JP2008147251A - Compound substrate - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a compound substrate that can effectively alleviate thermal stress and impact stress at the joining part with a simplified structure, and also to provide a method for manufacturing the same compound substrate. <P>SOLUTION: The compound substrate 10 is joined with a frame 20 at the one main surface 12b of the substrate body 12. The frame 20 is provided with (a) a frame member 22 formed of an insulating material and extended like a frame along the circumferential part of the one main surface 12b of the substrate body 12 including a through-hole 23 at the center and (b) a plurality of connecting members 30 in which a first piece 32 and a second piece 36 formed by bending process of a metal thin film respectively continue to both ends of an intermediate piece 34. The plurality of connecting members 30 is arranged to the frame member 22, the first piece 32 is joined to the terminal of one main surface 12b of the substrate body 12, the second piece 36 is exposed in the opposite side of the substrate body 12, and at least one 36 of the first piece and the second piece is movable in separation from the frame member 22. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a composite substrate, and more particularly to a composite substrate formed by bonding a frame to one main surface of a substrate body.

  In order to mount electronic components at high density, module components are provided in which chip-shaped electronic components are mounted on both sides or one side of a substrate body. When such a module component is mounted on another circuit board, it has been proposed to attach a frame-like member or package to the board body of the module component in order to lift the board body of the module component from the other circuit board. In this case, for electrical connection between the board body and another circuit board, a wiring pattern is formed on the frame member or package, one end of the wiring pattern is joined to the board body, and the other end of the wiring pattern is Joined to another circuit board (for example, Patent Documents 1 to 4).

  Further, in Patent Document 5, as shown in the perspective view of FIG. 24, the intermediate portion 114 of the lead terminal 110 is supported by a frame-shaped housing 120 having a through hole 126, and the lead terminal 110 for connecting to the module substrate. One end 112 of the lead terminal 110 extends along the lower surface 124 of the housing 120, and the other end 116 of the lead terminal 110 extends at a distance from the upper surface 122 of the housing 120 and protrudes from the housing 120. There has been proposed a board connecting member 100 that improves the impact resistance by utilizing the spring elasticity of the other end 116 side of the lead terminal 110.

  Further, in Patent Document 6, as shown in FIG. 26A, a lead frame 230 is insert-molded on a flat resin substrate 220, and an intermediate portion 231 of the lead frame 230 is placed inside the resin substrate 220. A chip package 210 is disclosed that is embedded and refracted at both ends of the lead frame 230 to expose the lead portions 232 and 233 on the front and back surfaces of the resin substrate 220.

  In this chip package 210, as shown in FIG. 26B, the chip 240 is mounted on the upper surface of the resinous substrate 220 so as to straddle the opening 223, and the chip 240 and the lead part 232 are connected by the bonding wire 250. ing.

Also, as shown in FIG. 26C, a resin sealant 252 is applied to the upper surface of the chip package 210 so as to also seal the chip 240, and then covered with a box-shaped lid 254 having an opening on the lower surface. A semiconductor device is formed by being fixed to the substrate 220. This semiconductor device is mounted on a printed board 271.
JP-A-6-216314 Japanese Patent Laid-Open No. 7-50357 JP 2000-101348 A JP 2001-339137 A JP 2005-333046 A JP 2005-328209 A

  If there is a difference in thermal expansion coefficient or linear expansion coefficient between the board body of the module component and another circuit board on which the module part is mounted, the wiring pattern formed on the frame-like member or package and the board body or other due to temperature changes Thermal stress is generated at the junction with the circuit board. In addition, impact stress is generated in these joint portions by a drop impact. In particular, when used in a harsh environment, the thermal stress and impact stress increase, so the joint reliability is significantly reduced.

  The structure in which the gap is provided between the housing 120 and the lead terminal 110 as in the substrate connecting member 100 disclosed in Patent Document 5 is provided with a gap in order to prevent housing material (for example, molding resin) from entering the gap. It is necessary to sandwich a spacer for ensuring the above. When the housing material is formed by an insert molding technique with high mass productivity, a portion corresponding to the spacer is provided in the molding die.

  For example, as shown in the cross-sectional view of the main part of FIG. 25A, the portion that becomes the housing 120 is insert-molded with the portion 115 on the tip 117 side of the lead terminal 110 being straight. At this time, a spacer (not shown) is arranged in the space 130 between the inner peripheral surface 127 of the housing 120 and the portion 115 on the tip 117 side of the lead terminal 110. Next, as shown in the main part sectional view of FIG. 25B, the portion 115 on the tip 117 side of the lead terminal 110 is bent. At this time, a spacer (not shown) for forming a space 132 between the upper surface 122 of the housing 120 and the end portion 116 of the lead terminal 110 is disposed on the upper surface 122 of the housing 120, and the tip 117 side of the lead terminal 110 is arranged. The portion 115 is bent.

  Considering durability, the spacer needs to have a certain thickness (for example, 100 μm or more). Therefore, the gap between the housing 120 and the lead terminal 110 cannot be reduced to the order of several tens of μm. That is, it is difficult to reduce the size and height.

  In addition, since the lead terminal is bent in a complicated manner, the configuration of the terminal bending die and the housing material molding die becomes complicated, the processing cost increases, and the initial investment for the die cost increases. Furthermore, since the shape is complicated, the quality variation becomes large and the mass productivity is poor.

  Furthermore, when solder is joined to the back surface of the end portion 116 of the lead terminal 110 or to the intermediate portion 114 side, the joining reliability may be lowered.

  The chip package disclosed in Patent Document 6 is one in which a chip is mounted and connected by a bonding wire, and is not bonded to a substrate body. Patent Document 6 does not disclose or suggest the shape of the lead frame for relieving thermal stress and impact stress.

  In view of such circumstances, the present invention is intended to provide a composite substrate that can effectively relieve thermal stress and impact stress at a joint portion with a simple configuration and a method for manufacturing the same.

  In order to solve the above technical problem, the present invention provides a composite substrate configured as follows.

  The composite substrate includes a substrate body having terminals on at least one main surface, and a frame body joined to the one main surface of the substrate body. The frame includes a frame member and a plurality of connection members. The frame member is made of an insulating material, has a through hole in the center, and extends in a frame shape along the peripheral edge of the one main surface of the substrate body. The plurality of connecting members are formed by bending a thin metal plate, and the first piece and the second piece are continuous at both ends of the intermediate piece, respectively. The plurality of connecting members are (a) arranged on the frame member, (b) the first piece is exposed to the substrate body side of the frame member, and the terminal on the one main surface of the substrate body (C) the second piece is exposed on the opposite side of the frame member from the substrate body, and (d) at least one of the first piece or the second piece is separated from the frame member. It is movable.

  In the above configuration, the composite substrate has the second piece of the connection member connected to the external circuit board.

  In the above configuration, when thermal stress or impact stress acts on the composite substrate, at least one of the first piece or the second piece of the connecting member that is movable away from the frame member moves, and the thermal stress or impact stress is moved. Can be effectively mitigated.

  Moreover, since the opposing connection members are arranged symmetrically, the first piece or the second piece that is movable away from the frame member extends on the opposite side and non-parallel. Therefore, the first piece or the second piece of at least one connecting member can move and absorb the shock regardless of the impact load in any direction.

  As a preferred embodiment, the first piece of the connecting member is embedded in the frame member at a portion opposite to the intermediate piece.

  In this case, the adhesion between the first piece of the connecting member and the frame member is strengthened, and the bonding between the substrate body and the frame member is strengthened and integrated, so the impact load is relaxed by the second piece of the connecting member, It is possible to improve the bonding reliability by preventing impact stress from occurring at the bonding portion between the substrate body and the frame member.

  As another preferable aspect, the intermediate piece of the connection member is (a) disposed along the inner surface of the through hole of the frame member, and (b) an intermediate between the first piece side and the second piece side. Only a portion is fixed to the frame member, and (c) both end portions of the first piece side and the second piece side of the intermediate piece can be contacted and separated from the inner surface of the through hole of the frame member.

  In this case, the vicinity of both ends of the intermediate piece of the connecting member can be separated from the frame member, so the movable range of the first piece and the second piece of the connecting member is when the vicinity of both ends of the intermediate piece is embedded in the connecting member. Wider than.

  As still another preferable aspect, a protrusion is provided on a surface of the frame member that faces the one main surface of the substrate body. The first piece of the connection member extends along a surface of the protrusion that faces the one main surface of the substrate body.

  In this case, since the first piece of the connecting member protrudes from the frame member, for example, a solder or a conductive adhesive is simultaneously applied to the first piece of the connecting member at a plurality of locations by a transfer method to efficiently produce the composite substrate. can do. In addition, since the connection member has a protrusion on the back of the part protruding from the frame member, solder for bonding to the substrate body does not wet the connection member, improving the bonding reliability can do.

  Preferably, a chip-shaped electronic component is disposed in the through hole of the frame-shaped member and is mounted on the one main surface of the substrate body.

  In this case, the mounting density of the composite substrate can be increased using the through holes of the frame-shaped member.

  Preferably, the chip-shaped electronic component is sealed with a resin, and the resin adheres to or abuts on a part of the frame.

  In this case, the flow of the resin can be prevented by the frame, and the chip-shaped electronic component can be reliably sealed. Further, the resin used for sealing can prevent deformation of the frame body and relative movement with respect to the substrate body, and can reinforce the bonding between the frame body and the substrate body.

  Preferably, the connection member of the frame is formed by punching and bending a thin metal plate. The frame member of the frame body is a resin molded in a state where a portion to be the connection member is inserted into a mold.

  In this case, the frame can be manufactured efficiently.

  Preferably, the substrate body is a ceramic substrate.

  Since the ceramic substrate has a small thermal expansion, the thermal stress acting on the joint portion when mounted on the external circuit substrate becomes large. Therefore, the effect of improving the bonding reliability is particularly great.

  Preferably, the substrate body is a ceramic multilayer substrate formed by laminating a plurality of ceramic layers sintered at 1050 ° C. or lower.

  In this case, it is possible to improve the bonding reliability while increasing the mounting density of the composite substrate by the ceramic multilayer substrate. In addition, since the ceramic multilayer substrate is more fragile than other types of substrates, the effect of preventing the ceramic multilayer substrate itself from being destroyed due to thermal stress or impact stress is great.

  Preferably, the metal thin plate of the connection member of the frame body has flexibility.

  If the thin metal plate constituting the connecting member is flexible, the first piece and the second piece of the connecting member are movable with the connecting portion with the intermediate piece as a fulcrum. Strength and bonding strength between the frame and the external circuit board are improved.

  Preferably, the connection member has a thickness of 50 μm or more and 300 μm or less.

  If it is in the said range, since a connection member can be processed with high precision, size reduction is easy. That is, when the thickness of the connection member is smaller than 50 μm, the variation during bending increases, and the accuracy of the position and height of the first piece and the second piece of the connection member decreases. Moreover, it is easy to fatigue failure. When the thickness of the connecting member is larger than 300 μm, the bending process becomes difficult, and the variation in the bending angle and the height become large.

  Preferably, a chip-shaped electronic component is mounted on the other main surface of the substrate body.

  In this case, the mounting density of the composite substrate can be increased.

  The present invention also provides a composite part configured as follows.

  In the composite part, the second piece of the connection member of any one of the above-described components is joined to a terminal of the external circuit board.

  Since at least one of the first piece or the second piece of the connecting member of the composite substrate is moved and the thermal stress and the impact stress can be effectively relieved, it is possible to provide a composite component with improved bonding reliability. it can.

  In order to solve the above technical problem, the present invention provides a method for manufacturing a composite substrate configured as follows.

  A method for manufacturing a composite substrate includes: a first step of preparing a substrate body provided with terminals on at least one main surface; and a frame body; and a step of joining the frame body to the one main surface of the substrate body. 2 steps. In the first step, the frame body is made of an insulating material and is formed by bending a frame member having a through hole in the center and a thin metal plate, and a first piece and a second piece at both ends of the intermediate piece, respectively. A plurality of connecting members. The plurality of connection members are disposed on the frame member, and the first piece and the second piece are respectively exposed on both main surfaces of the frame member extending around the through hole of the frame member, The first piece and the second piece extend in a direction in which the connection member faces through the through hole of the frame member. In the second step, (a) the frame body extends in a frame shape on the one main surface of the substrate body, and the frame member extends along a peripheral edge portion of the one main surface of the substrate body. (B) The first piece of the connection member of the frame is joined to the terminal provided on the one main surface of the substrate body.

  In the composite substrate manufactured by the above method, the second piece of the connection member is connected to the external circuit substrate. When thermal stress or impact stress is applied to the composite substrate, at least one of the first piece and the second piece of the connecting member that is movable away from the frame member is moved, so that the thermal stress and the impact stress are effective. Can be relaxed. As a result, the bonding reliability can be improved.

  Moreover, since the opposing connection members are arranged symmetrically, the first piece or the second piece that is movable away from the frame member extends on the opposite side and non-parallel. Therefore, the first piece or the second piece of at least one connecting member can move and absorb the shock regardless of the impact load in any direction.

  According to the present invention, it is possible to effectively relieve the thermal stress and impact stress of the joint portion with a simple configuration.

  Hereinafter, embodiments of the present invention will be described with reference to FIGS.

  Example 1 A composite substrate will be described with reference to FIGS.

  As shown in the cross-sectional view of FIG. 1A, the composite substrate 10 has a frame body 20 joined to one main surface 12b of a plate-like substrate body 12, as shown in the cross-sectional view of FIG. Further, it is bonded to the external circuit board 60.

  A chip-like electronic component 50 such as an IC chip is mounted on one main surface 12 b of the substrate body 12, and a terminal (not shown) of the chip-like electronic component 50 and a not-shown illustration provided on the one main surface 12 b of the substrate body 12. The pads are connected by bonding wires 52. On one main surface 12b of the substrate main body 12, a chip-like electronic component 55 to be connected by other than wire bonding may be mounted. For example, a surface mount type component (SMD) may be mounted.

  Chip-like electronic components 40 and 42 such as chip capacitors and IC chips are mounted on the other main surface 12a of the substrate body 12 as necessary, and the chip-like electronic components 40 and 42 are mounted by solder reflow or flip-chip bonding. A terminal (not shown) and a terminal (not shown) provided on the other main surface 12a of the substrate body 12 are connected.

  The substrate body 12 may have any structure as long as electronic components can be mounted on one side or both sides for high density. The substrate body 12 is, for example, a ceramic multilayer substrate in which a plurality of ceramic layers are stacked. The ceramic multilayer substrate is preferable as the substrate body 12 of the composite substrate 10 because the mounting density can be increased by configuring an electric circuit therein. However, the substrate body 12 is not limited to a ceramic multilayer substrate, and even if it is a ceramic substrate having only one layer (for example, an alumina substrate), a substrate using a material other than ceramic (for example, a printed circuit board, a flexible printed circuit board, etc.) ).

  In the frame 20, a plurality of connection members 30 are arranged on a frame member 22 made of an insulating material (for example, resin).

  The frame member 22 has a through hole 23 in the center, and extends in a frame shape along the peripheral edge portion of the one main surface 12 b of the rectangular substrate body 12. A recess (cavity) is formed by the through hole 23 of the frame member 22, and the above-described chip-shaped electronic components 50, 55 and pads are arranged on the one main surface 12 b of the substrate body 12 which becomes the bottom surface of the recess. .

  In order to protect from mechanical destruction and environments such as heat and moisture, the through hole 23 of the frame member 22 is filled with a sealing agent 54 as necessary, and the chip-shaped electronic components 50 and 55 are sealed. When the chip-like electronic components 50 and 55 are mounted on the one main surface 12b of the substrate body 12 by solder reflow, or when the chip-like electronic components 50 and 55 are flip-chip bonded with Au or solder bumps, sealing is performed. The agent 54 may be omitted.

  Further, the metal case 19 is joined to the other main surface 12a side of the substrate body 12 to cover the chip-shaped electronic components 40, 42, or the chip-shaped electronic components 40, 42 are sealed with a sealing agent, although not shown. You may stop it. This is because when the composite substrate 10 is mounted on the external circuit substrate 60, it is easily adsorbed by the mounter. In particular, when the metal case 19 is used for the high-frequency composite substrate 10, an electromagnetic shielding effect is also obtained. When the electromagnetic shield is unnecessary, a thermosetting resin such as an epoxy resin is applied or transfer molded so as to cover the upper surfaces of the chip-like electronic components 40 and 42, and the top surface is flattened.

  The connection members 30 are arranged on the four sides of the frame member 22 so as to face each other through the through holes 23 of the frame member 22. As shown in the enlarged cross-sectional view of the main part of FIG. 2, each connecting member 30 is a member having a substantially U-shaped cross section in which two bent portions 33 and 35 are formed by bending a belt-shaped metal thin plate at a right angle. A first piece 32 and a second piece 36 are connected to both ends of the piece 34, respectively. The intermediate piece 34 penetrates the inside of the frame member 22. The first piece 32 extends along a surface 22 a of the frame member 22 that faces the substrate body 12. The second piece 36 is separated from the surface 22b of the frame member 22 on the side opposite to the substrate body 12, and forms a wedge-shaped space 22x between the surface 22b of the frame member 22 on the side opposite to the substrate body 12. is doing.

  In the connecting member 30, the intermediate piece 34 is arranged on the through hole 23 side of the frame member 22, and the first piece 32 and the second piece 36 are arranged on the opposite side of the intermediate piece 34 from the through hole 23 of the frame member 22. Has been. That is, the intermediate piece 34 of the connection member 30 is disposed on the inner side, the first piece 2 and the second piece 36 of the connection member 30 are on the same side with respect to the intermediate piece 34, and the respective tips 31 and 37 are directed outward. Is arranged.

  The first piece 32 and the second piece 36 have different lengths, and the second piece 36 is longer than the first piece 32. That is, the tip 37 side of the second piece 36 reaches the outer peripheral surface 24 of the frame member 22 when the second piece 36 is placed along the surface 22 b of the frame member 22 opposite to the substrate body 12. On the other hand, the tip 31 of the first piece 32 along the surface 22 a of the frame member 22 on the substrate body 12 side does not reach the outer peripheral surface 24 of the frame member 22.

  As shown in the cross-sectional view of FIG. 1B and the enlarged cross-sectional view of the main part of FIG. 2, the first piece 32 of the connection member 30 is a terminal 18 provided on the one main surface 12b of the substrate body 12 (FIG. 2 only). The solder 26 is joined. As a result, the frame body 20 is joined to the one main surface 12 b of the substrate body 12.

  The second piece 36 of the connection member 30 exposed to the outside is joined via a solder 66 to a surface electrode 62 (shown only in FIG. 2) of an external circuit board 60 such as a mother board. As a result, the composite substrate 10 is mounted on the external circuit substrate 60 and electrically connected thereto. When the metal case 19 is joined to the substrate body 12, the metal case 19 is also electrically connected to the external circuit board 60.

  The second piece 36 of the connecting member 30 is separated from the frame member 22 even in a state where it is bonded to the external circuit board 60. Therefore, as will be described in detail later, for example, when an impact load is applied, the second piece 36 of the connecting member 30 moves and can absorb the impact.

  The connecting member 30 is made of Ni / Sn, Ni / Au, Ni in order to improve wettability with solder and conductive adhesive used for bonding to the substrate body 12 and the external circuit board 60 and to increase bonding strength. / Solder or the like may be plated. Such plating may be performed on the entire surface of the connection member 30 or only on the bonding surface of the first piece 32 and the second piece 36.

  Next, the manufacturing process of the composite substrate 10 will be described with reference to FIGS.

  First, the substrate body 12 and the frame body 20 are prepared.

  In the case of a ceramic multilayer substrate, the substrate body 12 is formed by, for example, laminating a plurality of ceramic layers. As shown in FIG. 2, the inside of the substrate body 12 is mainly composed of Ag, Ag / Pd, Ag / Pt, Cu, CuO, The in-plane conductor pattern 14 and the via hole conductor pattern 13 are formed using the conductive paste. Since such a configuration uses Ag or Cu having low resistance, the signal loss is small and it is put into practical use as a high-frequency component or module. The main surface 12b of the substrate body 12 is formed with pads 18 for bonding the chip-shaped electronic component 55 and the frame body 20, the terminals 18 and the chip-shaped electronic component 50, and the other main surface 12a. Are formed with terminals serving as bonding electrodes (bonding lands) for bonding the chip-shaped electronic components 40 and 42. The terminals and pads are plated with Ni / Sn, Ni / Au, Ni / Pd / Au, or Ni / solder as necessary.

Specifically, an unfired ceramic green sheet having a thickness of about 10 to 200 μm on which the in-plane conductor pattern 14 and the via-hole conductor pattern 13 are formed is prepared. The green ceramic green sheet includes a low-temperature sintered ceramic material, and the sintering temperature is 1050 ° C. or lower. Specific examples of the low-temperature sintered ceramic material include a glass composite LTCC (Low Temperature Co-fired Ceramic) material obtained by mixing borosilicate glass with ceramic powder such as alumina and forsterite, ZnO-MgO-Al. Crystallized glass-based LTCC materials using ₂ O ₃ —SiO ₂ -based crystallized glass, BaO—Al ₂ O ₃ —SiO ₂ ceramic powder, and Al ₂ O ₃ —CaO—SiO ₂ —MgO—B ₂ O ₃ Non-glass type LTCC material using a ceramic ceramic powder or the like. Next, the green ceramic green sheets are laminated in an appropriate order to form a laminate in which a plurality of green ceramic green sheets are laminated. Next, the substrate body 12 formed by sintering this laminate at the sintering temperature of the ceramic green sheet is taken out.

  As shown in FIG. 4 which is a plan view immediately after resin molding in FIG. 3, FIG. 4 which is a cross-sectional view cut along line AA in FIG. 3, and FIG. After punching a metal thin plate 80 such as white or white or Ni alloy with a die to form a plurality of strips 84 inside the frame portion 82, the tip 31 side of the strip 84 is bent into a U-shaped cross section and connected A portion to be the member 30 is formed. Then, injection molding of a thermoplastic resin such as LCP (liquid crystal polymer) or PPS (polyphenylene sulfide) or transfer molding of a thermosetting resin such as an epoxy resin is performed on the tip 31 side of the band-shaped portion 84 to be the connection member 30. The frame member 22 having the through hole 23 is formed by resin molding. At this time, the first piece 32 between the tip 31 and the first bent portion 33 and the band-like portion 84 on the frame portion 82 side of the second bent portion 35 (see FIG. 2) are formed on the inner surface of the mold. The resin is molded such that the intermediate piece 34 (see FIG. 2) between the first bent portion 33 and the second bent portion 35 is separated from the inner surface of the mold. As shown in FIG. 5, the tip 31 of the first piece 32 of the connection member 30 does not reach the outer peripheral surface 24 of the frame member 22.

  Immediately after the resin molding, as shown in FIG. 4 and FIG. 3, the band-like portion 84 of the metal thin plate 80 other than the portion that becomes the connection member 30 is connected to the periphery of the mold resin (frame member 22). 6, by moving the upper mold 70 in the direction indicated by the arrow 74 with respect to the lower mold 72, the band-shaped portion 84 of the thin metal plate 80 protruding from the molded resin (that is, the frame member 22). As shown in the sectional view of FIG. 7, the portion on the frame portion 82 side is cut along the outer peripheral surface 24 of the frame member 22. Thereby, the tip 37 side of the second piece 36 reaches the outer peripheral surface 24 of the frame member 22.

  At this time, immediately after the resin molding, the first piece 32 and the second piece 36 of the connecting member 30 and the mold resin, that is, the frame member 22 are temporarily temporarily bonded to the frame member 22 by heating and pressurization during resin molding. It is the state that was done. However, since it is not mechanically joined, the second piece 36 of the connecting member 30 is easily attached to the frame member 22 by a load / impact when the strip 84 of the thin metal plate 80 is cut by the mold. Peel from. Due to the load and impact at the time of cutting, the second piece 36 of the connecting member 30 is plastically deformed with the second piece 36 of the connecting member 30 peeled off from the frame member 22 as shown in the enlarged cross-sectional view of the main part of FIG. Maintains a state of being separated from the frame member 22.

  Next, as shown in FIG. 1, the frame body 20 is joined to the substrate body 12, and component mounting, sealing, and the like are performed to complete the composite substrate 10.

  Specifically, a conductive paste containing solder, Ag, or the like is printed on the terminals on the one main surface 12b of the substrate body 12, and the frame body 20 is mounted on the one main surface 12b of the substrate body 12. The conductive paste is thermally cured in a state where the first piece 32 of 30 is in contact with the conductive paste, and as shown in FIG. Join. At this time, since the intermediate piece 34 of the connecting member 30 is disposed inside the frame member 22 and the connecting member 30 is not exposed to the inner surface of the through hole 23, the substrate body 12 and the frame body 20 are easily joined. be able to. After bonding, cleaning is performed to remove the dirt on the pad provided on the one main surface 12b of the substrate body 12.

  When a surface mount type component is mounted on the one main surface 12 b of the substrate body 12, the surface mount type component can be joined simultaneously with the joining of the frame body 20.

  Next, chip-shaped electronic components 50 and 55 are mounted on the one main surface 12 b of the substrate body 12 from the through hole 23 of the frame body 20. For example, a chip-shaped electronic component 50 such as an IC or FET is mounted with an epoxy resin or a conductive resin, and a space between a terminal of the chip-shaped electronic component 50 and a pad provided on the one main surface 12 b of the substrate body 12. Are connected by a bonding wire 52 such as Au, Al, or Cu. At this time, since the intermediate piece 34 of the connecting member 30 is disposed inside the frame member 22 and the connecting member 30 is not exposed to the inner surface of the through hole 23, wire bonding can be easily performed.

  Next, the through hole 23 of the frame 20 is filled with a sealing agent 54 such as an epoxy resin and thermally cured, and the chip-shaped electronic components 50 and 55, the bonding wires 52, and the pads are covered with the sealing agent 54 and sealed. Stop.

  At this time, the height of the sealant 54 is set so as not to exceed the frame body 20. This is to prevent the sealing agent 54 from interfering when the composite substrate 10 is bonded to the external circuit substrate 60.

  Further, when the sealing agent 54 spreads to the second piece 36 of the connection member 30 exposed from the frame member 22, the second piece 36 is not soldered and cannot be joined to the external circuit board 60. In order to prevent this, a release agent, a water repellent, and a solder resist may be applied to the second piece 36 and its periphery.

  When the sealant 54 is cured, a conductive paste containing solder, Ag or the like is printed on the other main surface 12a of the substrate body 12, and a chip-shaped electronic component 40 such as a chip capacitor is mounted and reflowed or thermally cured. Alternatively, a chip-shaped electronic component 42 such as an IC chip is flip-chip bonded via a solder ball 43 to join the terminals of the chip-shaped electronic components 40 and 42 and the terminals of the other main surface 12a of the substrate body 12 together. If necessary, an underfill resin 44 made of an epoxy-based resin is filled between the chip-shaped electronic component 42 that has been flip-chip bonded and the other main surface 12a of the substrate body 12 and thermally cured. After the chip-like electronic components 40 and 42 are joined, a metal case 19 made of white or phosphor bronze is mounted on the other main surface 12a or the side surface of the substrate body 12 and joined.

  As shown in the enlarged cross-sectional view of the main part of FIG. 2, the composite substrate 10 manufactured through the above steps is exposed on the opposite side of the frame member 22 from the substrate body 12 when mounted on the external circuit substrate 60. The second piece 36 of the connecting member 30 is joined to a surface electrode 62 such as a joining land of an external circuit board 60 such as a printed wiring board via solder 66. As a result, the terminal 18 provided on the one main surface 12 b of the board body 12 is electrically connected to the surface electrode 62 of the external circuit board 60 via the solder 26, the connection member 30, and the solder 66.

  In the connecting member 30, the intermediate piece 34 is disposed inside the frame member 22, and the connecting member 30 is not exposed on the inner surface of the through hole 23. Therefore, the chip-like electronic component 50 on the one main surface 12 b of the substrate body 12, 55 can be easily mounted and the frame body 20 can be joined easily, so that the margin at the time of processing (gap for providing a margin) can be reduced, and the frame member 22 and thus the composite substrate 10 can be downsized. it can.

  Further, since the connecting member 30 is bent at the two bent portions 33 and 35, the intermediate piece 34 can be prevented from protruding outside the region where the first piece 32 and the second piece 36 face each other. Can be downsized.

  Since the composite substrate 10 can relieve thermal stress and impact stress as will be described below, the bonding reliability can be improved. In particular, when the substrate body 12 is a ceramic multilayer substrate having a lower bending strength than that of an alumina substrate or the like and containing glass or the like, the substrate body 12 has a great effect of preventing the substrate body from being destroyed by relaxing thermal stress and impact stress.

  That is, since the connection member 30 is a continuous metal terminal bent so as to be plastically deformed, it is elastically deformed in any of the XYZ directions. Further, the molded resin, that is, the frame member 22 and the connecting member 30 are not basically joined, and even after being molded, the resin is freely elastically deformed in the XYZ directions.

  If the connecting member 30 is elastically deformable, the reflow when the frame body 20 is bonded to the substrate body 12 or the composite substrate 10 is bonded to the external circuit substrate 60, and the heat during the subsequent heat cycle, Even if thermal stress occurs due to the difference in the linear expansion coefficient α, the thermal stress can be absorbed by elastic deformation. Similarly, an impact stress such as a drop impact can be absorbed by elastic deformation. As a result, the bonding reliability is improved.

  Furthermore, since the second piece 36 of the connecting member 30 is separated from the frame member 22 and is movable, the second piece 36 moves when an impact load is applied and can effectively reduce the impact load.

  Moreover, as shown in FIG. 1, the connection member 30 is opposed and symmetrically arranged through the through hole 23 of the frame member 22, and the paired connection members 30 are separated from the frame member 22. Since the movable second piece 36 is non-parallel, the second piece 36 of the at least one connecting member 30 can move and absorb the shock effectively regardless of the impact load in any direction. . For example, in FIG. 1, the impact load in both the upper and lower directions and the impact load in both the left and right directions can be effectively absorbed.

  When the second piece 36 of the connection member 30 is joined to the external circuit board 60 side, the composite substrate 10 such as the surface mount type components 40, 42, 50, 55, the substrate body 12, the frame member 22, the sealant 54, and the like. This is preferable because an impact mitigating effect can be exerted against an impact acting on the mass of all members.

  But the 2nd piece 36 of the connection member 30 spaced apart from the frame member 22 can also be joined not to the external circuit board 60 side but to the board body 22 side. In that case, not the total mass of the composite substrate 10 but the impact acting on the mass of the substrate main body 12 and the members 19, 40 and 42 mounted on the substrate main body 12 can be reduced. In addition, when filling the through hole 26 of the frame member 22 with the sealing agent 54, the frame member 22 is sealed so that the impact relaxation effect by the spring property of the second piece 36 of the connecting member 30 is exhibited. It is necessary to prevent them from being joined to 54.

  If the intermediate piece protrudes outside the region where the first piece and the second piece face each other by bending the connecting member only at one place or continuously plastically deforming it in an arc shape, the frame member Since the downsizing and thus the downsizing of the composite substrate 10 may be hindered, it is preferable that the connecting member is bent at a plurality of locations and the bending angle is substantially perpendicular. However, the present invention does not exclude a bent portion having a radius.

  On the other hand, the connecting member may be provided with three or more bent portions, and the intermediate piece may be bent inside the region where the first piece and the second piece face each other. This is because it does not hinder downsizing. For example, the intermediate piece may be bent into a square shape so that the cross-section of the connecting member is substantially Σ-shaped. By increasing the number of bent portions, the combination of spring constants in each direction can be changed.

  As shown in the enlarged sectional view of the main part of FIG. 8, the thickness S of the frame member 22 is preferably 200 μm or more. If it is less than 200 μm, it is difficult to resin-mold the frame member 22 together with the connection member 30.

  The thickness T of the metal thin plate used for the connecting member 30 is preferably 50 μm to 300 μm.

  If the thickness of the metal thin plate used for the connection member 30 is less than 50 μm, the variation during bending becomes large, and the variation in the position and height of the first piece 32 and the second piece 36 becomes large. When the variation in the position and height of the first piece 32 and the second piece 36 is increased, the alignment accuracy between the frame body 20 and the substrate body 12 is lowered. In order to securely bond the frame body 20 and the substrate body 12, if the terminal 16 of the substrate body 12 to be bonded to the first piece 32 is made large in consideration of a margin for the positional deviation of the first piece 32, the substrate body 12. Downsizing, and consequently downsizing of the composite substrate 10 is impaired.

  If the height of the first piece 32 or the second piece 36 of the connecting member 30 varies, for example, solder 26, 66 between the board body 12 and the frame body 20, or between the frame body 20 and the external circuit board 60. As a result, the bonding reliability is impaired. If the height margin is increased in consideration of the height variation, the height reduction of the composite substrate 10 is hindered.

  Further, the vicinity of the bent portions 33 and 35 of the connection member 30 is repeatedly subjected to fatigue due to thermal stress and impact stress. However, if the thickness is small, the fatigue reliability is liable to be deteriorated, so that the joint reliability is impaired.

  When the thickness of the metal thin plate used for the connecting member 30 exceeds 300 μm, the bending process becomes difficult, and the variation in bending angle and the variation in height become large. Further, the interval between the punching and bending is reduced, and the length (the dimension in the direction in which the first piece 32, the intermediate piece 34, and the second piece 36 are continuous) and the width of the first piece 32, the intermediate piece 34, and the second piece 36. Since (the dimension in a direction perpendicular to the direction in which the first piece 32, the intermediate piece 34, and the second piece 36 are continuous) cannot be reduced, the size reduction and the height reduction of the composite substrate 10 are hindered.

  The gap R between the tip 37 of the second piece 36 of the connecting member 30 and the frame member 22 is preferably 300 μm or less, that is, not more than the maximum thickness of the thin metal plate used for the connecting member 30. This is because the gap R of 300 μm or less forms the tip 37 of the second piece 36 of the connecting member 30 and can be easily formed when the thin metal plate is cut.

  It is also conceivable that the connecting member 30 is formed by a method other than bending a thin metal plate.

  However, for example, in the case of forming by plating, if the plating solution remains in the through hole, it remains in the step of bonding the frame body 20 to the substrate body 12 or the step of bonding the composite substrate 10 to the external circuit board 60. When the plating solution is heated, vaporized, and rapidly expands, cracks may occur near the through holes or voids may occur in the solder. In the case where the connecting member 30 is formed by bending a thin metal plate, such a situation does not occur, so that the joining reliability can be improved.

  Further, when the through hole is drilled and the inner peripheral surface is plated, the through hole has a diameter of, for example, 100 μm or less, which makes it difficult to process. When the connection member 30 is formed by bending a thin metal plate, the thickness of the thin metal plate can be reduced to 50 μm and can be easily processed. Also, the dimensions that need to be left around the hole should be smaller when the connecting member 30 is formed by bending a thin metal plate than when the through hole is drilled and the inner peripheral surface is plated. Can do. Therefore, the connecting member 30 can be easily reduced in size by being formed by bending a thin metal plate.

  Further, if the connecting member 30 is formed by bending a metal thin plate and resin-molded so as to cover it, the process becomes simple and the manufacturing cost can be reduced.

  The material of the metal thin plate used for the connection member 30 has a higher degree of freedom in selection than when the connection member 30 is formed by plating. The resin of the frame member 22 and the metal of the connection member 30 do not need to be firmly joined. Therefore, the resin material used for the frame member 22 is also highly selectable. Therefore, an inexpensive material, a material that can be easily bent, and a material that can be easily molded can be selected with a high degree of freedom, which is industrially useful.

  (Modification) A modification of the first embodiment will be described with reference to FIG.

  As shown in the cross-sectional view of FIG. 9A and the enlarged cross-sectional view of the main part of FIG. 9B, the composite substrate 10a of the modified example has only the shape of the frame 20a, more specifically, the shape of the connection member 30a. Different from the composite substrate 10 of the first embodiment.

  That is, in the connection member 30a, the first piece 32 and the second piece 36 are connected to both ends of the intermediate piece 34, respectively, as in the connection member 30 of the first embodiment. Is different and is bent in a substantially Z-shaped cross section, and the first piece 32 and the second piece 36 respectively extend on the opposite side with respect to the intermediate piece 34.

  As shown in FIG. 9B, unlike the connection member 30 of the first embodiment, the first piece 32 of the connection member 30a has the tip 31 on the through hole 23 side of the frame member 22, and the bent portion 33 is the frame member. 22 extends along the surface 22a of the frame body 22 on the substrate body side so as to be on the outer peripheral surface 24 side. The intermediate piece 34 of the connecting member 30a penetrates the frame member 22 diagonally.

  Similarly to the second piece 36 of the connection member 30 of the first embodiment, the second piece 36 of the connection member 30a is separated from the surface 22b of the frame member 22 on the side opposite to the substrate body 12, and the substrate body of the frame member 22 is separated. A wedge-shaped space 22x is formed between the surface 12b and the opposite surface 22b.

  Similar to the composite substrate 10 of the first embodiment, the composite substrate 10a is resin-molded in a state where the front end side of the strip portion of the metal thin plate is bent in a substantially Z-shaped cross section, and the metal thin plate other than the connection member 30a is cut and removed. By doing so, it can be manufactured.

  In the composite substrate 10a, the second piece 36 of the connection member 30a is joined to the terminal of the external circuit substrate, similarly to the composite substrate 10 of the first embodiment. In the composite substrate 10a, the second piece 36 of the connection member 30a is separated from the frame member 22 and has a spring property similarly to the first embodiment, so that the impact load can be reduced.

  Example 2 A composite substrate 10b of Example 2 will be described with reference to FIG. 10A is a cross-sectional view of the composite substrate 10b, and FIG. 10B is a cross-sectional view of the main part of the composite substrate 10b.

  As shown in FIGS. 10A and 10B, the composite substrate 10b of the second embodiment is configured in the same manner as the composite substrate 10 of the first embodiment. Below, it demonstrates centering around difference with Example 1, and uses the same code | symbol for the same component as Example 1. FIG.

  The composite substrate 10b of the second embodiment is different from the composite substrate 10 of the first embodiment in the shape of the frame 20b, more specifically, the shape of the connecting member 30b.

  Similarly to the connection member 30 of the first embodiment, the connection member 30 b includes a first piece 32 b and a second piece 36 that are continuous from both ends of the intermediate piece 34, and the second piece 36 is separated from the frame member 22. . Unlike the connection member 30 of the first embodiment, the connection member 30b is formed by extending the tip 31 side of the first piece 32b, and the first and second extension portions 31s and 31t are bent into a substantially U-shaped cross section. Yes. That is, the extended portions 31 s and 31 t of the first piece 32 b reach the outer peripheral surface 24 of the frame member 22, and the first extended portion 31 s extends along the outer peripheral surface 24 of the frame member 22. From the intermediate position of the outer peripheral surface 24, the second extension portion 31 t bites into the frame member 22. Therefore, the connecting member 30 has the tip 31 side and the intermediate piece 34 held inside the frame member 22, and the first piece 32 extending along the frame member 22 can be separated from the frame member 22. It is blocked and firmly fixed to the frame member 22.

  In the composite substrate of the second embodiment, the substrate main body 12 and the frame body 20b are strengthened and more integrated, so the impact load is relaxed by the second piece 36 of the connecting member 30b, and the substrate main body 12 and the frame body are reduced. It is possible to improve the bonding reliability by preventing impact stress from being generated in the bonded portion between 20b.

  Note that the tip 31 side of the first piece 32b of the connection member 30b may be bent so as to bite into the surface 22b of the frame member 22 on the substrate body side, but rather than this case, the frame member 22 as shown in FIG. The first piece 32b of the connection member 30b is firmly fixed to the frame member 22 by being bent so as to bite into the outer peripheral surface 24 on the substrate body side.

  <Example 3> The composite substrate of Example 3 will be described with reference to FIGS.

  The composite substrate 10s of Example 3 is configured in substantially the same manner as the composite substrate 10 of Example 1 as shown in the cross-sectional view of FIG. As shown in the cross-sectional view of FIG. 11B, the composite substrate 10s includes the second piece 36 of the connection member 30s spaced from the frame member 22s of the frame body 20s, like the composite substrate 10 of the first embodiment. To the external circuit board 60. The composite substrate 10s of Example 3 is different from the composite substrate 10 of Example 1 in the shape of the frame 20s.

  As shown in FIG. 12B, which is a plan view of FIG. 12A and a cross-sectional view taken along line BB of FIG. 12A, the frame body 20s is a composite substrate of Example 1. 10 includes a connection member 30s in which a first piece 32 and a second piece 36 are continuous from both ends of the intermediate piece 34s, and a frame member 22s.

  Unlike the connection member 30 of the first embodiment, the connection member 30s has an intermediate piece 34s extending along the inner surface of the through hole 23 of the frame member 22s and does not penetrate the frame member 22s. The frame member 22s extends along each side of the frame member 22s to an intermediate position on the inner surface of the through hole 23, that is, an intermediate position between the surface 22a on the substrate body side of the frame member 22s and the opposite surface 22b. An existing streak-like protrusion 25 is formed, the protrusion 25 crosses over the intermediate piece 34s of the connecting member 30s, and the intermediate piece 34s is fixed to the frame member 22s.

  The frame 20 having such a configuration is provided with a recess for forming the protrusion 25 in a mold for forming the frame member 22s, and in the same manner as in the first embodiment, the connection member 30s is formed. It can be manufactured by resin-molding the portion that becomes the frame member 22s together with the metal thin plate.

  As shown in the cross-sectional view of the main part of FIG. 13, the vicinity of both ends of the intermediate piece 34s of the connection member 30s, that is, the bent portions 33 and 35 and the vicinity thereof are not embedded in the frame member 22s, but only one surface is temporarily crimped. Since it is in the state, as shown by the chain line, it can be easily separated from the frame member 22s with the movement of the first piece 32 and the second piece 36 of the connecting member 30. Therefore, the movable range of the first piece 32 and the second piece 36 of the connecting member 30 indicated by the arrows 32r and 36r is wider than that in the first embodiment.

  In a state in which a resist is applied in advance to the surfaces 32k and 36k on which the first piece 32 and the second piece 36 of the connection member 30s are temporarily pressure-bonded to the frame member 22s and the surface 34k where the intermediate piece 34s is in contact with the protrusion 25. When the member 22s is insert-molded, the force by which the connecting member 30s is temporarily crimped to the frame member 22s is weakened, and the first piece 32 and the second piece 36 of the connecting member 30s are easily separated from the frame member 22. Can do.

  (Modification) A modification of the third embodiment will be described with reference to FIGS.

  As shown in the cross-sectional view of FIG. 14, in the composite substrate 10t of the modification of the third embodiment, a cavity (concave portion) 12c is formed on the substrate main body 12t on the other main surface 12a side, and the chip-shaped electronic component 40 is formed in the cavity 12c. , 42 are mounted and covered with a metal case 19t.

  Further, the frame body 20t of the composite substrate 10t is a plan view of FIG. 15 and a cross-sectional view cut along line AA, line BB, and line CC of FIG. As shown in FIGS. 17A to 17C, which are enlarged cross-sectional views of the main parts of FIGS. 16A to 16C, an intermediate piece 34t of the connection member 30t is provided on the connection member 22t. It is fixed by the protruding portion 25t. As shown in FIGS. 17B and 17C, the intermediate piece 34t of the connection member 30t is provided with a through hole 34h. The through hole 34h is provided in a metal thin plate for forming the connection member 30t by die punching / etching or the like before resin molding. The number of through holes 34h is not necessarily one, and may be plural. The shape of the through hole 34h may be a circle, a long hole, a quadrangle, or the like. The position of the through hole 34h is preferably closer to the center of the intermediate piece 34t because the movable range of the connecting member 30t is expanded.

  The protrusion 25t is formed in a hemispherical shape on the intermediate piece 34t of the connection member 30t by the resin that has passed through the through hole 34h of the intermediate piece 34t of the connection member 30t when the frame member 22t is resin-molded. The shape and number of the protrusions 25t are not limited to the illustrated example, as in the case of the through hole 34h provided in the intermediate piece 34t of the connection member 30t, and an appropriate shape and number can be selected.

  When the intermediate piece 34t of the connection member 30t is individually fixed by the protrusion 25t of the frame member 22t as in the modification, the material used for the frame member 22t is reduced compared to the case of fixing by the streak-like protrusion 25, The weight of the composite substrate can be reduced.

  <Example 4> The composite substrate of Example 4 will be described with reference to FIGS.

  The composite substrate 10x of Example 4 is configured in substantially the same manner as the composite substrate 10 of Example 1, as shown in the cross-sectional view of FIG. As shown in the cross-sectional view of FIG. 18B, the composite substrate 10x includes the second piece 36 of the connection member 30x that is separated from the frame member 22x of the frame body 20x, like the composite substrate 10 of the first embodiment. To the external circuit board 60. The composite substrate 10x of the fourth embodiment is different from the composite substrate 10 of the first embodiment in the shape of the frame 20x.

  Unlike the composite substrate 10 of the first embodiment, the frame body 20x of the composite substrate 10x is provided with a raised portion 22k on the main surface 22p of the frame member 22x on the substrate body 12 side. FIGS. 19B to 19D are plan views of FIG. 19A and cross-sectional views taken along line BB, line CC, and line DD of FIG. 19A. Thus, the protruding portion 22k is provided for each connection member 30x, and a space is formed between the adjacent protruding portions 20k.

  As shown in the enlarged cross-sectional view of the main part of FIG. 20, the intermediate piece 34x of the connection member 30x is provided with two bent portions 34a and 34b and is bent in a generally S shape. The connection member 30x extends along the raised portion 20k. Since the outer side of the bent portion 33x of the connecting member 30x is not constrained, the movable range of the first piece 32x of the connecting member 30x is expanded as indicated by a chain line.

  The first piece 32x of the connection member 30x is disposed outside the protrusion 22k of the frame member 22x, and is separated from the main surface 22p of the frame member 22x. Therefore, solder or a conductive adhesive for joining the frame body 20x to the board body 12 can be supplied to the first piece 32x of the connection member 30x by a transfer method.

  In this case, when the protruding portion 22k is too wide than the first piece 32x of the connection member 30x, for example, when transferring the solder for joining the frame 22x to the board body 12 to the first piece 32 of the connection member 30x. Solder also adheres to the raised portion 22k, the solder becomes excessive, the solder becomes spherical after reflow, and the joint between the frame 20x and the substrate body 12 becomes weak. As shown in FIG. 21 (a), which is a plan view of the main part viewed along line AA in the cross-sectional view of FIG. 21 (b), the protruding portion slightly protrudes from the first piece 32x of the connection member, or Conversely, as shown in the perspective view of FIG. 22, the width of the raised portion 22k is slightly smaller than the width of the connecting member 30x, and the side surface 22n of the raised portion 22k is slightly retracted inward from the first piece 32 of the connecting member 30x. If this is the case, such a problem will not occur.

  As shown in the cross-sectional view of FIG. 23, after mounting the frame body 20x on the one main surface 12b of the substrate body 12, when mounting the surface-mounted components 56 to 59 on the one main surface 12b of the substrate body 12, It is necessary to secure a space so that the mounter nozzle holding the surface-mounted components 56 to 59 does not interfere with the frame body 20. That is, the gap D between the frame 20 and the surface-mounted components 56 and 59 cannot be reduced.

  On the other hand, when the surface mount type components 56 to 59 are first mounted on the one main surface 12b of the substrate body 12 and the frame body 20 is mounted later, the frame body 20 and the surface mount type components 56 and 59 are mounted. Can be narrowed. This can be easily realized by supplying solder to the first piece 32x of the connection member 30x by a transfer method, and further downsizing of the frame body 20 and further downsizing of the composite substrate 10 are facilitated.

  Further, the connecting member 30x has a substantially L-shaped cross section along the raised portion 22k on the first piece 32x side. If the solder wets the portion extending in the substantially L-shaped cross section, the bonding reliability may be lowered. However, the raised portion 22k is applied to the inside of the portion extending in the substantially L-shaped cross section. The contact prevents the solder from getting wet. Therefore, it is possible to prevent a decrease in the bonding reliability between the frame body 20x and the substrate body 12.

  <Summary> As described above, the composite substrate has a simple configuration in which the second piece of the connecting member arranged on the frame member of the frame body is separated from the frame member, and the thermal stress and impact stress of the joint portion. Can be effectively mitigated.

  The present invention is not limited to the above-described embodiment, and can be implemented with various modifications.

  For example, the substrate body may be a substrate in which a plurality of terminals connected to the frame pair are provided on the same plane, and a concave portion or a convex portion is provided in a portion other than the flat portion to which the frame body is connected. It doesn't matter.

(A) Sectional drawing which shows the whole structure of a composite substrate, (b) It is sectional drawing which shows the state in which the composite substrate was connected to the external circuit board. (Example 1) It is a principal part expanded sectional view of a composite substrate. (Example 1) It is a top view immediately after resin molding. (Example 1) FIG. 4 is a cross-sectional view taken along line AA in FIG. 3. (Example 1) It is a principal part expanded sectional view of FIG. (Example 1) It is sectional drawing when cut | disconnecting a metal thin plate. (Example 1) It is sectional drawing of the frame immediately after cut | disconnecting a metal thin plate. (Example 1) It is a principal part expanded sectional view of the completed frame. (Example 1) (A) Sectional drawing which shows the whole structure of a composite substrate, (b) It is sectional drawing which shows the state in which the composite substrate was connected to the external circuit board. (Modification of Example 1) (A) Sectional drawing which shows the whole structure of a composite substrate, (b) It is sectional drawing which shows the state in which the composite substrate was connected to the external circuit board. (Example 2) (A) Sectional drawing which shows the whole structure of a composite substrate, (b) It is sectional drawing which shows the state in which the composite substrate was connected to the external circuit board. (Example 3) It is (a) top view and (b) sectional drawing of a frame. (Example 3) It is a principal part expanded sectional view of a frame. (Example 3) It is sectional drawing which shows the whole structure of a composite substrate. (Modification of Example 3) It is (a) top view and (b) sectional drawing of a frame. (Modification of Example 3) 15A is a cross-sectional view taken along line AA in FIG. 15, FIG. 15B is a cross-sectional view taken along line BB in FIG. 15, and FIG. 15C is cut along line CC in FIG. FIG. 6 is a cross-sectional view (modified example of Example 3) (A) Main part enlarged sectional view of FIG. 16, (b) Main part enlarged sectional view of FIG. 16, (c) Main part enlarged sectional view of FIG. 16 (modified example of Example 3) (A) Sectional drawing which shows the whole structure of a composite substrate, (b) It is sectional drawing which shows the state in which the composite substrate was connected to the external circuit board. Example 4 It is (a) top view and (b)-(d) sectional drawing of a frame. Example 4 It is a principal part expanded sectional view of a frame. Example 4 It is the (a) principal part top view of a frame, (b) principal part sectional drawing. Example 4 It is a principal part perspective view of a frame. Example 4 It is sectional drawing which shows the state in which the composite substrate was connected to the external circuit board. (Modification of Example 4) It is a perspective view of a frame. (Conventional example 1) It is principal part sectional drawing of a frame. (Conventional example 1) It is sectional drawing of a chip package. (Conventional example 2)

Explanation of symbols

10, 10a, 10b, 10s, 10t, 10x Composite substrate 12, 12t Substrate body 12a Other main surface 12b One main surface 18 Terminal 20 Frame body 22 Frame member 23 Through hole 30 Connection member 32 First piece 34 Intermediate piece 36 Second Piece 40, 42, 50, 55 chip-shaped electronic component

Claims (14)

A substrate body having terminals on at least one main surface;
A frame joined to the one main surface of the substrate body;
A composite substrate comprising:
The frame is
A frame member made of an insulating material, having a through hole in the center, and extending in a frame shape along a peripheral edge portion of the one main surface of the substrate body;
A plurality of connecting members formed by bending a thin metal plate, each having a first piece and a second piece continuous at both ends of the intermediate piece,
Have
The plurality of connecting members are:
Arranged in the frame member,
The first piece is exposed to the substrate body side of the frame member and joined to the terminal on the one main surface of the substrate body,
The second piece is exposed on a side of the frame member opposite to the substrate body;
At least one of the first piece or the second piece is movable away from the frame member.   2. The composite member according to claim 1, wherein the first piece of the connection member is embedded in the frame member at a portion opposite to the intermediate piece. The intermediate piece of the connecting member is
Arranged along the inner surface of the through hole of the frame member,
Only the intermediate part between the first one side and the second one side is fixed to the frame member,
2. The composite substrate according to claim 1, wherein both end portions of the first piece side and the second piece side of the intermediate piece can be contacted and separated from the inner surface of the through hole of the frame member. A protrusion is provided on a surface of the frame member facing the one main surface of the substrate body,
2. The composite substrate according to claim 1, wherein the first piece of the connection member extends along a surface of the protrusion that faces the one main surface of the substrate body.   5. The composite according to claim 1, wherein a chip-shaped electronic component is disposed in the through hole of the frame-shaped member and is mounted on the one main surface of the substrate body. substrate.   The composite substrate according to claim 5, wherein the chip-like electronic component is sealed with a resin, and the resin is bonded or abutted on a part of the frame. The connection member of the frame is formed by punching and bending a thin metal plate,
The composite substrate according to any one of claims 1 to 6, wherein the frame member of the frame body is a resin molded in a state where a portion to be the connection member is inserted into a mold. .   The composite substrate according to claim 1, wherein the substrate body is a ceramic substrate.   The composite substrate according to claim 1, wherein the substrate body is a ceramic multilayer substrate formed by laminating a plurality of ceramic layers sintered at 1050 ° C. or lower.   The composite substrate according to claim 7, wherein the metal thin plate of the connection member of the frame body is flexible.   The thickness of the said connection member is 50 micrometers or more and 300 micrometers or less, The composite substrate as described in any one of Claims 1-10 characterized by the above-mentioned.   The composite substrate according to claim 1, wherein a chip-like electronic component is mounted on the other main surface of the substrate body.   A composite part, wherein the second piece of the connection member of the composite board according to any one of claims 1 to 12 is joined to a terminal of the external circuit board. A first step of preparing a substrate body provided with terminals on at least one main surface and a frame;
A method of manufacturing a composite substrate, comprising: a second step of joining the frame body to the one main surface of the substrate body,
In the first step,
The frame is
A frame member made of an insulating material and having a through hole in the center;
A plurality of connecting members formed by bending a thin metal plate, each having a first piece and a second piece continuous at both ends of the intermediate piece,
Have
The plurality of connecting members are:
Arranged in the frame member,
The first piece and the second piece are respectively exposed on both main surfaces of the frame member extending around the through hole of the frame member;
The first piece and the second piece extend in a direction in which the connection member faces through the through hole of the frame member;
In the second step,
The frame body is arranged on the one main surface of the substrate body so that the frame member extends in a frame shape along a peripheral edge portion of the one main surface of the substrate body,
The method of manufacturing a composite substrate, wherein the first piece of the connection member of the frame body is joined to the terminal provided on the one main surface of the substrate body.

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