 JP JP6493889U patent/JPH036831U/ja active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6334936A (en) * | 1986-07-29 | 1988-02-15 | Nec Corp | Mounting structure of tape carrier |
| JPS63137442A (en) * | 1986-11-28 | 1988-06-09 | Rohm Co Ltd | Semiconductor device |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1054147A2 (en) | 1999-05-20 | 2000-11-22 | Honda Giken Kogyo Kabushiki Kaisha | Engine generator unit |