JPH0426520U

JPH0426520U -

Info

Publication number: JPH0426520U
Application number: JP6785990U
Authority: JP
Priority date: 1990-06-28
Filing date: 1990-06-28
Publication date: 1992-03-03

Description

[Brief explanation of the drawing]

第１図は本考案の実施例を示す表面実装用チツ
プ部品の実装状態を示す断面図、第２図は従来の
チツプ部品の電極構造を示す断面図、第３図は従
来の他の表面実装用チツプ部品の電極構造を示す
断面図、第４図は従来の問題点の説明図、第５図
は本考案の他の実施例を示す表面実装用チツプ部
品の実装状態を示す断面図である。２０……基板、２１，２２……パツド、２３，
３２……第１の電極、２４，３５……第２の電極
、２５，３１……表面実装用チツプ部品、３３…
…Ａｇ−Ｐｄ層、３４……Ａｕメツキ。 Fig. 1 is a sectional view showing the mounting state of a surface mount chip component according to an embodiment of the present invention, Fig. 2 is a sectional view showing the electrode structure of a conventional chip part, and Fig. 3 is a sectional view of another conventional surface mount chip component. FIG. 4 is an explanatory diagram of conventional problems, and FIG. 5 is a cross-sectional view showing the mounting state of a surface mount chip component showing another embodiment of the present invention. . 20... Board, 21, 22... Pad, 23,
32...First electrode, 24,35...Second electrode, 25,31...Surface mounting chip component, 33...
...Ag-Pd layer, 34...Au plating.

Claims

[Claims for Utility Model Registration] (1) In a surface mount chip component in which electrodes are formed on both sides, (a) a first component having a surface that is not mirror-finished;
and (b) a second electrode having a mirror-finished surface. (2) In a surface mount chip component in which electrodes are formed on both sides, (a) a first electrode having an unplated surface, and (b) a second electrode having an Au-plated surface. Includes surface mount chip parts. (3) In the mounting structure of a surface mount chip component in which electrodes are formed on both sides, (a) the first part has a surface that is not mirror-finished;
(b) a second electrode having a mirror-finished surface; (c) the first electrode is placed on a substrate pad on the side that is heated in advance during reflow; A mounting structure for surface mount chip components in which electrodes are connected to pads on the board that are heated later during reflow. (4) In the mounting structure of a surface-mount chip component in which electrodes are formed on both sides, (a) a first electrode having an unplated surface, and (b) a second electrode having an Au-plated surface. (c) connecting the first electrode to a pad of the substrate that is heated earlier during reflow, and connecting the second electrode to a pad of the substrate that is heated later during reflow; Mounting structure for surface mount chip components.