JPS6413797U - - Google Patents
Info
- Publication number
- JPS6413797U JPS6413797U JP11015787U JP11015787U JPS6413797U JP S6413797 U JPS6413797 U JP S6413797U JP 11015787 U JP11015787 U JP 11015787U JP 11015787 U JP11015787 U JP 11015787U JP S6413797 U JPS6413797 U JP S6413797U
- Authority
- JP
- Japan
- Prior art keywords
- metal substrates
- counterbore
- insulating metal
- insulating
- counterbore portion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000758 substrate Substances 0.000 claims description 9
- 239000002184 metal Substances 0.000 claims description 8
- 239000000463 material Substances 0.000 claims description 2
Landscapes
- Combinations Of Printed Boards (AREA)
- Casings For Electric Apparatus (AREA)
- Insulated Metal Substrates For Printed Circuits (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Description
第１図は本考案の実施例を示す斜視組立て分解
図、第２図は第１図のマル印内の要部拡大図、第
３図は従来例を示す斜視組立て分解図である。
１，２は絶縁性金属基板、３，６は第１及び第
２のザグリ部、４は接続体、５はケース材、７は
ワイヤ。
FIG. 1 is an exploded perspective view showing an embodiment of the present invention, FIG. 2 is an enlarged view of the main parts circled in FIG. 1, and FIG. 3 is an exploded perspective view of a conventional example. 1 and 2 are insulating metal substrates, 3 and 6 are first and second counterbore portions, 4 is a connecting body, 5 is a case material, and 7 is a wire.
Claims (1)
属基板の一側辺終端部に設けられた第１のザグリ
部と、前記第１のザグリ部が設けられた前記二枚
の絶縁性金属基板の反対面に形成された導電路と
、前記導電路上に固着された回路素子と、前記二
枚の絶縁性金属基板上に形成された前記導電路を
接続すると共に前記二枚の絶縁性金属基板を離間
連結する接続体と、前記回路素子を対向させ前記
接続体を折曲げ前記二枚の絶縁性金属基板を離間
配置する枠部に前記第１のザグリ部に対応する第
２のザグリ部が設けられたケース材と、前記第１
のザグリ部と前記第２のザグリ部とを接続して短
絡させるボンデイングワイヤとを備えたことを特
徴とする混成集積回路。 two insulating metal substrates; a first counterbore portion provided at the end of one side of the two insulating metal substrates; and the two insulating substrates provided with the first counterbore portion. A conductive path formed on the opposite surface of the metal substrate, a circuit element fixed on the conductive path, and the conductive path formed on the two insulating metal substrates are connected, and the two insulating metal substrates are connected. a connecting body for connecting the metal substrates at a distance; and a second counterbore corresponding to the first counterbore portion in a frame portion for making the circuit elements face each other, folding the connecting body, and arranging the two insulating metal substrates at a distance. a case material provided with a portion;
A hybrid integrated circuit comprising: a bonding wire that connects and short-circuits the counterbore portion and the second counterbore portion.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11015787U JPH0534132Y2 (en) | 1987-07-17 | 1987-07-17 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11015787U JPH0534132Y2 (en) | 1987-07-17 | 1987-07-17 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6413797U true JPS6413797U (en) | 1989-01-24 |
| JPH0534132Y2 JPH0534132Y2 (en) | 1993-08-30 |
Family
ID=31347056
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11015787U Expired - Lifetime JPH0534132Y2 (en) | 1987-07-17 | 1987-07-17 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0534132Y2 (en) |
-
1987
- 1987-07-17 JP JP11015787U patent/JPH0534132Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0534132Y2 (en) | 1993-08-30 |