JPH0534132Y2 - - Google Patents

Description

[Detailed description of the invention] (a) Field of industrial application The present invention relates to a hybrid integrated circuit, and in particular to an improvement in the grounding structure of a hybrid integrated circuit for the purpose of electromagnetic shielding.

(b) Conventional technology Conventionally, a hybrid integrated circuit for the purpose of electronic shielding is shown in Figure 3 (see Utility Model Application No. 62-23014).
Two metal substrates 21 and 22 are separated and connected with an insulating film 23, and the film 23 is bent onto a case material 24 made of a metal material so as to face the circuit element 20 fixed on the metal substrates 21 and 22. holes 27 provided in advance at the four corners of the metal substrates 21 and 22 and holes 2 formed in the case material 24.
7', and the case material 24 and the substrates 21, 22 are locked with the screws 28. The screw 28 is the board 2
It not only locks the substrates 21, 22 and the case material 24, but also serves to bring the substrates 21, 22 and the case material 24 to the same potential. Furthermore, a metal lid body 26 is provided on the case material to protect the film 23 at the bent portion.
is fixed to the case material 24 with screws 28 and integrated.

By covering the entire device with metal in this manner, electromagnetic waves from the outside can be completely shielded, and adverse effects such as malfunction due to electromagnetic waves can be prevented.

(c) Problems that the invention aims to solve However, in conventional hybrid integrated circuits, screws were used to bring the metal case and the insulating metal substrate to the same potential, so screw holes were provided in the substrate. Therefore, there was a problem that the board mounting area became smaller. Further, there is a problem in that the workability is significantly reduced when screwing is used.

(d) Means for solving the problems The present invention was made in view of the problems mentioned above, and as shown in Figs. 1 and 2, two insulating metal substrates 1 and 2 are used. A first counterbore 3 provided at the end of one side, a conductive path 8 formed on the opposite surface of the two insulating metal substrates 1 and 2 provided with the first counterbore 3, A connecting body 4 that connects the circuit element 11 fixed on the path 8 and the conductive paths 8, 8 formed on the two insulating metal substrates 1, 2, and connects the two substrates 1, 2 apart. and circuit element 1
1 and 2 by bending the connecting body 4 so that they face each other.
A case material 5 in which a second counterbore part 6 corresponding to the first counterbore part 3 is provided on a frame part 14 which is spaced apart from the other parts.
This is solved by providing a bonding wire 7 that connects and short-circuits the first counterbore part 3 and the second counterbore part 6.

(E) Effect As described above, according to the present invention, the first counterbore portion is provided at the end of one side of the two insulating metal substrates, and the second counterbore portion corresponding to the first counterbore portion is attached to the case. By providing the holes in the frame of the material and connecting the respective counterbore portions with bonding wires for short-circuiting, the mounting area of the substrate can be improved since there is no need to provide holes in the substrate as in the conventional case.

(f) Examples The present invention will be described in detail below based on the examples shown in FIGS. 1 and 2.

As shown in FIG. 1, the hybrid integrated circuit of the present invention includes two insulating metal substrates 1 and 2, and a first counterbore 3 provided at the end of the two insulating metal substrates 1 and 2. , a connecting body 4 that connects and connects two insulating metal substrates 1 and 2, a case material 5 that arranges the two substrates 1 and 2 apart, and a second
, and a wire 7 connecting the first counterbore part 3 and the second counterbore part 6.

Aluminum substrates are used as the two insulating metal substrates 1 and 2, and an aluminum oxide film is formed on their surfaces by anodic oxidation to make them insulating. Further, in order to improve insulation, an insulating resin 19 such as epoxy resin or polyimide resin is adhered to one main surface of the two insulating metal substrates 1 and 2. A copper foil is integrated with the insulating resin in advance, and the copper foil is etched into a desired shape to form a conductive path 8 in a desired pattern shape.

A plurality of conductive pads 10 to which the connecting bodies 4 and external leads 9 are firmly connected are formed at the end peripheries of opposing sides of each of the substrates 1 and 2 on which the conductive paths 8 are formed. A first counterbore portion 3 is formed on the opposite surface of the two substrates 1 and 2 on which the conductive path 8 is formed, that is, on the exposed surface side of the substrate. The first counterbore portion 3 is a conductive pad 10
It is provided at the end of one side of the substrates 1 and 2 where no other side is provided. The size of the first counterbore portion 3 can be any shape as long as it can be bonded with a wire, and here a semicircle is formed.

Circuit elements 11 such as chip resistors, chip capacitors, capacitors, ICs, transistors, etc. are fixedly mounted on the conductive paths 8 of the respective substrates 1 and 2.

The connecting bodies 4 are firmly connected to the conductive pads 10 on each of the two substrates 1 and 2, and connect the circuits formed on the two substrates 1 and 2, and also separate and connect the substrates 1 and 2. The connecting body 4 has a conductive pattern formed on a flexible insulating film 12 made of polyimide resin, etc. Conductive wires 13, which are conductive patterns, are led out from both ends of the insulating film 12, and their tips are placed on each conductive pad 10. is soldered to.

The case material 5 is made of metal aluminum,
A frame portion 14 that fixes the substrates 1 and 2 apart, and
2 and a lid 16.

The frame portion 14 is formed into a frame shape in order to face the circuit elements 11 fixed on the two substrates 1 and 2 and fix the substrates 1 and 2 apart from each other. A second counterbore portion 6 is formed at a position corresponding to the first counterbore portion 3 provided in . The second counterbore portion 6 may have any shape as long as it can be bonded like the first counterbore portion 3,
For example, it is also possible to form a semicircle or a concave portion.

Further, leg portions 15 extending from the frame portion 14 are provided at both lower ends of the frame portion 14. Stoppers 16 are provided at both ends of the leg portions 15 to be inserted into insertion holes previously provided in a printed circuit board such as a mounting board. A lid body 1 is provided at each corner of the upper surface of the frame portion 14.
A protrusion 17 for fitting with the frame 14 is provided integrally with the frame 14. The partition plate 15 is provided approximately at the center inside the frame portion 14 . That is, the partition plate 15 is provided parallel to the substrates 1 and 2 so as to divide the space formed by the case material 5 and the two metal substrates 1 and 2 into two.

The lid body 16 is formed into a concave shape except for the periphery, as shown in FIG. Ru. In addition, the frame portions 1 are provided at both ends of the lid body 16.
A convex portion 18 that fits between the protrusions 17 of No. 4 is formed.

The two boards 1 and 2 are separated and connected by the connecting body 4, and the connecting body 4 is bent and arranged on the upper surface of the frame part 14 of the case material 5, and the legs 14 are sandwiched between the two boards 1 and 2 to complete the case. The material 5 and the substrates 1 and 2 are integrated. At this time, since a frame-shaped adhesive sheet is placed on the frame portion 14 of the case material 5, it is strongly adhered.

When the case material 5 and the substrates 1 and 2 are integrated, the first and second counterbore portions 3 and 6 are arranged correspondingly as shown in FIG. The first and second counterbore portions 3 and 6 are bonded and connected by a wire 7 using a commonly used bonding device. The wires 7 bring the substrates 1, 2 and the case material 5 to the same potential, thereby providing electromagnetic shielding. At this time, since the wire 7 is placed in the first and second counterbore portions 3 and 6, there is no risk of it being cut, but resin may be placed in the first and second counterbore portions 3 and 6.

(g) Effects of the invention As detailed above, according to the invention, a first counterbore part is provided on the terminal side of the board, and a second counterbore part corresponding to the first counterbore part is provided in the case material. By connecting the first and second counterbore parts with a wire, the board and case material can be made to have the same potential without creating a hole in the board as in the conventional case. increases, and packaging density improves.

[Brief explanation of the drawing]

FIG. 1 is an exploded perspective view showing an embodiment of the present invention, FIG. 2 is an enlarged view of the main parts circled in FIG. 1, and FIG. 3 is an exploded perspective view of a conventional example. 1 and 2 are insulating metal substrates, 3 and 6 are first and second counterbore portions, 4 is a connecting body, 5 is a case material, and 7 is a wire.

Claims (1)

[Scope of utility model registration request] two insulating metal substrates; a first counterbore portion provided at the end of one side of the two insulating metal substrates; and the two insulating substrates provided with the first counterbore portion. A conductive path formed on the opposite surface of the metal substrate, a circuit element fixed on the conductive path, and the conductive path formed on the two insulating metal substrates are connected, and the insulating properties of the two sheets are a connecting body for connecting the metal substrates at a distance; and a second counterbore corresponding to the first counterbore portion in a frame portion for making the circuit elements face each other, bending the connecting body, and arranging the two insulating metal substrates apart from each other. What is claimed is: 1. A hybrid integrated circuit comprising: a case material provided with a section; and a bonding wire that connects and short-circuits the first counterbore section and the second counterbore section.