JPH0430564A - High power hybrid integrated circuit device - Google Patents

Abstract

PURPOSE:To ensure high integration by deriving a small signal lead terminal from one substrate without allowing the terminal to protrude from a substrate surface, and extending a power lead terminal fixed onto the other substrate along a casing and disposing a connection part between the terminal and the casing such that said connection part is substantially flush with the exposed surface of the one substrate. CONSTITUTION:A small signal lead terminals 3a for connection to external circuits is fixedly mounted on a pad 6a provided on the opposing peripheral edges of a substrate 1a. The lead terminal 3a alows its tip end to be disposed, directed upwardly from a horizontal direction and not to be protruded from an exposed surface of the one substrate 1a. A power thick conductor passage 5b is primarily formed on the substrate 1b. A plurality of puds 6b for fixing the power lead terminal are provided on one peripheral edge side of the substrate 1b extended from the conductor passage 5b, on which pads 6b power lead terminals 3b are fixed. Further, not only the power conductor line 5b but also a conductor passage of part of a signal system are formed on the other substrate 1b.

Description

Detailed Description of the Invention (a) Industrial Application Field The present invention relates to a high-output hybrid integrated circuit device in which a high-output circuit board and a control circuit board for controlling the same are integrated via a case material. More specifically, the present invention relates to a package structure of a high-output hybrid integrated circuit device.

(b) Conventional technology In general, power semiconductor devices can be used for power drive control of outdoor units of inverter air conditioners, etc., but in conventional power semiconductor devices of this type, power semiconductor elements are not connected to each other!
A power circuit board and a control circuit board to which various electrical components are connected are separately and independently arranged on a control panel or the like. For this reason, it has been difficult to downsize the device and to form it into an easily replaceable module.

Therefore, in recent years, in order to solve the above-mentioned problems, there has been a power semiconductor device in which a power circuit board and a control circuit board are integrated into one package.

FIG. 7 is a sectional view showing, for example, one conventional power semiconductor device.

As shown in FIG. 7, it is equipped with a power circuit board (51) and a control circuit board (52). 56), and the control circuit board (52
) is fitted into the molding resin outer frame (54) and fixed by injection hardening of a sealing resin (58) such as epoxy resin, so that both circuit boards (51)<52) are fitted into the molding resin outer frame<54> are stacked and held parallel to each other. Then, power semiconductor elements (such as transistors and diodes) are connected to the wiring pattern formed on the power circuit board (51).
110), various electrical components (112) are respectively connected to wiring patterns formed on the control circuit board (52). Further, external input/output terminals (114) are soldered to the power circuit board (51>), and these external input/output terminals (114) are connected to the sealing resin (58) and the control circuit board (5).
2) and is led out to the top. Further, an external connection connector (116) is connected to the control circuit board (52), and this external connection connector (116) is connected to the sealing resin (
58) and protrudes from the top. The power circuit board (51>) and the control circuit board (52) are electrically connected to each other by a board connection connector (118).

(c) Problems to be Solved by the Invention The conventional power semiconductor device described above has various problems as shown below.

First of all, although such power semiconductor devices have been able to achieve miniaturization and replaceable module form, the power circuit board (5
1) and the control circuit board (52) is an internally injected resin (5).
6) and the sealing resin (58), the heat generated from the power semiconductor element (110) placed on the power circuit board (51) is transferred to the internal injection resin (56) and the sealing resin. (58) to the various electrical components (112) arranged on the control circuit board (52), and as a result, the various electrical components (112) are affected by heat and their characteristics change. This causes malfunction and is a major constraint on the power circuit formed on the power circuit board (51). Therefore, there is a big problem that a device compatible with high power circuits of 50A to 200A class cannot be realized.

Next, the control circuit board (52) is formed of a resin-based board, and includes electrical components (112) mounted on the board (52).
Since the structure is such that the noise is disposed on the top surface side, the noise resistance is extremely poor, resulting in malfunctions due to noise.

Furthermore, the connection between the power circuit board (51) and the control circuit board (52) is made by first fixing the power circuit board (51) to the outer frame (54) and making the connections on the board (51) in advance. The connector (11g) must be protruded from the surface of the board (52) and the protrusion must be soldered, which significantly reduces workability and reliability and also precludes automation.

Furthermore, input/output terminals (114) and connectors (116)
Since all of the terminals protrude upward from the main body, there is a problem in that stacking cannot be performed when completed, which reduces the efficiency of packaging work.

(d) Means for Solving the Problems The present invention has been made in view of the above-mentioned problems, and includes two metal substrates that are arranged facing each other so that the surface of at least one of the substrates is exposed, and both of the substrates. a plurality of control system circuit elements connected to the conductive path on the one substrate, and a plurality of power system circuit elements connected to the conductive path on the other substrate. and a case material for fixing and integrating the side substrates, a small signal lead terminal is led out from the peripheral edge of at least one side of the one substrate, and a power source is fixed to the peripheral edge of the other substrate. The external connection portion of the lead terminal for use is arranged on the same surface as the exposed surface of the one substrate.

*) Function As described above, according to the present invention, two metal substrates are arranged facing each other with a case material in between so that the surface of one of the substrates is exposed, and a small signal lead terminal is connected from one of the substrates. The power lead terminal fixed on the other board is led out without protruding from the surface of the board, and is extended along the case material so that the connection part is between the exposed surface of one board and the surface. By arranging the lead terminals on both substrates, it is possible to provide a high-output hybrid integrated circuit device in which the lead terminals fixed to both substrates do not protrude.

Furthermore, in the high-output hybrid integrated circuit device of the present invention, circuit elements such as control system transistors, ICs, chip capacitors, and chip resistors are used in the form of chips on one of the substrates, the surface of which is exposed. This makes it possible to provide a highly integrated control board.

Furthermore, since the two substrates are connected at the peripheral edge portions of each substrate, there is an advantage that the connection between the two substrates can be performed extremely easily.

Furthermore, since both substrates are arranged so that their back surfaces are fully exposed and their respective circuit elements face each other, the shielding effect against external noise is significantly improved.

(F) Embodiment The high-output hybrid integrated circuit device of the present invention will be explained in detail below based on the embodiment shown in FIGS. 1 to 3.

FIG. 1 is a sectional view showing a high-output hybrid integrated circuit device of the present invention, FIG. 2 is a plan view, and FIG. 3 is a front view.

As shown in FIGS. 1 to 3, the high-output hybrid integrated circuit device of the present invention includes two metal substrates (LA) (LB) and a plurality of Control system and power system circuit elements (2a) (2b), both boards (1a
) (lb), small signal and power lead terminals (3a) (3b) fixed to the peripheral edge of the board (lb), and two boards (1a
) (1b) separated and fixedly integrated (4)
It consists of

As the metal substrate, for example, an aluminum substrate with a thickness of 0.5 to 5.0 mm is used. Both boards (ia) (lb)
An aluminum oxide film (alumite layer) is formed on the surface by well-known anodic oxidation, and a 10 to 7
An insulating resin layer such as epoxy or polyimide with a thickness of 0 μm is pasted. Further, a copper foil having a thickness of 10 to 105 .mu.m is adhered onto the insulating resin layer simultaneously with the insulating resin layer by means such as a roller or hot press.

On the surface of the copper foil provided on the main surfaces of both substrates (la) and (lb), a conductive path of a desired shape is exposed by screen printing and masked with a resist, and precious metals (gold, silver, platinum) are coated.
A plating layer is plated on the surface of the copper foil. Thereafter, the resist is removed and the copper foil is etched using the noble metal plating layer as a mask to form a desired conductive path. Here, the limit for the thinness of the conductive path by screen printing is 0.5 mm, so when an ultra-fine wiring pattern is required, it is possible to form an ultra-fine conductive path of up to about 2μ rule using well-known photo-etching technology. Become.

Figure 4 shows two substrates (
la) This is a plan view of one board (1a) of (lb), that is, the control circuit board.As is clear from FIG. Conductive path (
5a) is formed substantially over the entire surface of the substrate (1a). A plurality of lead fixing pads (6a) are provided at the peripheral end of the substrate (1a) along which the conductive path (5a) extends.

Pads (6) provided on opposing peripheral edges of the substrate (1a)
a) has a small signal lead terminal (
3a) is fixed. This lead terminal (3a) is not clearly shown in each figure, but its tip is arranged so that it faces upwards from the horizontal direction, and the lead terminal (3a)
The tip of 3a) is designed so that it does not protrude beyond the exposed surface (opposite surface) of one substrate (1a).In addition, the fixing pad (1a) provided on the other side of one substrate (1a)
6a') is a fixing pad for connecting to the other substrate (1b) which will be described later.

Chip-shaped circuit elements (2a) such as transistors, ICs, chip capacitors, and chip resistors that do not generate heat are mounted in the form of a die at predetermined positions on the control system board (1a) described above.

On the other hand, Fig. 5 is a plan view of the other board (1b), that is, the power output board, and as shown in Fig. 5, there are mainly thick conductive paths (5b) for power on the board (1b). Completely formed. A plurality of pads (6b) for fixing power lead terminals are provided on the peripheral edge of the substrate (1b) extending from the conductive path (5b), and the power lead terminals are attached to the pads (6b). 3b> is fixed. In addition, on the other substrate (1b), not only a power conductive path (5b) but also some signal system conductive paths are formed, and the tip of the conductive path is connected to a power lead terminal (3b). A pad (6b') is formed to extend on the opposite side to which is fixed, and is connected to the connection pad (6a') of the one substrate (1a) described above.

On this other board <1b> are mounted power elements such as a power transistor, power MO8, IGBT, and a plurality of circuit elements (2b) that constitute a power system protection circuit including a large current detection resistor. There is. Needless to explain, what is required for a power element is a substrate (1b) via a so-called heat sink material (7) such as Cu or Invar.
mounted on top.

In addition, the thickness of the copper foil of the other board (1b) in this example is 1
05μ, it is possible to flow a large current of 100A to 200A class with minimal heat generation.

The power lead terminal (3b) fixed on the other board (1b) is fixed to the fixing pad (6b) as shown in Figs. It is formed by bending.

This bent portion is bent along the surface of a case material (4), which will be described later, but in this embodiment, it is bent at a substantially right angle. More specifically, the power lead terminal (3b) of this embodiment is bent so that its connecting portion is flush with the exposed surface of one of the substrates (1a). That is, both lead terminals (3a) and (3b) are arranged without protruding to the upper surface side.

By the way, of the two boards (la) and (lb), the other board (1b) for the power system is thicker than the one board (1a) for the control system.
) This was taken into consideration during the design so that it would be larger. Those two boards (la) (lb) are connected to the respective circuit elements (2a
) (2b) are fixedly integrated with each other with a predetermined distance between them by the case material (4) so that they face each other.

The case material (4) used in this example will be explained using FIGS. 6A to 6C.

Figure 6A is a front view of the case material (4), Figure B is a plan view,
Figure C is a bottom view.

As shown in FIG. 6A to FIG. A wing-shaped locking part (11) led out from both ends and a power lead terminal (3b
) is comprised as a main part of an external connection member (12) which is substantially abutted and connected to an external circuit.

Furthermore, in the case material (4) of this embodiment, in addition to the above-mentioned main components, there is a protrusion (13) that forms a region for connecting both substrates (la) and (lb), and a case material (4) after injection molding.
A reinforcing portion (19) for preventing distortion (warping) of the case material (4) is integrally formed with the case material (4).

The characteristic of the case material (4) is that the external connection member (
12). That is, the external connection member (12) is provided on the vertical and horizontal surfaces of the case material (4) so that the connection portion of the power lead terminal (3b) is set on the side and top surfaces of the device, respectively. (12) is provided with a hole <19') into which a nut for screwing is inserted.

Further, the plurality of external connection members (12) are partitioned into blocks by slits (14') having a predetermined depth. This slit (14') is designed so that an insulator (not shown) can be inserted into the slit (14') to maintain a constant insulation distance between adjacent power lead terminals.

Both substrates (1a) and (lb) are integrated with the case material (4) using such a case material (4).

One board (1a) that will become the control system circuit board is made of case material (
4) Place the other board (which will become the power circuit board) on the top side.
1b) is arranged on the bottom side of the case material (4), and the circuit elements (2a) (
2b) are considered to be opposite to each other. Incidentally, the case material (4) and the respective substrates (1g) (lb) are bonded together using an adhesive sheet (J sheet: trade name) by a hot press bonding method.

Inner board (1g>(lb) integrally fixed to case material (4)
is the protrusion (13) of the case material (4) and the inner board (la)
(lb) are electrically connected to each other within the space formed by the peripheral end portion. There are several ways to connect them, such as film and metal leads, but in this example, metal leads (15) are used to connect both boards (la) and (lb). After that, the above-mentioned space is filled with an epoxy sealing resin (17) to protect each connection area. In addition, since it is necessary to fill the space formed by the inner substrates (1a) (1b) and the protrusion (13) with resin (17), the peripheral edges of the inner substrates (la) (lb) are approximately Designed to match.

One board (1a) arranged on the top surface of the case material (4)
As shown in FIG. 2, the small signal lead terminal (3a) derived from the
As shown in FIG. 3, the tip of 3a) does not protrude from the surface of the substrate (1a).

On the other hand, the other board (
The power lead terminal (3b) fixed to the first
As shown in Figure 31150, the lead terminal (
The connecting portion 3b) is bent so as to be flush with the exposed surface of one substrate (1a). Since the nut (16) is placed in advance in the hole (13') of the external connection member (12) of the case material (4), the nut (16) is sealed by the bent lead terminal (3b). The state will be as follows. Needless to explain, the lead terminal (3b) has a hole, insert the screw (18) into the hole, and screw the screw (18) and nut (16) together to connect the power lead terminal. Connect <3b) with the external circuit.

In this embodiment, a mother board (20) serving as a third board is fixedly and integrally fixed to the surface of the other board (1b).

For the purpose of improving heat dissipation and insulation, the motherboard (20) is a metal substrate, and its main surface is provided with an insulating resin layer (not shown) such as polyimide resin. There is. As is clear from FIG. 1, this mother board <20> is formed larger than the other board (1b), and is housed in the case material (4) like the two boards (la) and (1b>).

That is, the mother board (20) is arranged in the area indicated by the dashed line as shown in FIG. 6C (a diagram showing the bottom surface of the case material). At this time, the position of the mother board (20) is regulated by the wing-shaped locking parts (11) provided at both ends of the case material (4), so that the other board (lb) and the mother board (20) There is no risk of problems such as misalignment when fixing.

When the mother board (20) and the other board (1b) are fixed and integrally connected to the case material (4), the connection between the mother board (20) and the case material (4) is established as shown in Figures 1 and 3. The space formed by the member (12) is filled with an epoxy sealing resin (17), and the enclosure connection portion of the power lead terminal (3b) is sealed and protected.

According to the present invention, two metal substrates are arranged facing each other with a case material in between so that the surface of one of the substrates is exposed, and a lead terminal for a small signal is protruded from the surface of one of the substrates. By extending the power lead terminal fixed on the other board along the case material and arranging the connection part so that it is on the surface between the exposed surface of one board and the path, It is possible to provide a high-output hybrid integrated circuit device in which the lead terminals fixed to the inner substrate do not protrude. As a result, a high-output hybrid integrated circuit device that is thin and easy to handle can be realized.

(G) Effects of the Invention As detailed above, according to the present invention, the inner substrate (la)
The respective lead terminals (3a) (3b) fixed to (lb)
) is arranged on one substrate (1a) side, that is, on the top surface side without protruding, so that a thin device with excellent handling properties can be provided.

Furthermore, according to the present invention, since the surface of one substrate (1a) is exposed, the other substrate (1a) for power
1b) is significantly reduced compared to the conventional structure. As a result, the other board (1
b) Even if a high output circuit is formed on the circuit board (1a) of the control system, heat may damage the circuit elements (
The reliability of 2a) can be improved.

Further, according to the present invention, since the chip-shaped circuit elements (2a) (2b) are fully mounted on the inner substrates (la) (lb), it is possible to provide a highly integrated, high-output hybrid integrated circuit device. be able to.

[Brief explanation of drawings]

FIG. 1 is a sectional view showing the present invention, FIG. 2 is a plan view of FIG. 1, FIG. 3 is a front view of FIG. 1, FIGS. 4 and 5 are plan views showing the substrate, and FIG. A to C are views showing the case material used in this embodiment, and FIG. 7 is a sectional view showing a conventional example. (1g>(lb) is the board, (2a) (2b) are the circuit elements, (3a) (3b) are the lead terminals, (4) is the case material,
(5a) (5b) are conductive paths, (6a) (6b) are pads for fixing lead terminals, (7) are heat sinks, (10) are frame parts, (11) are locking parts, (12) are external connections Element,(
13) is a protruding part, <14) is a reinforcing part, (15) is a metal lead, (16) is a nut, (17) is a sealing resin, (1
8) is a screw, and (20) is a motherboard.

Claims (5)

[Claims] (1) Two metal substrates placed opposite each other so that the surface of at least one of the substrates is exposed, a conductive path formed on both substrates having a desired shape, and a conductive path on the one substrate connected to the conductive path. At least one side of the one substrate, comprising a plurality of control system circuit elements, a plurality of power system circuit elements connected to conductive paths on the other substrate, and a case material that fixes and integrates both the substrates. The small signal lead terminal is led out from the peripheral edge, and the external connection part of the power lead terminal fixed to the peripheral edge of the other board is arranged on the same surface as the exposed surface of the one board. A hybrid integrated circuit device for high output. (2) The high output hybrid integrated circuit device according to claim 1, wherein the conductive path is made of copper foil. (3) The high-output hybrid integrated circuit device according to claim 1, wherein the other substrate is larger than the one substrate, and the respective substrates are electrically connected to each other. (4) Claim 3, wherein the peripheral edges of the respective substrates to which the two substrates are electrically connected are substantially aligned.
The high output hybrid integrated circuit device described above. (5) The high output hybrid integrated circuit device according to claim 1, wherein the power lead terminal is bent upward.