JP3232723B2 - Electronic circuit device and method of manufacturing the same - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic circuit device comprising a semiconductor element, a resistor, a capacitor and the like mounted on an insulating substrate such as a ceramic substrate, and a method of manufacturing the same.

[0002]

2. Description of the Related Art In recent years, in electronic circuit devices in which a resistor, a capacitor, a semiconductor element, and the like are mounted on an insulating substrate, there is a strong demand for a higher density of mounting as devices become lighter and thinner.

Conventionally, in order to increase the component mounting density in this type of electronic circuit device, it has been realized by reducing the wiring pitch or by stacking a plurality of substrates on which semiconductor elements are mounted.

[0004]

However, in such a conventional electronic circuit device which realizes high density by miniaturizing the wiring pitch,
There is a limit in increasing the density, and it is not possible to sufficiently meet the demand for higher density simply by reducing the wiring pitch.

In the case of a structure in which a plurality of boards on which components are mounted are stacked, connection between the plurality of boards is made by lead pins. However, in order to ensure insulation between the boards, a space is provided between the boards. The arrangement is such that the boards are connected by a plurality of lead pins, so that the plurality of lead pins must be connected while being accurately positioned on the board, and the assembly work is extremely troublesome. Had become something. Moreover, in the case of this structure, there is a problem that it is difficult to connect the lead pins to a fine-pitch substrate in which the interval between the lead pins is narrow, and it is not possible to use the fine-pitch substrate.

An object of the present invention is to solve such a conventional problem and to provide a configuration capable of high-density mounting.

[0007]

According to the present invention, a plurality of terminals are provided on each frame portion of an annular insulating frame so that the terminals protrude outward in a U-shape. It has a first terminal portion disposed, a wiring pattern connected to each terminal of the first terminal portion, a surface mounting component mounted on one surface, and the surface mounting component side is the first terminal. With the first circuit board connected to face the inside of the
A second terminal part comprising a plurality of terminals arranged on each frame of the annular insulating frame so that the terminals protrude outward in an L-shape; A wiring pattern connected to each terminal of the second terminal portion, a surface mounting component mounted on one side, and the surface mounting component side connected to the inside of the second terminal portion.
A second circuit module with the first circuit module, the at least one first circuit module being stacked on the second circuit module with the second circuit module being the lowest part, and These are connected by terminals.

[0008]

According to this structure, the connection between the circuit boards mounted at a high density is performed through the terminals, and the terminals are formed by accurately arranging a plurality of terminals on the frame. Circuit boards mounted at high density can be easily connected.

[0009]

DESCRIPTION OF THE PREFERRED EMBODIMENTS An electronic circuit device according to an embodiment of the present invention will be described below with reference to FIGS.

(Embodiment 1) FIGS. 1 to 3 show an electronic circuit device according to a first embodiment of the present invention, and FIG. 4 shows a circuit module portion thereof. It is a square plate-shaped circuit module that constitutes a circuit,
In this embodiment, two circuit modules 1 and 2 are used.

Of the circuit modules 1 and 2, the circuit module 1 has a plurality of terminals 4 on each frame of a rectangular annular frame 3 made of an insulating material such as a synthetic resin. A terminal portion 5 configured by being disposed so as to protrude from the side surface of the frame body 3 along the lower surface to the outside of the frame portion along the lower surface, and connected to each terminal 4 of the terminal portion 5 by soldering or the like. And an insulating circuit board 7 made of ceramic or the like having a flip-chip type semiconductor element, a surface mounting component 6 such as a resistor or a capacitor mounted on one side. Reference numeral 7a denotes connection lands to which the terminals 4 are soldered. The connection lands are provided on the periphery of the circuit board 7 in accordance with the arrangement of the terminals 4.

In the circuit module 2, similarly to the circuit module 1, a plurality of terminals 8 are provided on each frame portion of the frame 3, and the terminals 8 are arranged outside the respective frame portions from the side surface of the frame 3 to the lower surface. A terminal portion 9 projecting in an L-shape along the terminal portion 9 so as to have a gull-wing terminal shape;
Alternatively, it is constituted by a circuit board 7 provided with another circuit. Note that the distal end of the terminal 4 of the terminal portion 9 is disposed so as to be flush with the lower surface of the frame 3.

Further, in the circuit modules 1 and 2, the circuit board 7 is connected to the terminal portions 5 and 9 such that the component surface mounting surface side faces the inside of the terminal portions 5 and 9;
The surface mounting component 6 of the mounted circuit board 7 has a thickness such that it does not protrude from the terminal portions 5 and 9.

These circuit modules 1 and 2 are shown in FIGS.
As shown in FIG. 7, the terminals 4, 5 of the terminal portions 5, 9 are provided.
8 are aligned to match and the circuit module 2
Are stacked on top of each other, and the terminals 4,
Numeral 8 is electrically and mechanically connected by soldering or the like at the contact portion. In FIGS. 5 to 7, reference numeral 10 denotes a connecting portion for connecting the terminal 4 and the terminal 8;
Reference numeral 1 denotes a connection portion that connects the terminals 4 and 8 to the connection land portions 7a of the wiring pattern of the circuit board 7.

At the uppermost part of the circuit modules 1 and 2 thus stacked, a rectangular plate-shaped top plate 12 made of metal or non-metal is arranged, thereby performing electromagnetic shielding of the circuit modules 1 and 2. ing. This top plate 1
2 has substantially the same area as the circuit modules 1 and 2, and has a square provided with a fixing hole 13 for fixing the top plate 12 to the frame 3 of the circuit module 1 by caulking. That is, projections 14 are provided at the corners of the frame 3 of the circuit modules 1 and 2, the fixing holes 13 of the top plate 12 are fitted into the projections 14, and as shown in FIG.
The top plate 12 is fixed to the frame 3 by crushing the top 4 and caulking the top 12 to the projections 14 of the frame 3. In FIG. 7, reference numeral 14a denotes a caulking portion provided by crushing the projection 14.

As shown in FIG. 8, an L-shaped shield connection terminal 12a is provided integrally with the top plate 12, and is connected to the grounding portion of the circuit module 1, as shown in FIG. The top plate 12 can be easily attached.

Next, the terminals 5, 5 of the circuit modules 1, 2
9 will be described in detail. Note that the terminal portion 5 and the terminal portion 9 are different only in the terminals 4 and 8 and the other configurations are the same. Therefore, in the following description, only the terminal portion 5 will be described.
This will be described with reference to FIGS.

As shown in FIGS. 9 to 12, in the frame 3 of the terminal portion 5, a plurality of projections 15 are provided at regular intervals on the outer edge of each of the four frames. Protrusion 15
The terminal 4 is drawn out to the outside through the gap. Also,
Each corner of the frame 3 is provided with a flat portion 16 which is lower than the projections 15 and 14. Further, four holes 17 reaching the terminals 4 are provided on the lower surface side of the frame 3 along the sides of the frame as shown in FIG.

Each terminal 4 of the terminal portion 5 is bent so that the front end protrudes outside the frame 3, and the rear end is embedded in the frame 3 as shown in FIG. , Projecting from the inner peripheral surface of the frame 3. Further, the intermediate portion of the terminal 4 is provided so as to be flat along the upper surface of the frame 3 as shown in FIGS. 13 to 15 and is arranged so as to slightly protrude from the upper surface of the frame 3. I have. In FIGS. 13 to 15, reference numeral 18 denotes a protrusion protruding from the inner peripheral surface of the frame 3 of the terminal 4, and reference numeral 19 denotes a flat portion provided at an intermediate portion of the terminal 4.

In the flat portion 19 of the terminal 4, the boundary between the flat portion 19 and the rear end portion embedded in the frame 3 is formed by a resin portion 20.
Covered by

That is, each terminal 4 of the terminal portion 5 is connected to the circuit board 7 at a flat portion 19 protruding from the upper surface of the frame 3 as shown in FIG.

In the present invention, the circuit board 7 can be positioned on the frame 3 by controlling the position by contacting the outer ends of the respective sides of the circuit board 7 with the projections 15 of the frame 3, The connection between the terminal portion 5 and the circuit board 7 can be easily and accurately performed. In this case, as shown in FIG. 16, a small projection 15a is provided on a surface of some of the projections 15 where the circuit board 7 contacts, and the small projection 15a May be performed. With such a configuration, the positioning accuracy can be further improved as compared with the case where the positioning is performed by the protrusions 15.

Further, as shown in FIG. 12, by providing a tapered portion 15b on the projecting portion 15 so as to gradually taper upward, the terminals 4, 8 of the terminal portions 5, 9 can be accurately matched with each other. In addition, electrical and mechanical connections such as soldering at the contact portions of the terminals 4 and 8 can be reliably performed.

Further, in the present invention, the projections 14 are provided at the corners of the frame 3 of the terminal portion 5, so that the circuit module 1 and the
When 2 are stacked in multiple layers, the positioning and support between the circuit modules can be easily performed by the protrusions 14.

In the present invention, as shown in FIG. 17, a part of the flat portion 19 of the terminal 4 is buried in the projection 15, and the buried portion 19a allows the flat portion 1 of the terminal 4 to be buried.
9, and the flatness of the flat portion 19 is ensured. In the example shown in FIG. 17, both sides of the flat portion 19 of the terminal 4 are embedded in the protrusion 15.
As shown in FIG. 18, only one side of the flat portion 19 is
It may be embedded inside.

Here, a method of manufacturing the terminal portion 5 is shown in FIG.
In the present invention, when the frame 3 is molded, the terminals 4 are integrally embedded by insert molding. In FIG. 19, reference numeral 21 denotes a terminal frame, and the terminal frame 21 has a shape in which both ends of a plurality of terminals 4 are connected to connecting portions 21a and 21b. That is, as shown in FIG. 19A, the molding of the frame 3 is performed in a state where the four terminal frames 21 are arranged so that the connecting portions 21a of the terminal frames 21 protrude from the inner peripheral surface of the frame 3. As a result, the terminal portion 5 in which the terminal frame 21 is insert-molded in the frame 3 is obtained. After that, terminal frame 2
The terminal portion 5 as shown in FIG. 9 is obtained by cutting the connecting portions 21a and 21b and bending the outwardly protruding portion into a U-shape.

At this time, in the present invention, the rear end of the terminal 4 protrudes from the inner peripheral surface of the frame 3.

By using the terminal frame 21 as described above, the terminal 4 can be accurately fixed at the time of insert molding. Further, although holes 17 are provided on the back surface of the frame 3, the terminals 4 are held during insert molding and are insert-molded, so that the alignment accuracy of the terminals 4 can be sufficiently ensured.

(Embodiment 2) FIG. 20 shows a second embodiment of the present invention. In this embodiment, the circuit module is composed of nine circuit modules 1 and one circuit module 2.
This is a hierarchical electronic circuit device. The configuration of the circuit modules 1 and 2 is the same as that of the first embodiment.

(Embodiment 3) FIG. 21 shows a third embodiment of the present invention. In this embodiment, an electronic circuit device is constituted by only one circuit module 2.
In FIG. 21, reference numeral 22 denotes a printed wiring board. As shown in FIG. 21, the electronic circuit device of the present invention is mounted on the printed wiring board 22 by soldering or the like, and is connected to another electronic circuit.

(Embodiment 4) FIGS. 22 to 24 show an electronic circuit device according to a fourth embodiment of the present invention, and FIG. 25 shows a circuit module portion thereof.
Is a square plate-shaped circuit module constituting a predetermined electronic circuit. In this embodiment, two circuit modules 23 and 2 are provided.
4 is used.

Of the circuit modules 23 and 24, the circuit module 23 has a plurality of terminals 26 on each frame of a rectangular annular frame 25 made of an insulating material such as synthetic resin.
Are arranged so that the terminals 26 protrude from the side surfaces of the frame body 25 in a U-shape along the lower surface outside the frame portions, and the terminal 2 of the terminal portion 27 is formed.
6 and an insulating circuit board 29 made of ceramic or the like having a wiring pattern connected by soldering or the like, and a surface mounting component 28 such as a flip-chip type semiconductor element, a resistor, or a capacitor mounted on one side. It is configured. Reference numeral 29a denotes connection lands to which the terminals 26 are soldered. The connection lands are provided on the periphery of the circuit board 29 in accordance with the arrangement of the terminals 26.

Similarly to the circuit module 23, the circuit module 24 includes a plurality of terminals 3 on each frame of the frame 25.
A terminal portion 31 in which the terminal 30 is disposed outside the respective frame portions in an L-shape from the side surface of the frame body 25 along the lower surface to form a gull-wing terminal shape; Circuit board 29 provided with the same circuit or another circuit
It is composed of

Further, in the circuit boards 23 and 24, the circuit board 29 has the terminal portions 27 and 31 on the component surface mounting surface side.
The terminal portions 27 and 31 are connected to the terminal portions 27 and 31 so as to face inward. The terminal portions 27 and 31 have a thickness such that the surface mounting component 28 of the mounted circuit board 29 does not protrude from the terminal portions 27 and 31. I have.

As shown in FIGS. 26 to 28, these circuit modules 23 and 24 have respective terminals 27 and 3 respectively.
The terminals 26, 30 of one circuit module 23, 24 are stacked so that the terminals 26, 30 of one circuit module are aligned and the circuit modules 23 are stacked on top of the circuit module 24, and the terminals 26, 30 of the respective circuit modules 23, 24 Are electrically and mechanically connected by soldering or the like. 26 to 28, reference numeral 32 denotes a connecting portion for connecting the terminal 26 and the terminal 30, and 33 denotes the terminal 2
This is a connection portion for connecting the connection lands 29a of the wiring patterns of the circuit board 29 with the connection lands 6, 30.

A rectangular plate-shaped heat sink 34 made of metal is disposed above the circuit modules 23 and 24 stacked in this manner via silicon grease or the like, thereby dissipating heat from the circuit modules 23 and 24. Is going. The heat radiating plate 34 is larger than the circuit modules 23 and 24, and when the electronic circuit device is mounted, the terminals 26, 30
In order to recognize the image, a window 35 is provided on the upper part of the terminal part 27, 31 so as to match with the terminal part 27, and further, a heat sink 34 is fixed to the frame 25 of the circuit module 23, 24 by caulking at the corner part. A fixing hole 36 is provided. That is, the projections 37 are provided at the corners of the frame 25 of the circuit modules 23 and 24, the fixing holes 36 of the radiator plate 34 are fitted into the projections 37, and the projections 37 are formed as shown in FIG. The heat radiating plate 34 is fixed to the frame 25 by crushing and crimping the heat radiating plate 34 to the protrusion 37 of the frame 25. In FIG. 28, reference numeral 37a denotes a caulking portion provided by crushing the projection 37. In particular, when the surface mount component 28 that requires heat radiation characteristics is mounted, a convex portion 34a is provided on the heat sink 34 as shown in FIG. 29, and the heat sink 34 and the surface mount component 28 are directly connected via silicon grease or the like. The contact may be made to increase the heat radiation effect. At this time, the lowermost radiator plate 34 is held by the peripheral portion 34b of the radiator plate 34 disposed on the circuit module 24, which is folded back into an L-shape. Also, as shown in FIGS.
A comb-shaped heat sink 38 may be interposed between the heat sinks to increase the heat radiation effect. With this configuration, heat can be more reliably dissipated than when heat is dissipated by bringing the heat dissipating plate 34 into direct contact with the substrate.

If a connecting terminal for shielding is provided on the heat radiating plate 34 of the present embodiment, the same electromagnetic shielding effect as the top plate 12 described in the first embodiment can be obtained.

Next, the terminals 27 and 31 of the circuit modules 23 and 24 will be described in detail. The terminal 2
7 differs from the terminal portion 31 only in the terminals 26 and 30.
Since other configurations are the same, in the following description, only the terminal portion 27 will be described with reference to FIGS.

As shown in FIGS.
In the frame body 25, a protrusion 39 for regulating the position of the outer end is provided at the outer edge of the upper part of each of the four frame portions, and a plurality of grooves are provided outside the protrusion 39 at predetermined intervals. The terminal 26 is drawn out through the groove 40. According to such a configuration, the first circuit module and the second circuit module can be connected to each other without lowering the strength of the frame than when a plurality of protrusions are provided at regular intervals on the outer peripheral portion of each of the four frame portions. Circuit modules can be stacked. At each corner of the frame 25, a flat portion 41 which is lower than the projection 39 and the projection 37 is provided.

Each terminal 26 of the terminal portion 27 is bent so that the front end protrudes outside the frame 25, and the rear end is embedded in the frame 25 as shown in FIG. , Protrude from the inner peripheral surface of the frame 25.
Further, the intermediate portion of the terminal 26 is provided so as to be flat along the upper surface of the frame 25 as shown in FIGS. 33 to 35 and is arranged so as to slightly protrude from the upper surface of the frame 25. I have. 33 to 35, reference numeral 42 denotes a protruding portion protruding from the inner peripheral surface of the frame 25 of the terminal 26, and reference numeral 43 denotes a flat portion provided at an intermediate portion of the terminal 26.

In the flat portion 43 of the terminal 26, the boundary between the flat portion 43 and the rear end portion embedded in the frame 25 is covered with a resin portion 44.

That is, each terminal 26 of the terminal portion 27 is connected to the circuit board 29 at a flat portion 43 protruding from the upper surface of the frame 25 as shown in FIG.

In the present invention, the protrusion 39 of the frame 25 is provided.
The outer surface of each side of the circuit board 29 is brought into contact with each other to regulate the position, so that the circuit board 29 can be positioned on the frame 25, and the connection between the terminal portion 27 and the circuit board 29 can be easily and accurately performed. It can be carried out. At this time, as shown in FIG. 35, the four corners of the projection 39 are cut away so as not to come into contact with the substrate and escaped to prevent interference with the burr of the substrate, thereby enabling more accurate connection.

In the present invention, as shown in FIG. 36, a part of the flat portion 43 of the terminal 26 is embedded in the projection 39, and the embedded portion 43a fixes the flat portion 43 of the terminal 26. In addition, the flatness of the flat portion 43 is ensured.

[0045]

As described above, according to the present invention, a terminal portion in which a plurality of terminals are arranged on each frame portion of an annular insulating frame so that the terminals protrude outward, A circuit module having a wiring pattern connected to each terminal of the unit and a circuit board having a surface mounting component mounted on one side and connected so that the surface mounting component side faces the inside of the terminal portion, By stacking a plurality of the above-described circuit modules and connecting the circuit modules with terminals, the circuit boards having high-density mounting can be easily and accurately connected to the terminal portions by the terminals, whereby the circuit modules can be arranged in multiple layers. Because it can be arranged easily and accurately,
Higher density mounting can be realized.

[Brief description of the drawings]

FIG. 1 is an exploded perspective view showing an electronic circuit device according to a first embodiment of the present invention.

FIG. 2 is a perspective view showing an appearance of the apparatus.

FIGS. 3 (a) and 3 (b) are a plan view and a side view showing the device with a part cut away.

FIG. 4 is an exploded perspective view of a main part of the apparatus.

FIG. 5 is an enlarged view showing a main part structure of the apparatus.

FIG. 6 is an enlarged sectional view showing the structure of a main part of the apparatus.

FIG. 7 is an enlarged view showing a main structure of the apparatus.

FIG. 8 is a perspective view showing another example of a main part of the apparatus.

FIG. 9 is a perspective view showing a terminal portion of the device.

FIG. 10 is a plan view of the terminal portion as viewed from above.

FIG. 11 is a plan view seen from the back surface of the terminal unit.

12A and 12B are a side view and a cross-sectional view of the terminal portion.

FIG. 13 is an enlarged view showing a main part of the terminal part.

FIG. 14 is an enlarged sectional view of the same.

FIG. 15 is an enlarged perspective view showing a main part of the terminal part.

FIG. 16 is an enlarged perspective view showing another example of the terminal section.

FIG. 17 is an enlarged view showing a main part of the terminal part.

FIG. 18 is an enlarged view showing another example of the terminal section.

19 (a) and (b) are a plan view and a side view showing a state at the time of insert molding when manufacturing the terminal portion.

FIG. 20 is a perspective view showing an electronic circuit device according to a second embodiment of the present invention.

FIG. 21 is a perspective view showing an electronic circuit device according to a third embodiment of the present invention.

FIG. 22 is an exploded perspective view showing an electronic circuit device according to a fourth embodiment of the present invention.

FIG. 23 is a perspective view showing the appearance of the apparatus.

24 (a) and (b) are a plan view and a side view showing the device with a part cut away.

FIG. 25 is an exploded perspective view of a main part of the device.

FIG. 26 is an enlarged view showing a main structure of the apparatus.

FIG. 27 is an enlarged sectional view showing the structure of a main part of the device.

FIG. 28 is an enlarged cross-sectional view showing a main part structure of the device.

FIG. 29 is an enlarged sectional view of a main structure of the same device.

FIG. 30 is a perspective view showing another example of the main parts of the apparatus.

FIG. 31 is an enlarged sectional view showing another example of a main part of the apparatus.

FIG. 32 is a perspective view showing a terminal portion of the device.

FIG. 33 is an enlarged sectional view showing a main part of the terminal part.

FIG. 34 is an enlarged perspective view showing a main part of the terminal part.

FIG. 35 is an enlarged view showing a main part of the terminal part.

FIG. 36 is an enlarged view showing a main part of the terminal part.

[Explanation of symbols]

 1, 2, 23, 24 Circuit module 3, 25 Frame 4, 8, 26, 30 Terminal 5, 9, 27, 31 Terminal 6, 28 Surface mounting component 7, 29 Circuit board 7a, 29a Connection land 10 , 11, 32, 33 Connecting part 12 Top plate 12a Connecting terminal 13 Fixing hole 16 Flat part 17 Hole 18 Projecting part 34 Heat sink 36 Fixing hole 37 Projection 37a Caulking part 39 Projecting part 40 Groove 41 Flat part 43 Flat part 43a Buried part

Continuation of the front page (56) References JP-A-6-132476 (JP, A) JP-A-8-34278 (JP, B2) STACKABLE “J” LEAD ED CHIP CARRIER, IBM Technical Disclosure Bulletin, March 1986 Month, Vol. 28, No. 12, pp. 5174-5175 (58) Fields investigated (Int. Cl. ⁷ , DB name) H01L 25/065 H01L 25/10

Claims (17)

(57) [Claims] A first terminal portion having a plurality of terminals arranged on each frame portion of an annular insulating frame so that the terminals protrude outward in a U-shape; and a first terminal portion. And a first circuit board having a wiring pattern connected to each terminal of the unit and having a surface mounting component mounted on one surface and connected such that the surface mounting component side faces the inside of the first terminal portion. A second terminal part which constitutes the first circuit module, and has a plurality of terminals arranged on each frame of the annular insulating frame so that the terminals protrude outward in an L-shape; A second wiring pattern having a wiring pattern connected to each terminal of the second terminal portion, a surface-mounting component mounted on one surface, and connection such that the surface-mounting component side faces the inside of the second terminal portion; A second circuit module comprising the second circuit module and the second circuit module. An electronic circuit device in which at least one first circuit module is stacked on the second circuit module with the lowermost part as a lowermost part, and the respective circuit modules are connected by terminals. 2. The electronic circuit device according to claim 1, wherein a top plate for electromagnetic shielding is provided on the uppermost first circuit module. 3. The electronic circuit device according to claim 1, wherein a radiator plate for radiating heat is in contact with a circuit board of each circuit module. 4. The electronic circuit device according to claim 3, wherein connection terminals for electromagnetic shielding are provided on the heat sink. 5. The electronic circuit device according to claim 3, wherein a window is provided on the heat sink at a position corresponding to the terminals of the first and second terminal portions. 6. The electronic circuit device according to claim 3, wherein a convex portion is provided on the heat radiating plate such that the heat radiating plate and the surface mount component come into direct contact with each other. 7. The first circuit module and the second circuit module, wherein projections are provided at the corners of the frame, and the projections support the circuit modules.
An electronic circuit device according to claim 1. 8. In the first terminal portion and the second terminal portion, a plurality of protrusions for regulating the position of the outer end of the circuit board are provided at predetermined intervals on the peripheral edge of the upper surface of each frame. 2. The electronic circuit device according to claim 1, wherein a plurality of terminals are provided outside through the protrusions. 9. In the first terminal portion and the second terminal portion, a projection is provided on the outer edge of the upper surface of each frame, and a plurality of grooves are formed outside the projection at predetermined intervals. 4. The electronic circuit device according to claim 3, wherein a plurality of terminals are provided to the outside through the grooves. 10. The method of claim 8 also provided with tapered at protruding portion provided in the first terminal and the second terminal portion
An electronic circuit device according to claim 9 . 11. In the first terminal portion and the second terminal portion, four corners of the protrusion for regulating the position of the circuit board are cut off so as not to contact the circuit board.
An electronic circuit device according to claim 1. 12. The electronic circuit device according to claim 1, wherein the first terminal portion and the second terminal portion are provided by insert-molding the terminal to the frame. 13. In the first terminal portion and the second terminal portion, the rear end side of the terminal is embedded in the frame, the rear end protrudes from the inner peripheral surface of the frame, and the first terminal portion and the second terminal portion are connected to the intermediate portion of the terminal. 5. The electronic circuit device according to claim 4, wherein the provided flat portion is exposed on an upper surface of the frame and is drawn out through the space between the protrusions. 14. The electronic circuit device according to claim 4, wherein a part of a portion between the protrusions of the terminal is embedded in the protrusion. 15. The electronic circuit device according to claim 4, wherein a small protrusion is provided on a surface of the protrusion of the frame body, the surface being in contact with an outer end of the circuit board. 16. The first terminal portion and the second terminal portion, wherein a hole reaching the terminal is provided on the lower surface side of the frame.
An electronic circuit device according to claim 1. 17. A terminal frame in which both ends of a plurality of terminals are connected by a connecting portion, and the terminal frame is insert-molded into the frame such that the connecting portion at one end protrudes from the inner peripheral surface of the frame. 2. The method for manufacturing an electronic circuit device according to claim 1, wherein the connecting portion is cut.