JPH0661415A - Electronic circuit device and its manufacture - Google Patents

Abstract

PURPOSE:To increase the packaging density of an electronic circuit device in which semiconductor elements, resistors, capacitors, etc., are mounted on insulating substrates composed of ceramic substrates, etc. CONSTITUTION:Circuit modules 1 and 2 are constituted of terminal sections 5 and 9 in which pluralities of terminals 4 and 8 are arranged in each frame section of annular insulating frame bodies 3 so that the terminals 4 and 8 can be protruded outward from the frame sections and circuit boards 7 on which wiring patterns respectively connected to the terminals 4 and 8 of the sections 5 and 9 are formed and surface mounting parts 6 are mounted on one surface and which are connected so that the surfaces mounted with the parts 6 can be faced to the terminal sections 5 and 9. In addition, the module 1 is put on the other module 2 in such a state that the modules 1 and 2 are connected to each other by means of the terminals 4 and 8. Therefore, the packaging density of this electronic circuit device can be easily increased.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic circuit device having a semiconductor element, a resistor, a capacitor and the like mounted on an insulating substrate such as a ceramic substrate and a method for manufacturing the same.

[0002]

2. Description of the Related Art Recently, in electronic circuit devices in which resistors, capacitors, semiconductor elements, etc. are mounted on an insulating substrate, there has been a strong demand for higher packaging density as the equipment becomes lighter, thinner and shorter.

Conventionally, in order to increase the density of parts mounted in this kind of electronic circuit device, it has been realized by making the wiring pitch fine or by stacking a plurality of substrates on which semiconductor elements are mounted.

[0004]

However, regarding such a conventional electronic circuit device which realizes high density by miniaturizing the wiring pitch,
There is a limit to the high density, and it has not been possible to sufficiently meet the demand for higher density simply by reducing the wiring pitch.

Also, in the case of a structure in which a plurality of boards on which components are mounted are stacked, the plurality of boards are connected by lead pins, but a space is provided between the boards in order to ensure insulation between the boards. Since it was configured to be connected and these boards are connected by multiple lead pins, it is necessary to accurately align and connect the multiple lead pins to the board, and the assembly work is extremely troublesome. It was a thing. Moreover, in the case of this structure, there is a problem in that it is difficult to connect the lead pins to a substrate having a fine pitch in which the distance between the lead pins is narrow, and the substrate cannot be used for a substrate having a fine pitch.

The present invention solves such conventional problems, and an object thereof is to provide a structure capable of high-density mounting.

[0007]

In order to solve this problem, according to the present invention, a plurality of terminals are provided in each frame portion of an annular insulating frame body so that the terminals project outward in a U-shape. The first terminal has an arranged first terminal portion and a wiring pattern connected to each terminal of the first terminal portion, and a surface mounting component is mounted on one surface of the first terminal. The first circuit board and the first circuit board connected to face the inside
And a second terminal portion in which a plurality of terminals are arranged in each frame portion of an annular insulating frame body so that the terminals project outward in an L shape, and A second wiring part having a wiring pattern connected to each terminal of the second terminal part and having a surface mounting component mounted on one surface thereof, and the surface mounting component side being connected to the inside of the second terminal part;
A second circuit module with the circuit board, and at least one first circuit module is stacked on the second circuit module with the second circuit module as the lowermost part, and between the circuit modules. It is connected by terminals.

[0008]

With this configuration, the connection between the circuit boards mounted in high density is made through the terminal portion, and moreover, the terminal portion is formed by accurately disposing a plurality of terminals in the frame body. Circuit boards mounted in high density can be easily connected.

[0009]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An electronic circuit device according to an embodiment of the present invention will be described below with reference to the drawings of FIGS.

(Embodiment 1) FIGS. 1 to 3 show an electronic circuit device according to a first embodiment of the present invention, and FIG. 4 shows a circuit module portion thereof. In FIG. It is a square plate shaped circuit module that constitutes a circuit,
In this embodiment, two circuit modules 1 and 2 are used.

Of the circuit modules 1 and 2, the circuit module 1 has a plurality of terminals 4 in each frame portion of a rectangular and annular frame body 3 made of an insulating material such as synthetic resin. A terminal portion 5 formed by arranging the side surface of the frame body 3 so as to project in a U-shape along the lower surface outside the frame portion, and each terminal 4 of the terminal portion 5 are connected to each other by soldering or the like. And an insulative circuit board 7 made of ceramic or the like having a surface mounting component 6 such as a flip-chip type semiconductor element, a resistor or a capacitor mounted on one side. Reference numeral 7a denotes a connection land portion to which each terminal 4 is soldered, and is provided on the peripheral portion of the circuit board 7 in accordance with the arrangement of the terminals 4.

In the circuit module 2, as in the circuit module 1, a plurality of terminals 8 are provided in each frame portion of the frame body 3, and the terminals 8 are provided outside the respective frame portions from the side surface to the lower surface of the frame body 3. A terminal portion 9 which is arranged so as to project in an L-shape along the above so as to have a gull-wing terminal shape, and the same circuit as the circuit board 7.
Alternatively, the circuit board 7 is provided with another circuit. The tip of the terminal 4 of the terminal portion 9 is arranged so as to be flush with the lower surface of the frame body 3.

Further, in the circuit modules 1 and 2, the circuit board 7 is connected to the terminal portions 5 and 9 so that the component surface mounting surface side faces the inside of the terminal portions 5 and 9, and the terminal portions 5 and 9 are
The surface mounting component 6 of the mounted circuit board 7 has such a thickness that it does not protrude from the terminal portions 5 and 9.

These circuit modules 1 and 2 are shown in FIGS.
As shown in FIG. 7, the terminals 4 of the respective terminal portions 5 and 9 are
8 aligned and circuit module 2
The circuit modules 1 are stacked on top of each other, and the terminals 4 of the respective circuit modules 1 and 4 are
8 is electrically and mechanically connected at its abutting portion by soldering or the like. 5 to 7, 10 is a connecting portion for connecting the terminals 4 and 8 to each other,
Reference numeral 1 is a connection portion that connects the terminals 4 and 8 to the connection land portion 7a of the wiring pattern of the circuit board 7.

A square plate-shaped top plate 12 made of metal or non-metal is arranged at the uppermost part of the circuit modules 1 and 2 thus stacked, and thereby the circuit modules 1 and 2 are electromagnetically shielded. ing. This top plate 1
Reference numeral 2 has substantially the same area as that of the circuit modules 1 and 2, and a square is provided with a fixing hole 13 for fixing the top plate 12 to the frame body 3 of the circuit module 1 by caulking. That is, the projections 14 are provided at the corners of the frame bodies 3 of the circuit modules 1 and 2, and the fixing holes 13 of the top plate 12 are fitted into the projections 14, and the projections 1 are formed as shown in FIG.
The top plate 12 is fixed to the frame body 3 by crushing 4 and crimping the top plate 12 to the protrusions 14 of the frame body 3. In FIG. 7, 14a is a caulking portion provided by crushing the protrusion 14.

As shown in FIG. 8, an L-shaped shield connecting terminal 12a is integrally provided as the top plate 12 so as to be connected to the ground portion of the circuit module 1 for electromagnetic shielding. The top plate 12 can be easily attached.

Next, the terminal portions 5 of the circuit modules 1 and 2
9 will be described in detail. Since the terminals 5 and 9 are different only in the terminals 4 and 8 and the other configurations are the same, only the terminal 5 will be described in the following description.
This will be described with reference to FIGS. 9 to 19.

As shown in FIGS. 9 to 12, in the frame body 3 of the terminal portion 5, a plurality of protrusions 15 are provided at the outer edge of each of the four frame portions at regular intervals. Protrusion 15
The terminal 4 is pulled out through the space. Also,
A flat portion 16 lower than the protrusion 15 and the protrusion 14 is provided at each corner of the frame body 3. Further, on the lower surface side of the frame body 3, as shown in FIG. 11, four holes 17 reaching the terminals 4 are provided along the sides of the frame portion.

Further, each terminal 4 of the terminal portion 5 is bent so that the tip end portion thereof is projected to the outside from the frame body 3, and the rear end portion side is embedded in the frame body 3 as shown in FIG. , Protrudes from the inner peripheral surface of the frame body 3. Further, the intermediate portion of the terminal 4 is provided so as to be flat along the upper surface of the frame body 3 as shown in FIGS. 13 to 15, and is arranged so as to slightly project from the upper surface of the frame body 3. There is. In FIGS. 13 to 15, reference numeral 18 denotes a projecting portion projecting on the inner peripheral surface of the frame body 3 of the terminal 4, and 19 denotes a flat portion provided at the intermediate portion of the terminal 4.

Further, in the flat portion 19 of the terminal 4, the boundary portion with the rear end portion embedded in the frame body 3 has a resin portion 20.
Is covered by.

That is, each terminal 4 of the terminal portion 5 is connected to the circuit board 7 at the flat portion 19 projecting from the upper surface of the frame 3 as shown in FIG.

In the present invention, the circuit board 7 can be positioned on the frame body 3 by bringing the outer ends of the respective sides of the circuit board 7 into contact with the protrusions 15 of the frame body 3 to regulate the position of the circuit board 7. The connection between the terminal portion 5 and the circuit board 7 can be accurately and easily performed. In this case, as shown in FIG. 16, a small protrusion 15a is provided on the surface of a part of the plurality of protrusions 15 with which the circuit board 7 abuts. May be positioned. With such a configuration, the positioning accuracy can be further improved as compared with the case where the protrusion 15 is used for positioning.

Further, as shown in FIG. 12, by providing the protrusion 15 with a taper 15b which gradually becomes thinner toward the upper side, the terminals 4 and 8 of the terminal portions 5 and 9 can be accurately matched, Moreover, electrical and mechanical connection such as soldering can be surely performed at the contact portions of the terminals 4 and 8.

Further, in the present invention, the projections 14 are provided at the corners of the frame body 3 of the terminal portion 5, and the circuit module 1,
When the two are stacked in multiple hierarchies, positioning and support between the circuit modules can be easily performed also by the projections 14 thereof.

Further, in the present invention, as shown in FIG. 17, a part of the flat portion 19 of the terminal 4 is embedded in the protrusion 15, and the flat portion 1 of the terminal 4 is formed by this embedded portion 19a.
9 is fixed, and the flatness of the flat portion 19 is ensured. In addition, in the example shown in FIG. 17, both sides of the flat portion 19 of the terminal 4 are embedded in the protrusion portion 15.
As shown in FIG. 18, only one side of the flat portion 19 is provided with the protrusion 15
It may be embedded inside.

Here, the manufacturing method of the terminal portion 5 will be described with reference to FIG.
In the present invention, when the frame 3 is molded, the terminals 4 are integrally embedded by insert molding. In FIG. 19, 21 is a terminal frame, and this terminal frame 21 has a shape in which both ends of a plurality of terminals 4 are joined to the connecting portions 21a and 21b. That is, as shown in FIG. 19A, the frame body 3 is molded with four terminal frames 21 arranged so that the connecting portions 21 a of the terminal frames 21 project from the inner peripheral surface of the frame body 3. By doing so, the terminal portion 5 in which the terminal frame 21 is insert-molded in the frame body 3 is obtained. After that, the terminal frame 2
9 is obtained by cutting the connecting portions 21a and 21b of No. 1 and bending the portion projecting outward in a U-shape.

At this time, in the present invention, the rear end portion side of the terminal 4 projects to the inner peripheral surface of the frame body 3.

By using the terminal frame 21 in this way, the terminal 4 can be fixed with high precision during insert molding. Further, the hole 17 is provided on the back surface of the frame body 3. By this, since the terminal 4 is held during insert molding and the insert molding is performed, it is possible to sufficiently secure the alignment accuracy of the terminal 4.

(Embodiment 2) FIG. 20 shows a second embodiment of the present invention. In this embodiment, nine circuit modules 1 and one circuit module 2 are used and 10
This is a hierarchical electronic circuit device. The configurations of the circuit modules 1 and 2 are the same as those in the first embodiment.

(Embodiment 3) FIG. 21 shows a third embodiment of the present invention. In this embodiment, an electronic circuit device is composed of only one circuit module 2.
In FIG. 21, reference numeral 22 denotes a printed wiring board. As shown in FIG. 21, the electronic circuit device of the present invention is mounted on the printed wiring board 22 by soldering or the like, and is connected to another electronic circuit.

(Embodiment 4) FIGS. 22 to 24 show an electronic circuit device according to a fourth embodiment of the present invention, and FIG. 25 shows the circuit module portion thereof.
Is a rectangular plate-shaped circuit module that constitutes a predetermined electronic circuit. In this embodiment, two circuit modules 23 and 2 are provided.
4 is used.

Of the circuit modules 23 and 24, the circuit module 23 includes a plurality of terminals 26 in each frame portion of a rectangular and annular frame body 25 made of an insulating material such as synthetic resin.
A terminal portion 27 formed by arranging the terminal 26 outside the respective frame portions so as to project in a U-shape from the side surface of the frame body 25 along the lower surface, and each terminal 2 of the terminal portion 27.
6 and an insulative circuit board 29 made of ceramic or the like having wiring patterns respectively connected by soldering or the like and having a surface mounting component 28 such as a flip-chip type semiconductor element, a resistor or a capacitor mounted on one surface. It is configured. Reference numeral 29a denotes a connection land portion to which each terminal 26 is soldered, and is provided on the peripheral portion of the circuit board 29 in accordance with the arrangement of the terminals 26.

The circuit module 24, like the circuit module 23, has a plurality of terminals 3 in each frame portion of the frame body 25.
0 is arranged so that the terminal 30 protrudes in an L-shape from the side surface of the frame body 25 to the outside of each frame portion along the lower surface to form a gull-wing type terminal, and the circuit board 29. Circuit board 29 provided with the same circuit or another circuit
It is composed of and.

Further, in the circuit modules 23 and 24, the circuit board 29 has terminals 27 and 31 on the component surface mounting surface side.
It is connected to the terminal portions 27, 31 so as to face inward, and the terminal portions 27, 31 have a thickness such that the surface mounting component 28 of the mounted circuit board 29 does not protrude from the terminal portions 27, 31. There is.

As shown in FIGS. 26 to 28, these circuit modules 23 and 24 have respective terminal portions 27 and 3 respectively.
One terminal 26, 30 is aligned and mated and the circuit module 23 is stacked on top of the circuit module 24, and the terminals 26, 30 of each circuit module 23, 24 have their abutting portions. At, they are electrically and mechanically connected by soldering or the like. 26 to 28, 32 is a connecting portion for connecting the terminals 26 and 30 and 33 is the terminal 2
6, 30 and the connection land portion 29a of the wiring pattern of the circuit board 29.

On the upper part of the circuit modules 23 and 24 thus stacked, a heat dissipation plate 34 made of metal and having a rectangular plate shape is disposed via silicon grease or the like, whereby the heat dissipation of the circuit modules 23 and 24 is performed. Is going. The heat sink 34 is larger than the circuit modules 23 and 24, and when the electronic circuit device is mounted, the terminals 26 and 30 are mounted.
A window 35 is provided on the upper portions of the terminal portions 27 and 31 so as to match with the image recognition portion, and the heat radiation plate 34 is fixed to the frame 25 of the circuit modules 23 and 24 by caulking at the corner portions. A fixing hole 36 is provided. That is, the projections 37 are provided at the corners of the frame 25 of the circuit modules 23 and 24, and the fixing holes 36 of the heat dissipation plate 34 are fitted into the projections 37, and the projections 37 are formed as shown in FIG. The heat dissipation plate 34 is fixed to the frame body 25 by crushing and caulking the heat dissipation plate 34 on the protrusions 37 of the frame body 25. In FIG. 28, 37a is a caulking portion provided by crushing the protrusion 37. When the surface mount component 28 that requires heat dissipation characteristics is mounted in particular, the heat sink 34 is provided with the convex portion 34a as shown in FIG. 29, and the heat sink 34 and the surface mount component 28 are directly connected via silicon grease or the like. You may make it contact and may improve a heat dissipation effect. At this time, the lowermost heat dissipation plate 34 is held by the peripheral portion 34b of the heat dissipation plate 34 arranged on the circuit module 24, which is folded back into an L shape. Further, as shown in FIGS.
A heat sink 38 having a comb shape may be disposed between them to enhance the heat dissipation effect. According to this structure, heat can be radiated more reliably as compared with the case of radiating heat by directly contacting the heat radiating plate 34 and the substrate.

If the heat dissipation plate 34 of this embodiment is provided with a connection terminal for shielding, the same electromagnetic shielding effect as that of the top plate 12 of the first embodiment can be obtained.

Next, the terminal portions 27 and 31 of the circuit modules 23 and 24 will be described in detail. The terminal portion 2
7 and the terminal portion 31 are different only in the terminals 26 and 30,
Since other configurations are the same, only the terminal portion 27 will be described below with reference to FIGS. 32 to 36.

As shown in FIGS. 32 to 36, the terminal portion 27
In the frame body 25 of FIG. 5, a protrusion 39 for restricting the position of the outer end is provided on the outer edge of the upper portion of each of the four frame portions, and a plurality of grooves are provided outside the protrusion 39 at a predetermined interval. 40 is provided, and the terminal 26 is drawn out through the groove 40. With such a configuration, it is possible to reduce the strength of the frame body and the first circuit module and the second circuit module without lowering the strength of the frame body as compared with the case where a plurality of projecting portions are provided at regular intervals on the outer peripheral portions of the four frame portions. The circuit modules can be stacked. A flat portion 41, which is lower than the protrusion 39 and the protrusion 37, is provided at each corner of the frame 25.

Further, each terminal 26 of the terminal portion 27 is bent so that the tip end portion thereof is projected to the outside of the frame body 25, and the rear end portion side is embedded in the frame body 25 as shown in FIG. , Projects from the inner peripheral surface of the frame body 25.
Further, the intermediate portion of the terminal 26 is provided so as to be flat along the upper surface of the frame body 25 as shown in FIGS. 33 to 35, and is arranged so as to slightly project from the upper surface of the frame body 25. There is. 33 to 35, reference numeral 42 is a protruding portion that protrudes from the inner peripheral surface of the frame body 25 of the terminal 26, and 43 is a flat portion provided in the intermediate portion of the terminal 26.

Further, in the flat portion 43 of the terminal 26, the boundary portion with the rear end portion embedded in the frame body 25 is covered with the resin portion 44.

That is, in each terminal 26 of the terminal portion 27, as shown in FIG. 33, the flat portion 43 protruding from the upper surface of the frame 25 is connected to the circuit board 29.

In the present invention, the protruding portion 39 of the frame body 25
The circuit board 29 can be positioned on the frame body 25 by bringing the outer ends of the respective sides of the circuit board 29 into contact with each other to regulate the position, and the connection between the terminal portion 27 and the circuit board 29 can be carried out accurately and easily. It can be carried out. At this time, as shown in FIG. 35, the four corners of the protrusion 39 are cut out so as not to contact the substrate and run away, so that interference with the burr of the substrate can be prevented and connection can be made more accurately.

Further, in the present invention, as shown in FIG. 36, a part of the flat portion 43 of the terminal 26 is embedded in the projection 39, and the embedded portion 43a fixes the flat portion 43 of the terminal 26. At the same time, the flatness of the flat portion 43 is ensured.

[0045]

As described above, according to the present invention, a terminal portion in which a plurality of terminals are arranged in each frame portion of an annular insulating frame body so that the terminals protrude outward, and this terminal portion A circuit module with a circuit board having a wiring pattern connected to each terminal of the part and mounting a surface-mounting component on one side and connecting the surface-mounting component side so as to face the inside of the terminal part, By stacking a plurality of the above-mentioned circuit modules and connecting the circuit modules with terminals, it is possible to easily and accurately connect the circuit boards mounted with high density to the terminal portions, thereby making the circuit modules into a multi-layer structure. Because it can be easily and accurately arranged,
It is possible to realize higher density mounting.

[Brief description of drawings]

FIG. 1 is an exploded perspective view showing an electronic circuit device according to a first embodiment of the present invention.

FIG. 2 is a perspective view showing the appearance of the device.

3 (a) and 3 (b) are a plan view and a side view showing a part of the apparatus by cutting away.

FIG. 4 is an exploded perspective view of a main part of the device.

FIG. 5 is an enlarged view showing a main part structure of the device.

FIG. 6 is an enlarged cross-sectional view showing the main structure of the device.

FIG. 7 is an enlarged view showing a main part structure of the device.

FIG. 8 is a perspective view showing another example of main parts of the apparatus.

FIG. 9 is a perspective view showing a terminal portion of the device.

FIG. 10 is a plan view of the terminal portion viewed from above.

FIG. 11 is a plan view of the terminal section seen from the back surface.

12 (a) and 12 (b) are a side view and a cross-sectional view of the terminal portion.

FIG. 13 is an enlarged view showing a main part of the terminal portion.

FIG. 14 is an enlarged sectional view of the same.

FIG. 15 is an enlarged perspective view showing a main part of the terminal portion.

FIG. 16 is an enlarged perspective view showing another example of the terminal portion.

FIG. 17 is an enlarged view showing a main part of the terminal portion.

FIG. 18 is an enlarged view showing another example of the terminal portion.

19 (a) and 19 (b) are a plan view and a side view showing a state at the time of insert molding when manufacturing the terminal portion.

FIG. 20 is a perspective view showing an electronic circuit device according to a second embodiment of the present invention.

FIG. 21 is a perspective view showing an electronic circuit device according to a third embodiment of the present invention.

FIG. 22 is an exploded perspective view showing an electronic circuit device according to a fourth embodiment of the present invention.

FIG. 23 is a perspective view showing the appearance of the same device.

FIGS. 24 (a) and 24 (b) are a plan view and a side view showing a part of the device by cutting away.

FIG. 25 is an exploded perspective view of a main part of the same device.

FIG. 26 is an enlarged view showing the main structure of the device.

FIG. 27 is an enlarged cross-sectional view showing the main structure of the same device.

FIG. 28 is an enlarged cross-sectional view showing the main part structure of the same device.

FIG. 29 is an enlarged cross-sectional view of the main part structure of the same device.

FIG. 30 is a perspective view showing another example of the main parts of the apparatus.

FIG. 31 is an enlarged cross-sectional view showing another example of the main parts of the same device.

FIG. 32 is a perspective view showing a terminal portion of the same device.

FIG. 33 is an enlarged cross-sectional view showing the main parts of the terminal portion.

FIG. 34 is an enlarged perspective view showing a main part of the terminal portion.

FIG. 35 is an enlarged view showing a main part of the terminal portion.

FIG. 36 is an enlarged view showing a main part of the terminal section.

[Explanation of symbols]

 1,2,23,24 Circuit module 3,25 Frame body 4,8,26,30 Terminals 5,9,27,31 Terminal part 6,28 Surface mounting component 7,29 Circuit board 7a, 29a Connection land part 10 , 11, 32, 33 Connection part 12 Top plate 12a Connection terminal 13 Fixing hole 16 Flat part 17 Hole 18 Projection part 34 Heat sink 36 Fixing hole 37 Protrusion 37a Caulking part 39 Projection part 40 Groove 41 Flat part 43 Flat part 43a Embedded part

Claims (18)

[Claims] 1. A first terminal portion in which a plurality of terminals are arranged in each frame portion of an annular insulating frame body so that the terminals project outward in a U-shape, and the first terminal portion. A first circuit board having a wiring pattern connected to each of the terminals and having a surface mounting component mounted on one surface thereof and the surface mounting component side being connected to face the inside of the first terminal portion. A second terminal portion that constitutes the first circuit module and has a plurality of terminals arranged in each frame portion of an annular insulating frame body so that the terminals project outward in an L-shape; A second wiring part having a wiring pattern connected to each terminal of the second terminal part, and having a surface mounting component mounted on one surface thereof and the surface mounting component side being directed toward the inside of the second terminal part. And a second circuit module to form a second circuit module with the second circuit module. An electronic circuit device in which at least one first circuit module is stacked on the second circuit module with the cable as the lowermost part, and the circuit modules are connected by terminals. 2. The electronic circuit device according to claim 1, wherein a top plate for electromagnetic shielding is provided on the uppermost first circuit module. 3. The electronic circuit device according to claim 1, wherein a heat dissipation plate for heat dissipation is in contact with the circuit board of each circuit module. 4. The electronic circuit device according to claim 3, wherein a connection terminal for electromagnetic shielding is arranged on the heat dissipation plate. 5. The electronic circuit device according to claim 3, wherein a window is provided in the heat dissipation plate at a position matching the terminals of the first and second terminal portions. 6. The electronic circuit device according to claim 3, wherein the heat dissipation plate is provided with a convex portion so that the heat dissipation plate and the surface mount component are in direct contact with each other. 7. The first circuit module and the second circuit module are configured such that projections are provided at corners of the frame bodies, and the projections support the respective circuit modules.
Electronic circuit device described. 8. In the first terminal portion and the second terminal portion, a plurality of protrusions for regulating the position of the outer end of the circuit board are provided at predetermined intervals on the peripheral edge of the upper surface of each frame. The electronic circuit device according to claim 1, wherein the electronic circuit device is provided, and a plurality of terminals are drawn out through the protrusions. 9. In the first terminal portion and the second terminal portion, a protrusion is provided on the outer edge of the upper surface of each frame, and a plurality of grooves are formed outside the protrusion at predetermined intervals. The electronic circuit device according to claim 3, wherein the electronic circuit device is provided and a plurality of terminals are drawn out through the groove. 10. The electronic circuit device according to claim 8, wherein the projections provided on the first terminal portion and the second terminal portion are tapered. 11. The first terminal portion and the second terminal portion, the projections for restricting the position of the circuit board, the four corners are cut off so as not to contact the circuit board.
Electronic circuit device described. 12. The electronic circuit device according to claim 1, wherein the first terminal portion and the second terminal portion are provided by insert-molding terminals into the frame body. 13. In the first terminal portion and the second terminal portion, the rear end side of the terminal is embedded in the frame body, the rear end is projected from the inner peripheral surface of the frame body, and the intermediate portion of the terminal is formed. The electronic circuit device according to claim 4, wherein the provided flat portion is exposed on the upper surface of the frame body and is drawn out through the space between the protrusions. 14. The electronic circuit device according to claim 4, wherein a part of a portion between the protrusions of the terminal is embedded in the protrusion. 15. The electronic circuit device according to claim 4, wherein a small projection is provided on a surface of the frame body on which the outer end of the circuit board abuts. 16. The first terminal portion and the second terminal portion are provided with holes reaching the terminals on the lower surface side of the frame body.
Electronic circuit device described. 17. A terminal frame in which both ends of a plurality of terminals are connected by a connecting portion is used, and after the terminal frame is insert-molded into the frame body so that the connecting portion at one end projects from the inner peripheral surface of the frame body, The method for manufacturing an electronic circuit device according to claim 1, wherein the connecting portion is cut. 18. A terminal portion formed by disposing a plurality of terminals on each frame portion of an annular insulating frame body so that the terminals project outward, and each terminal of this terminal portion, respectively. An electronic circuit device comprising a circuit board having a wiring pattern to be connected and having a surface-mounting component mounted on one surface thereof, and the circuit board being connected to the terminal portion such that the surface-mounting component side faces the inside of the terminal portion. .