JPH03101528U - - Google Patents
Info
- Publication number
- JPH03101528U JPH03101528U JP948390U JP948390U JPH03101528U JP H03101528 U JPH03101528 U JP H03101528U JP 948390 U JP948390 U JP 948390U JP 948390 U JP948390 U JP 948390U JP H03101528 U JPH03101528 U JP H03101528U
- Authority
- JP
- Japan
- Prior art keywords
- bonding position
- window hole
- semiconductor element
- tab tape
- bonded
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 claims description 5
- 239000003566 sealing material Substances 0.000 claims description 2
Landscapes
- Wire Bonding (AREA)
Description
第１図は本考案に係る半導体装置の実施例を示
す断面図（要部拡大図を含む）、第２図は第１図
の要部の拡大平面図である。
１……タブテープ、２……配線基板、３……半
導体素子、４……導通スルーホール、７……封止
材、Ａ……回路基板、Ａ′……ボンデイング位置
。
FIG. 1 is a cross-sectional view (including an enlarged view of the main part) showing an embodiment of a semiconductor device according to the present invention, and FIG. 2 is an enlarged plan view of the main part of FIG. DESCRIPTION OF SYMBOLS 1... Tab tape, 2... Wiring board, 3... Semiconductor element, 4... Conductive through hole, 7... Sealing material, A... Circuit board, A'... Bonding position.
Claims (1)
ボンデイング位置に窓孔が開孔されてその周りに
配線基板が積層一体化され、配線基板の配線とタ
ブテープのリードとを導通スルーホールで電気的
に接続した回路基板と、前記ボンデイング位置に
ボンデイングされた半導体素子と、前記窓孔を通
じて前記ボンデイング位置の表裏両面側に充填さ
れた封止材とを備えてなる半導体装置。 A circuit board in which a window hole is opened at the bonding position where the semiconductor element of the tab tape is bonded, a wiring board is laminated and integrated around the window hole, and the wiring of the wiring board and the lead of the tab tape are electrically connected by a conductive through hole. A semiconductor device comprising: a semiconductor element bonded at the bonding position; and a sealing material filled on both front and back sides of the bonding position through the window hole.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990009483U JP2525354Y2 (en) | 1990-01-31 | 1990-01-31 | Semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990009483U JP2525354Y2 (en) | 1990-01-31 | 1990-01-31 | Semiconductor device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH03101528U true JPH03101528U (en) | 1991-10-23 |
| JP2525354Y2 JP2525354Y2 (en) | 1997-02-12 |
Family
ID=31513083
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1990009483U Expired - Fee Related JP2525354Y2 (en) | 1990-01-31 | 1990-01-31 | Semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2525354Y2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6867068B2 (en) | 1996-10-17 | 2005-03-15 | Seiko Epson Corporation | Semiconductor device, method of making the same, circuit board, and film carrier tape |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03129745A (en) * | 1989-10-16 | 1991-06-03 | Sumitomo Bakelite Co Ltd | Mounting of semiconductor device |
-
1990
- 1990-01-31 JP JP1990009483U patent/JP2525354Y2/en not_active Expired - Fee Related
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03129745A (en) * | 1989-10-16 | 1991-06-03 | Sumitomo Bakelite Co Ltd | Mounting of semiconductor device |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6867068B2 (en) | 1996-10-17 | 2005-03-15 | Seiko Epson Corporation | Semiconductor device, method of making the same, circuit board, and film carrier tape |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2525354Y2 (en) | 1997-02-12 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |