JPS61182048U - - Google Patents
Info
- Publication number
- JPS61182048U JPS61182048U JP6651685U JP6651685U JPS61182048U JP S61182048 U JPS61182048 U JP S61182048U JP 6651685 U JP6651685 U JP 6651685U JP 6651685 U JP6651685 U JP 6651685U JP S61182048 U JPS61182048 U JP S61182048U
- Authority
- JP
- Japan
- Prior art keywords
- hybrid
- pattern
- bonding pattern
- membrane element
- connection
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000012528 membrane Substances 0.000 claims description 3
- 238000005476 soldering Methods 0.000 claims 1
- 125000006850 spacer group Chemical group 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Description
第１図は従来品の斜視断面図を示し、第２図は
本考案の斜視断面図を示す。
１……ＩＣ、２……膜素子、４……リード端子
、１０……基板、１１，２２……接続用パターン
、１２，２１……接合パターン、１３……第１の
混成ＩＣ、２０……スペーサ、２３……第２の混
成ＩＣ。
FIG. 1 shows a perspective sectional view of a conventional product, and FIG. 2 shows a perspective sectional view of the present invention. DESCRIPTION OF SYMBOLS 1...IC, 2...Membrane element, 4...Lead terminal, 10...Substrate, 11, 22...Connection pattern, 12, 21...Joining pattern, 13...First hybrid IC, 20... ...Spacer, 23...Second hybrid IC.
Claims (1)
続用パターンを有しかつ裏面に接合パターンを有
してなる第１の混成ＩＣと、膜素子等を搭載する
とともに外部接続用リード端子と接続用パターン
を有しかつ接合パターンを有する第２の混成ＩＣ
とを、電気的には接続用パターンで接続し、機械
的には接合パターンをはんだ等により機械的に一
体化することを特徴とする混成ＩＣ。 A first hybrid IC on which an IC, a membrane element, etc. are mounted, and has a connection pattern on the end and a bonding pattern on the back side, and a first hybrid IC on which a membrane element, etc. is mounted and is connected to a lead terminal for external connection. a second hybrid IC having a bonding pattern and a bonding pattern;
A hybrid IC characterized in that the two are electrically connected by a connection pattern and mechanically integrated by a bonding pattern by soldering or the like.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6651685U JPS61182048U (en) | 1985-05-07 | 1985-05-07 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6651685U JPS61182048U (en) | 1985-05-07 | 1985-05-07 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS61182048U true JPS61182048U (en) | 1986-11-13 |
Family
ID=30599495
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6651685U Pending JPS61182048U (en) | 1985-05-07 | 1985-05-07 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61182048U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63169797A (en) * | 1987-01-07 | 1988-07-13 | 日本電気株式会社 | Hybrid integrated circuit device |
-
1985
- 1985-05-07 JP JP6651685U patent/JPS61182048U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63169797A (en) * | 1987-01-07 | 1988-07-13 | 日本電気株式会社 | Hybrid integrated circuit device |