JPH0422244U - - Google Patents
Info
- Publication number
- JPH0422244U JPH0422244U JP6364690U JP6364690U JPH0422244U JP H0422244 U JPH0422244 U JP H0422244U JP 6364690 U JP6364690 U JP 6364690U JP 6364690 U JP6364690 U JP 6364690U JP H0422244 U JPH0422244 U JP H0422244U
- Authority
- JP
- Japan
- Prior art keywords
- thick
- film
- electrodes
- integrated circuit
- semiconductor integrated
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 4
- 239000010931 gold Substances 0.000 claims description 4
- 229910052737 gold Inorganic materials 0.000 claims description 4
- 239000004065 semiconductor Substances 0.000 claims 2
- 238000010438 heat treatment Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Landscapes
- Electronic Switches (AREA)
Description
第１図は本考案を厚膜型サーマルヘツドに適用
した一実施例を示す要部斜視図、第２図は同実施
例を幅方向に切断した状態を示す断面図である。
第３図は従来の厚膜型サーマルヘツドを示す断面
図である。
２……基板、４，６，８，１０……メタルオー
ガニツク金電極、１２……発熱体、１４，１６…
…Ａｇ−Ｐｄ厚膜電極、２０……駆動用ＩＣ、２
２……半田バンプ。
FIG. 1 is a perspective view of a main part of an embodiment in which the present invention is applied to a thick film type thermal head, and FIG. 2 is a cross-sectional view of the same embodiment taken in the width direction.
FIG. 3 is a sectional view showing a conventional thick film type thermal head. 2...Substrate, 4,6,8,10...Metal-organic gold electrode, 12...Heating element, 14,16...
...Ag-Pd thick film electrode, 20...Drive IC, 2
2...Solder bump.
Claims (1)
て、少なくとも一部の電極はメタルオーガニツク
金を用いた厚膜金電極であり、厚膜金電極のうち
、少なくとも前記半導体集積回路装置と接続され
るボンデイングパツド部分には厚膜ペーストを用
いた厚膜電極が積層されていることを特徴とする
電子装置。 An electronic device equipped with a semiconductor integrated circuit device, wherein at least some of the electrodes are thick-film gold electrodes using metal-organic gold, and at least the thick-film gold electrodes are connected to the semiconductor integrated circuit device. An electronic device characterized in that a thick film electrode using thick film paste is laminated on a bonding pad portion.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6364690U JPH0422244U (en) | 1990-06-15 | 1990-06-15 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6364690U JPH0422244U (en) | 1990-06-15 | 1990-06-15 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0422244U true JPH0422244U (en) | 1992-02-25 |
Family
ID=31593885
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6364690U Pending JPH0422244U (en) | 1990-06-15 | 1990-06-15 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0422244U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0671133U (en) * | 1993-03-19 | 1994-10-04 | 株式会社三協精機製作所 | Thermal head |
| JPWO2020196349A1 (en) * | 2019-03-26 | 2020-10-01 |
-
1990
- 1990-06-15 JP JP6364690U patent/JPH0422244U/ja active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0671133U (en) * | 1993-03-19 | 1994-10-04 | 株式会社三協精機製作所 | Thermal head |
| JPWO2020196349A1 (en) * | 2019-03-26 | 2020-10-01 | ||
| WO2020196349A1 (en) * | 2019-03-26 | 2020-10-01 | 京セラ株式会社 | Thermal head and thermal printer |
| US11945233B2 (en) | 2019-03-26 | 2024-04-02 | Kyocera Corporation | Thermal head and thermal printer |