WO2013099360A1 - Module and component equipped with module - Google Patents

Module and component equipped with module Download PDF

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Publication number
WO2013099360A1
WO2013099360A1 PCT/JP2012/072553 JP2012072553W WO2013099360A1 WO 2013099360 A1 WO2013099360 A1 WO 2013099360A1 JP 2012072553 W JP2012072553 W JP 2012072553W WO 2013099360 A1 WO2013099360 A1 WO 2013099360A1
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WO
WIPO (PCT)
Prior art keywords
connection terminal
module
resin layer
wiring board
solder
Prior art date
Application number
PCT/JP2012/072553
Other languages
French (fr)
Japanese (ja)
Inventor
伸明 小川
陽一 高木
水白　雅章
福田　寛
明彦 鎌田
Original Assignee
株式会社村田製作所
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Publication date
Application filed by 株式会社村田製作所 filed Critical 株式会社村田製作所
Publication of WO2013099360A1 publication Critical patent/WO2013099360A1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49811—Additional leads joined to the metallisation on the insulating substrate, e.g. pins, bumps, wires, flat leads
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H01L23/3121—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
    • H01L23/5389—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates the chips being integrally enclosed by the interconnect and support structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/552—Protection against radiation, e.g. light or electromagnetic waves
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/153—Connection portion
    • H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/153—Connection portion
    • H01L2924/1532—Connection portion the connection portion being formed on the die mounting surface of the substrate
    • H01L2924/1533—Connection portion the connection portion being formed on the die mounting surface of the substrate the connection portion being formed both on the die mounting surface of the substrate and outside the die mounting surface of the substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/191—Disposition
    • H01L2924/19101—Disposition of discrete passive components
    • H01L2924/19105—Disposition of discrete passive components in a side-by-side arrangement on a common die mounting substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/191—Disposition
    • H01L2924/19101—Disposition of discrete passive components
    • H01L2924/19106—Disposition of discrete passive components in a mirrored arrangement on two different side of a common die mounting substrate

Definitions

  • the present invention relates to a module using a plurality of connection terminals forming an interlayer connection conductor and a module mounting component including the module.
  • an IC chip 502 mounted on one main surface of a wiring substrate 501 (semiconductor substrate) and a passive component 503 such as a capacitor and a resistor are resin-sealed with a mold resin 504.
  • the module 500 is known (see, for example, Patent Document 1).
  • the module 500 has a post electrode 505 whose one end is connected to one main surface of the wiring substrate 501 and an external connection terminal 506 provided on the end surface of the other end of the post electrode 505 exposed from the mold resin 503. And.
  • the module 500 is mounted on an external mounting substrate in a state where it is mounted on, for example, an interposer substrate.
  • a wire made of a conductive material such as Au, Cu, or Al is formed on a wiring provided on one main surface of the wiring board 501 by a wire bonding method using heat and ultrasonic waves in combination. Connected to the position, a wire post is formed. Then, the post electrode 505 is formed in the module 500 by cutting the wire pillar formed on the wiring board 501 to a predetermined length using an electric torch or a laser.
  • the columnar connection terminals are mounted on the wiring provided on one main surface of the wiring board 501 by using a general surface mounting technique in which the IC chip 502 and the passive component 503 are surface-mounted on the wiring board 501 with solder.
  • An attempt is made to reduce the manufacturing cost of the module 500 by forming the post electrode 505. That is, the post electrodes 505 are formed by surface mounting the columnar connection terminals on the wiring board 501 using the same apparatus as the mounting apparatus for mounting the IC chip 502 and the passive component 503 on the wiring board 501 by soldering. Therefore, it is not necessary to separately prepare a device for mounting the IC chip 502 and the passive component 503 on the wiring substrate 501 and a device for forming the post electrode 505, and thus the manufacturing cost of the module 500 can be reduced. .
  • the following problems may occur. That is, for example, when the module 500 is mounted on an external mounting board by solder reflow, the solder that connects the post electrode 505 to the wiring board 501 is melted. The molten solder is the post electrode 505 and the mold resin 504. It moves to the side of the external connection terminal 506 provided on the end surface of the other end of the post electrode 505 through the gap at the boundary.
  • an external connection terminal 506 is provided on the end surface of the other end portion of the post electrode 505, and the molten solder that has moved through the gap between the post electrode 505 and the mold resin 504 has the external connection terminal 506. Since it is dammed up as a lid, it cannot move any further. Therefore, since the molten solder moves through the gap at the boundary between the wiring substrate 501 and the mold resin 504, the post electrode 505, another post electrode 505, the IC chip 502, the passive component 503, and the like that are disposed adjacent to each other. There was a risk of short circuit.
  • the present invention has been made in view of the above problems, and provides a highly reliable module at low cost by mounting columnar connection terminals on a wiring board to form interlayer connection conductors and external connection terminals. At the same time, it is an object to provide a module mounting component including this module.
  • the module of the present invention is a module in which an electronic component is mounted on at least one main surface of a wiring board, and one end thereof is connected to one main surface of the wiring board by solder.
  • a columnar connection terminal that is mounted to form an interlayer connection conductor, a first resin layer that is provided on one main surface of the wiring board so as to cover the electronic component and the connection terminal, and the other end of the connection terminal And an outer edge for external connection formed such that a boundary portion between the outer edge portion of the end surface and the first resin layer is exposed on the surface of the first resin layer facing the one main surface of the wiring board.
  • a connection terminal is provided (claim 1).
  • connection terminal may be plated (Claim 2).
  • connection terminal constituting the external connection terminal may be plated (Claim 3).
  • the plating may be gold plating (Claim 4).
  • bumps are formed on the external connection terminals (claim 5).
  • connection terminal is mounted by soldering one end of the connection terminal to a land electrode formed on the wiring board, and the solder has an end surface and an outer peripheral surface of the one end in a bowl shape. It may be formed so as to cover (Claim 6).
  • connection terminal may be formed such that the diameter of the one end is larger than the diameter of the other end (Claim 7).
  • connection terminal may be formed such that the diameter of the other end is larger than the diameter of the one end (Claim 8).
  • Another electronic component may be further mounted on the other main surface of the wiring board (claim 9).
  • the second main surface of the wiring board may further include a second resin layer provided so as to cover the other electronic component (claim 10).
  • connection terminal is further mounted on the other main surface of the wiring board, and an electronic component is further mounted on the second resin layer so as to be connected to the connection terminal mounted on the other main surface. (Claim 11).
  • the module mounting component of this invention is equipped with the module in any one of Claim 1 thru
  • the said external connection terminal connects to the said mounting board in the said module. (Claim 12).
  • the columnar connection terminal which is mounted together with the electronic component on one main surface of the wiring board and forms the interlayer connection conductor, has one end connected to the wiring board by solder and the other end The portion is exposed on a surface of the first resin layer that covers the electronic component and the connection terminal and that is provided on the one main surface of the wiring board, facing the one main surface of the wiring board.
  • An external connection terminal for external connection is formed by the end surface of the other end of the connection terminal exposed on the surface of the first resin layer and the boundary between the outer edge of the end surface and the first resin layer.
  • the module is mounted on the external mounting board.
  • the solder that connects the connection terminal to one main surface of the wiring board melts, and the molten solder travels through the gap at the boundary between the connection terminal and the first resin layer, and the other of the connection terminals.
  • the molten solder that has moved to the other end side of the connection terminal is the boundary between the outer edge of the end surface of the other end of the connection terminal that is open to the outside and the first resin layer. Discharged from. Therefore, when the molten solder moves through the gap at the interface between the wiring board and the first resin layer, it is possible to prevent adjacent electronic components and connection terminals from being short-circuited, that is, solder flash.
  • the interlayer connection conductor is formed by mounting one end portion of the columnar connection terminal by soldering to one main surface of the wiring board and mounting the electronic component on the wiring board. It can be mounted on a wiring board using a general surface mounting technique. Therefore, the columnar connection terminal is mounted on the wiring board to form the interlayer connection conductor, and the external connection terminal is formed by the other end of the connection terminal exposed on the surface of the first resin layer, so that the reliability is high. Modules can be provided at low cost.
  • connection terminal since the side surface of the connection terminal is plated, the wettability of the solder is improved, and the molten solder is easily moved along the side surface of the connection terminal. Since the discharge is further efficiently performed from the boundary portion between the outer edge portion of the other end portion of the connection terminal opened to the outside and the first resin layer, a more reliable module can be provided.
  • the molten solder discharged to the outside of the module is applied to the end surface of the other end portion of the connection terminal. Since it becomes easy to gather, it can prevent that the molten solder discharged
  • connection terminal is plated with gold, the wettability of the solder is very high, and the molten solder is more efficiently discharged from the inside of the module to the outside.
  • a highly reliable module can be provided.
  • the module since the bump is formed on the external connection terminal, the module can be easily mounted on another mounting board by melting the bump.
  • connection terminal is mounted by soldering one end of the connection terminal to the land electrode formed on the wiring board, and the solder is connected to the end surface of the one end of the connection terminal and The outer peripheral surface is formed in a bowl shape. Therefore, since the solder spreading in a hook shape outside the one end of the connection terminal is caught by the first resin layer, it is possible to prevent the connection terminal from falling off from the first resin layer.
  • connection terminal is formed in a wedge shape in the first resin layer so that the diameter of one end connected to the wiring board is larger than the diameter of the other end. Since the large-diameter portion of one end of the connection terminal connected to the wiring board is caught by the first resin layer, it is possible to reliably prevent the connection terminal from falling out of the first resin layer.
  • connection terminal is formed on the surface of the first resin layer so that the diameter of the other end part forming the external connection terminal is larger than the diameter of the one end part.
  • a large area external connection terminal can be formed on the surface of the first resin layer. Therefore, electrical connectivity and bonding strength when the module is mounted on an external mounting substrate or the like can be improved.
  • the ninth aspect of the present invention it is possible to provide a module in which the mounting density of electronic components is increased by further mounting other electronic components on the other main surface of the wiring board.
  • the second resin layer is provided on the other main surface of the wiring substrate so as to cover the other main component, the other electronic components mounted on the other main surface of the wiring substrate are It can be protected by the second resin layer.
  • connection terminal is further mounted on the other main surface of the wiring board, and the electronic component is connected to the second resin layer so as to be connected to the connection terminal mounted on the other main surface. Further, by mounting, it is possible to provide a practical module in which the mounting density of electronic components is further increased.
  • the twelfth aspect of the present invention it is possible to provide a module-mounted component having a practical configuration in which the external connection terminal of the module according to any of the first to eleventh aspects is connected to a mounting board.
  • FIG. 1 is a diagram showing a module according to the first embodiment of the present invention.
  • FIG. 2 is a diagram showing a module manufacturing method according to the first embodiment of the present invention, and (a) to (c) show different processes.
  • FIG. 3 is a diagram showing module mounting components according to the first embodiment of the present invention.
  • the module described in this embodiment is mounted on a mounting substrate included in a communication portable terminal such as a mobile phone or a portable information terminal, and various electronic components 102 are mounted on at least one main surface of the wiring substrate 101.
  • various communication modules such as a Bluetooth (registered trademark) module and a wireless LAN module, an antenna switch module, and a high-frequency circuit module such as a power supply module are formed.
  • the module 100 includes a wiring board 101 and an electronic component 102 mounted on one main surface of the wiring board 101.
  • the columnar connection terminals 11 are mounted on the land electrode 101a formed on one main surface of the wiring board 101 by joining and connecting one end of the land electrode 101a with solder S.
  • the connection terminal 11 forms an interlayer connection conductor of the module 100.
  • a first resin layer 103 is provided on one main surface of the wiring board 101 so as to cover the electronic component 102 and the connection terminal 11.
  • the end surface of the other end of the connection terminal 11 and the boundary between the outer edge of the end surface and the first resin layer 103 are in contact with one main surface of the wiring substrate 101 of the first resin layer 103.
  • An external connection terminal 11a for external connection formed to be exposed on the facing surface is provided.
  • Module manufacturing method A method of manufacturing the module 100 in which the columnar connection terminals 11 and the electronic components 102 forming the interlayer connection conductor are mounted on the wiring substrate 101 and sealed with resin will be described. 2A and 2B, the module 100 of FIG. 1 is shown upside down.
  • a plurality of columnar connection terminals 11 forming interlayer connection conductors of the module 100 and electronic components 102 such as various chip components and ICs are one main component of the wiring substrate 101. It is mounted by a general surface mounting technique using solder S at a predetermined position on the surface (mounting process).
  • the connection terminal 11 is mounted with one end thereof connected to a land electrode 101 a provided on the wiring substrate 101 by solder S.
  • the wiring substrate 101 is a multilayer ceramic substrate formed by laminating and firing a plurality of ceramic green sheets.
  • a ceramic green sheet is a sheet of slurry in which a mixed powder of alumina and glass is mixed with an organic binder and solvent, and via holes are formed at predetermined positions on the ceramic green sheet by laser processing or the like.
  • the formed via hole is filled with a conductor paste containing Ag, Cu or the like to form a via conductor for interlayer connection, and various electrode patterns are formed by printing with the conductor paste.
  • the ceramic green sheets are laminated and pressure-bonded to form a ceramic laminate, and the wiring substrate 101 is formed by so-called low-temperature firing at a low temperature of about 1000 ° C.
  • the wiring board 101 is provided with various electrode patterns such as the internal wiring pattern, the land electrode 101a on which the connection terminal 11 and the electronic component 102 are mounted, and the external connection electrode. It can be formed with printed circuit board, LTCC, alumina substrate, glass substrate, composite material substrate, single layer substrate, multilayer substrate, etc. using resin or polymer material, etc.
  • the wiring board 101 may be formed by selecting a suitable material.
  • connection terminal 11 can be made of Cu, an alloy in which Fe is mixed in a proportion of 0.1% to 20%, or a metal pin formed of a metal conductor such as Au, Ag, or Al.
  • the connection terminal Processing accuracy when 11 is cut or the like can be improved.
  • the connection terminal 11 is formed in a columnar shape or a polygonal column shape by shearing a metal conductor wire having a desired diameter and having a circular or polygonal cross-sectional shape with a predetermined length.
  • connection terminal 11 While improving the machinability, grindability, and polishing accuracy of the connection terminal 11, the wet state of the conductive bonding material such as solder or metal brazing to the connection terminal 11, or when the connection terminal 11 is plated. In order not to deteriorate the plating state, it is more preferable to employ a Cu—Fe alloy in which 1 to 10% Fe is added to Cu.
  • the first resin layer 103 is formed of a composite resin formed by mixing an inorganic filler such as aluminum oxide, silica (silicon dioxide), or titanium dioxide with a thermosetting resin such as an epoxy resin, a phenol resin, or a cyanate resin. can do.
  • an inorganic filler such as aluminum oxide, silica (silicon dioxide), or titanium dioxide
  • a thermosetting resin such as an epoxy resin, a phenol resin, or a cyanate resin. can do.
  • the first resin layer 103 is formed using a resin sheet obtained by molding and semi-curing a composite resin on a PET film, a spacer (mold) having a desired thickness is arranged around After covering the wiring board 101 with a resin sheet and heat-pressing the resin sheet so that the thickness of the resin becomes the thickness of the spacer, the wiring board 101 is heated in an oven to cure the resin.
  • One resin layer 103 can be formed.
  • the first resin layer 103 may be formed using a general molding technique for forming a resin layer, such as a potting technique using a liquid resin, a transfer molding technique, or a compression molding technique.
  • the surface of the first resin layer 103 and the other end of the connection terminal 11 are ground or polished by a roller blade or the like to remove unnecessary resin,
  • the surface of the first resin layer 103 is flattened, and the other end of the connection terminal 11 is exposed on the surface of the first resin layer 103 (polishing or grinding process).
  • the external connection terminal 11a for external connection is exposed by the end surface of the other end of the connection terminal 11 exposed on the surface of the first resin layer 103 and the boundary between the outer edge of the end surface and the first resin layer 103.
  • the formed module 100 is completed.
  • connection terminal 11 from one main surface of the wiring board 101 varies due to the influence of the thickness of the solder S that connects one end of the connection terminal 11 to the wiring board 101
  • the height of the connection terminal 11 from the wiring substrate 101 can be made uniform.
  • gold plating or nickel / gold plating may be applied to the other end portion of the connection terminal 11 exposed on the surface of the first resin layer 103.
  • the sealing step when the first resin layer 103 is formed so that the other end of each connection terminal 11 is exposed, the step of polishing or grinding the surface of the first resin layer 103 is not necessarily executed. You don't have to.
  • the modules 100 may be manufactured individually. However, after the assembly of a plurality of modules 100 is formed, the modules 100 may be manufactured by dividing them into individual modules 100. .
  • a terminal assembly in which a plurality of columnar connection terminals 11 forming interlayer connection conductors of the module 100 are supported on one main surface of a flat support (not shown) is mounted on the wiring board 101.
  • the plurality of connection terminals 11 may be mounted on the wiring board 101 at the same time.
  • a support layer made of an adhesive layer or an adhesive layer is provided on one surface of the support, and the connection terminal 11 is supported by this support layer.
  • the support may be formed of a plate member made of a magnetic material. If it does in this way, the connection terminal 11 can be easily supported by a support body by adsorb
  • connection terminals 11 may be mounted on the wiring board 101 by using a terminal assembly formed by inserting the columnar connection terminals 11 from the other end side at necessary positions.
  • the terminal assembly can be easily manufactured at low cost simply by inserting the columnar connection terminals 11 into the holes provided in the plate-like support. Further, by inserting the connection terminal 11 into a required hole among the plurality of holes provided in the support, a terminal assembly corresponding to the type of module can be formed. Therefore, since it is not necessary to design a support for each type of module, the manufacturing cost of the terminal assembly can be reduced.
  • a support body by forming a hole only in the required position of a resin board according to the design aspect of a module.
  • the support can be formed, for example, by injection molding using a resin or by forming a hole in a resin plate.
  • connection terminal 11 is stamped or etched to form a member in which the other end portions of the plurality of connection terminals 11 are connected to both sides of the connection portion.
  • the connection terminals 11 may be mounted on the wiring board using a terminal assembly formed by bending the connection terminals 11 on both sides.
  • the metal plate will be punched or etched to form an assembly in which a plurality of connecting terminals 11 are connected via connecting parts, and the connecting parts of connecting terminals 11 and connecting parts will be the same.
  • a terminal assembly can be easily formed at low cost simply by bending in the direction.
  • the terminal assembly is mounted after the terminal assembly is mounted on the wiring board 101.
  • a sealing step of filling one main surface of the wiring board 101 with resin may be performed.
  • a sealing step of filling one main surface of the wiring board 101 with resin may be performed.
  • the surface of the first resin layer 103 is polished.
  • the terminal assembly support may be removed by polishing or grinding the terminal assembly support together with the first resin layer 103.
  • the module mounting component 200 of this embodiment is mounted on a communication portable terminal such as a mobile phone or a portable information terminal, and includes a module 100 and a mounting substrate 201 on which the module 100 is mounted.
  • the module 100 is mounted on the mounting substrate 201 by connecting the external connection terminals 11a to the mounting electrodes 202 formed on the mounting substrate 201 using solder S.
  • the mounting board 201 can be formed of a printed board using a resin or a polymer material, LTCC, alumina-based board, glass board, composite material board, single layer board, multilayer board, etc.
  • the mounting substrate 201 may be formed by selecting an appropriate material as appropriate according to the purpose of use.
  • the columnar connection terminal 11 that is mounted together with the electronic component 102 on one main surface of the wiring board 101 and forms an interlayer connection conductor has one end thereof soldered to the wiring board 101.
  • the first resin layer 103 that is connected by S and whose other end covers the electronic component 102 and the connection terminal 11 and is provided on one main surface of the wiring substrate 101 is opposed to the one main surface of the wiring substrate 101. Is exposed.
  • the external connection terminal 11a for external connection is exposed by the end surface of the other end of the connection terminal 11 exposed on the surface of the first resin layer 103 and the boundary between the outer edge of the end surface and the first resin layer 103. Is formed.
  • the module 100 is, for example, When the module mounting component 200 shown in FIG. 3 is mounted on the mounting board 201 by solder reflow, the solder S connecting the connection terminal 11 to one main surface of the wiring board 101 is melted, and the molten solder S is connected to the connection terminal.
  • connection terminal 11 moves to the other end side of the connection terminal 11 through the gap between the side surface of the first resin layer 103 and the first resin layer 103, the molten solder S moved to the other end side of the connection terminal 11 It is discharged from the boundary part between the outer edge part of the end surface of the other end part of the open connection terminal 11 and the first resin layer 103. Therefore, when the melted solder S moves through a gap at the interface between the one main surface of the wiring substrate 101 and the first resin layer 103, the adjacent electronic component 102 and the connection terminal 11 are short-circuited, that is, the solder. Flash can be prevented.
  • the interlayer connection conductor of the module 100 is formed by connecting one end portion of the columnar connection terminal 11 to one main surface of the wiring board 101 by using solder S and mounting the connection terminal 11.
  • the electronic component 102 can be mounted on the wiring board 101 by using a general surface mounting technique for mounting the electronic component 102 on the wiring board 101. Accordingly, the columnar connection terminals 11 are mounted on the wiring substrate 101 to form interlayer connection conductors, and the external connection terminals 11 a are formed by the other end of the connection terminals 11 exposed on the surface of the first resin layer 103. Therefore, the highly reliable module 100 can be provided at a low cost.
  • the wettability of the end surface is improved, so that the molten solder S discharged to the outside of the module 100 is removed. Since it becomes easy to gather on the end surface of the other end portion of the connection terminal 11, it is possible to prevent the molten solder S discharged from the inside of the module 100 from spreading on the surface of the first resin layer 103.
  • the module mounting component 200 having a practical configuration. it can.
  • connection terminal 11 may be formed of a Cu—Fe alloy.
  • the Cu—Fe alloy has a linear expansion coefficient lower than that of Cu by adding Fe having a linear expansion coefficient of about 12 ppm / ° C., which is lower than Cu, to Cu having a linear expansion coefficient of about 17 ppm / ° C.
  • the connection terminal 11 made of the Cu—Fe alloy has a linear expansion coefficient of about 17 ppm / ° C.
  • the columnar connection terminals 11 formed of a Cu—Fe alloy are mounted on the wiring board 101 to form an interlayer connection conductor, whereby the wiring board 101 and the connection terminals 11 are thermally expanded when heated. Since the stress generated between the wiring board 101 and the connection terminal 11 can be suppressed, for example, the connection portion between the wiring board 101 and the connection terminal 11 can be prevented from being damaged, and the highly reliable module 101 can be prevented. Can be provided.
  • connection terminal 11 having a desired diameter and length
  • the Cu—Fe alloy is obtained by adding Fe to Cu. Since the hardness is higher than Cu and excellent in machinability and grindability, it is suppressed that a flash is formed at the cut end of the connection terminal 11 when the wire is cut and the connection terminal 11 is formed. Therefore, the columnar connection terminal 11 having a very high precision shape can be prepared.
  • the electronic component 102 is mounted on one main surface of the wiring board 101 and the connection terminal 11 is mounted so that one end of the connection terminal 11 is connected to the wiring board 101.
  • the electronic component 102 and the connection terminal 11 mounted on are sealed with the first resin layer 103.
  • the other end portion of the first resin layer 103 and the connection terminal 11 is polished or ground, so that the other end portion of the connection terminal 11 is exposed on the surface of the first resin layer 103, but the connection terminal 11 is formed. Since the Cu—Fe alloy has high hardness and is excellent in machinability and grindability, it is suppressed that a flash is formed at the other end when the other end of the connection terminal 11 is polished or ground. .
  • each connection terminal 11 is exposed on the surface of the first resin layer 103 and functions as the external connection terminal 11a of the module 100, but the connection terminal 11 exposed on the surface of the first resin layer 103 is exposed. Since the connection terminals 11 are prevented from being short-circuited by the flash formed at the other end, the columnar connection terminals 11 formed of a Cu—Fe alloy are mounted on the wiring board 101 to form an interlayer connection conductor. Thus, the module 100 with high reliability can be provided.
  • connection terminal 11 is formed of a Cu—Fe alloy, it is possible to suppress the formation of flash at the other end of the connection terminal 11 in the polishing or grinding process. 11 is prevented from being short-circuited, the distance between the plurality of connection terminals 11 mounted on the wiring board 101 can be reduced, and each connection terminal 11 is mounted close to the wiring board 101 and mounted between the terminals. Thus, the module 100 can be provided with a reduced size. In addition, since the plurality of connection terminals 11 can be mounted close to the wiring substrate 101, the degree of freedom in designing the module 100 can be increased.
  • the surface of the first resin layer 103 can be flattened by grinding or polishing after the sealing step, and the height of the module 100 can be reduced.
  • the external connection is formed on the surface of the first resin layer 103 by the other end of the connection terminal 11.
  • the terminal 11a can be easily formed.
  • connection terminals 11 having side surfaces plated with 11b are mounted on the wiring board 101.
  • the plating 11b is given to the side surface of the connection terminal 11, the wettability of the solder S will improve and it will become easy for the molten solder S to move along the side surface of the connection terminal 11, and it was fuse
  • the first resin layer 103 is ground or polished in the process described with reference to FIG.
  • the plating 11b applied to the end surface of the other end of the connection terminal 11 is removed, the other end is ground or polished and exposed to the surface of the first resin layer 103, and then exposed.
  • Plating may be applied to the end face of the other end of the connection terminal.
  • solder S nickel / gold plating, tin plating, or the like can be performed as the plating on the connection terminal 11, but the wettability of the solder S is extremely high by applying the gold plating in particular, and the molten solder Since it is more efficiently discharged from the inside of the module to the outside, the module 100 with higher reliability can be provided.
  • the bump B is formed on the external connection terminal 11a, by melting the bump B, the module B becomes like the mounting substrate 201 of the module mounting component 200 shown in FIG. It can be easily mounted on an external substrate.
  • the bump B can be formed by, for example, solder. Further, the bump B may be formed on the external connection terminal 11a of the module 100a described with reference to FIG.
  • FIG. 6 is a diagram showing a module according to the second embodiment of the present invention.
  • the module according to this embodiment is different from the first embodiment described above in that another electronic component 102 is further mounted on the other main surface of the wiring board 101 of the module 100c as shown in FIG. is there. Since other configurations are the same as those in the first embodiment, description of the configuration is omitted by giving the same reference numerals.
  • the mounting density of the electronic component 102 mounted on the module 100a can be increased, and the mounting density of the electronic component 102 is increased.
  • a module 100a having a typical configuration can be provided.
  • FIG. 7 is a diagram showing a module according to the third embodiment of the present invention.
  • the module according to this embodiment differs from the second embodiment described above in that the electronic component 102 mounted on the other main surface of the wiring board 101 of the module 100d covers the electronic component 102 as shown in FIG.
  • the second resin layer 104 is sealed by the second resin layer 104. Since other configurations are the same as those in the first and second embodiments described above, the description of the configurations is omitted by giving the same reference numerals.
  • the electronic component 102 is mounted on the other main surface of the wiring board 101, and the electronic component 102 mounted on the other main surface of the wiring board 101 is the second resin layer 104. Since the mounting density of the electronic components 102 mounted on the module 100d can be increased by sealing with the above, it is practical.
  • the second resin layer 104 is provided so as to cover the other main surface of the wiring substrate 101 with the electronic component 102, the electronic component 102 mounted on the other main surface of the wiring substrate 101 is formed by the second resin layer 104. Can be protected.
  • FIG. 8 is a diagram showing a module according to the fourth embodiment of the present invention.
  • the module according to this embodiment is different from the third embodiment described above, as shown in FIG. 8, in which the metal shield layer 105 is formed on the second resin layer 104 provided on the other main surface of the wiring substrate 101 of the module 100e. Is a point provided. Since other configurations are the same as those in the first to third embodiments, description thereof will be omitted by assigning the same reference numerals. Note that the metal shield layer 105 is preferably electrically connected to the GND wiring provided on the wiring board 101.
  • the metal shield layer 105 is provided in the 2nd resin layer 104, it is prevented especially that a noise propagates from the exterior to the electronic component 102 sealed by the 2nd resin layer 104. At the same time, electromagnetic waves and the like can be prevented from being radiated from the electronic component 102 sealed in the second resin layer 104.
  • FIG. 9 is a diagram showing a module according to the fifth embodiment of the present invention.
  • the module according to this embodiment differs from the third embodiment described with reference to FIG. 7 in that the terminal assembly 10 is mounted on the other main surface of the wiring board 101 of the module 100f as shown in FIG. Thus, an interlayer connection conductor by the connection terminal 11 is provided on the second resin layer 104.
  • an electronic component 102 is further mounted on the second resin layer 104 so as to be connected to the interlayer connection conductor formed by the connection terminals 11 provided on the second resin layer 104. Since other configurations are the same as those in the first to fourth embodiments described above, description of the configurations is omitted by giving the same reference numerals.
  • connection terminal 11 is further mounted on the other main surface of the wiring substrate 101, whereby an interlayer connection conductor using the connection terminal 11 can be formed on the second resin layer 104. Further, since the electronic component 102 is further mounted on the second resin layer 104 so as to be connected to the connection terminal 11 provided on the second resin layer 104, the mounting density of the electronic component 102 mounted on the module 100d Is practical because it can be further increased.
  • the end surface of the other end of the connection terminal 11 mounted on the other main surface of the wiring substrate 101 and exposed on the surface of the second resin layer 104 is the other end of the connection terminal 11 provided on the first resin layer 103.
  • the same configuration as that of the end surface of the part may be used, and in this way, the same effect as that of the first embodiment described above can be obtained also on the other main surface side of the wiring substrate 101.
  • FIGS. 10 (a) to 10 (c) are enlarged views of main parts, and the same components as those in the first to fifth embodiments are denoted by the same reference numerals, and the description of the components is omitted.
  • the modification example of the connection terminal described below can achieve the same effect regardless of whether it is mounted on one of the main surface and the other main surface of the wiring board 101. Only the case where it is mounted on one main surface of the wiring board 101 will be described.
  • a land electrode 101b having a larger area than the cross-sectional area of the connection terminal 11 is provided on one main surface of the wiring board 101.
  • the connection terminal 11 is connected to the land electrode 101b by solder S.
  • the solder S spreads over the entire land electrode 101b having a larger area than the cross-sectional area of the connection terminal 11, and spreads over the entire land electrode 101b, whereby the end surface and the outer periphery of one end of the connection terminal 11 are spread. Since the solder S formed so as to cover the surface like a bowl is caught by the first resin layer 103, it is possible to prevent the solder S from falling off from the first resin layer 103 of the connection terminal 11.
  • a bonding agent S such as solder may be disposed between the connection terminal 11 and the mounting electrode 101b.
  • connection terminal 11c is formed in a tapered shape by forming the diameter of one end portion larger than the diameter of the other end portion.
  • a land electrode 101b having a larger area than the cross-sectional area of the connection terminal 11c on the large diameter side is provided on one main surface of the wiring board 101. Then, one end portion on the large diameter side of the connection terminal 11c is mounted on the land electrode 101b with solder S.
  • connection terminal 11c is provided in a wedge shape in the 1st resin layer 103, while the large diameter part of the connection terminal 11c is hooked on the 1st resin layer 103, the cross-sectional area of the large diameter side of the connection terminal 11c Since the solder S formed so as to cover the end surface and the outer peripheral surface of one end portion of the connection terminal 11c in a bowl shape by being spread over the land electrode 101b having a larger area than the land electrode 101b, the connection terminal 11c becomes the first terminal. It is possible to reliably prevent the resin layer 103 from falling off.
  • a bonding agent S such as solder may be disposed between the connection terminal 11c and the mounting electrode 101b.
  • the area of the mounting electrode 101b may be equal to the cross-sectional area on the large diameter side of the connection terminal 11c.
  • connection terminal 11d is formed in a tapered shape by forming the diameter of the other end portion larger than the diameter of the one end portion.
  • a land electrode 101b having a larger area than the cross-sectional area of one end portion on the small diameter side of the connection terminal 11d is provided on one main surface of the wiring board 101.
  • the small diameter side of the connection terminal 11d is mounted on the land electrode 101b with solder S.
  • solder S formed so as to cover the end surface and the outer peripheral surface of one end of the connection terminal 11d in a bowl shape by spreading over the entire land electrode 101b having a larger area than the cross-sectional area of the connection terminal 11d on the small diameter side. Since S is caught on the resin layer 103, the connection terminal 11d can be prevented from coming off from the resin layer 103.
  • a bonding agent S such as solder may be disposed between the connection terminal 11d and the mounting electrode 101b.
  • connection terminal 11d is exposed on the surface of the first resin layer 103, so that the land-shaped external connection terminal 11a having a large area can be easily formed in the module. Can be improved in electrical connectivity and bonding strength when mounted on a mother board or the like.
  • the present invention can be widely applied to a technique for forming an interlayer connection conductor of a module by mounting columnar connection terminals on the circuit board of the module using surface mounting technology, and various electronic components can be applied to the wiring board. By mounting, modules having various functions can be configured.

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Abstract

A highly reliable module is provided at a low cost by mounting a pillar connection terminal on a circuit board and forming an interlayer connection conductor and an external connection terminal. For example, even when a solder (S) is heated and melted during a reflow process, the melted solder (S) is drained in accordance with the increase of pressure inside a module (100) for the melted solder (S), through the boundary section between the outer edge of the end face of another end of a connection terminal (11) which is opened to the outside and a first resin layer (10) prior to the generation of solder flush, and thus preventing solder flush due to the melted solder (S) from being generated. Therefore, the interlayer connection conductor is formed by mounting the pillar connection terminal (11) on the circuit board (101) in accordance with a general surface mount technology using the solder (S). An external connection terminal (11a) is formed by another terminal of the connection terminal (11), which is exposed on the surface of the first resin layer (103), whereby the reliable module (100) can be provided at a low cost.

Description

モジュールおよびこれを備えるモジュール搭載部品Module and module mounting component including the same
　本発明は、層間接続導体を形成する複数の接続端子を用いたモジュールおよびこれを備えるモジュール搭載部品に関する。 The present invention relates to a module using a plurality of connection terminals forming an interlayer connection conductor and a module mounting component including the module.
　図１１の従来のモジュールの一例に示すように、配線基板５０１（半導体基板）の一方主面に実装されたＩＣチップ５０２や、コンデンサ、抵抗等の受動部品５０３がモールド樹脂５０４で樹脂封止されたモジュール５００が知られている（例えば特許文献１参照）。また、モジュール５００は、その一方端部が配線基板５０１の一方主面に接続されたポスト電極５０５と、モールド樹脂５０３から露出したポスト電極５０５の他方端部の端面に設けられた外部接続端子５０６とを備えている。そして、モジュール５００は、例えばインターポーザ基板に搭載された状態で外部の実装基板に実装される。 As shown in an example of a conventional module in FIG. 11, an IC chip 502 mounted on one main surface of a wiring substrate 501 (semiconductor substrate) and a passive component 503 such as a capacitor and a resistor are resin-sealed with a mold resin 504. The module 500 is known (see, for example, Patent Document 1). The module 500 has a post electrode 505 whose one end is connected to one main surface of the wiring substrate 501 and an external connection terminal 506 provided on the end surface of the other end of the post electrode 505 exposed from the mold resin 503. And. The module 500 is mounted on an external mounting substrate in a state where it is mounted on, for example, an interposer substrate.
　このようなモジュール５００では、ＡｕやＣｕ、Ａｌなどの導電性材料から成るワイヤが、例えば熱および超音波が併用されたワイヤボンディング法により配線基板５０１の一方主面に設けられた配線上の所定位置に接続されてワイヤ柱が形成される。そして、電気トーチやレーザが用いられて、配線基板５０１に形成されたワイヤ柱が所定の長さに切断されることにより、ポスト電極５０５がモジュール５００に形成される。 In such a module 500, a wire made of a conductive material such as Au, Cu, or Al is formed on a wiring provided on one main surface of the wiring board 501 by a wire bonding method using heat and ultrasonic waves in combination. Connected to the position, a wire post is formed. Then, the post electrode 505 is formed in the module 500 by cutting the wire pillar formed on the wiring board 501 to a predetermined length using an electric torch or a laser.
特開２００４－７１９６１号公報（段落００２３～００４２、図１など）Japanese Unexamined Patent Publication No. 2004-71961 (paragraphs 0023 to 0042, FIG. 1, etc.)
　ところで、ＩＣチップ５０２や受動部品５０３を配線基板５０１上にはんだにより表面実装する一般的な表面実装技術を用いて、柱状の接続端子を配線基板５０１の一方主面に設けられた配線上に実装してポスト電極５０５を形成することにより、モジュール５００の製造コストの低減を図る試みが為されている。すなわち、ＩＣチップ５０２や受動部品５０３を配線基板５０１上にはんだにより表面実装する実装装置と同じ装置を用いて、柱状の接続端子を配線基板５０１上に表面実装してポスト電極５０５を形成することにより、ＩＣチップ５０２や受動部品５０３を配線基板５０１上に実装する装置と、ポスト電極５０５を形成する装置とを個別に用意する必要が無いので、モジュール５００の製造コストの低減を図ることができる。 By the way, the columnar connection terminals are mounted on the wiring provided on one main surface of the wiring board 501 by using a general surface mounting technique in which the IC chip 502 and the passive component 503 are surface-mounted on the wiring board 501 with solder. An attempt is made to reduce the manufacturing cost of the module 500 by forming the post electrode 505. That is, the post electrodes 505 are formed by surface mounting the columnar connection terminals on the wiring board 501 using the same apparatus as the mounting apparatus for mounting the IC chip 502 and the passive component 503 on the wiring board 501 by soldering. Therefore, it is not necessary to separately prepare a device for mounting the IC chip 502 and the passive component 503 on the wiring substrate 501 and a device for forming the post electrode 505, and thus the manufacturing cost of the module 500 can be reduced. .
　ところが、この場合、次のような問題が生じるおそれがあった。すなわち、例えば、モジュール５００が外部の実装基板にはんだリフローにより実装されるときに、ポスト電極５０５を配線基板５０１に接続するはんだが溶融するが、溶融したはんだは、ポスト電極５０５とモールド樹脂５０４との境界の隙間を伝ってポスト電極５０５の他方端部の端面に設けられた外部接続端子５０６側に移動する。 However, in this case, the following problems may occur. That is, for example, when the module 500 is mounted on an external mounting board by solder reflow, the solder that connects the post electrode 505 to the wiring board 501 is melted. The molten solder is the post electrode 505 and the mold resin 504. It moves to the side of the external connection terminal 506 provided on the end surface of the other end of the post electrode 505 through the gap at the boundary.
　このとき、ポスト電極５０５の他方端部の端面には外部接続端子５０６が設けられており、ポスト電極５０５とモールド樹脂５０４との境界の隙間を伝って移動した溶融はんだは、外部接続端子５０６が蓋となって堰き止められるため、それ以上移動することができない。したがって、溶融したはんだは、配線基板５０１とモールド樹脂５０４との境界の隙間を伝って移動するため、ポスト電極５０５と、隣接配置されている他のポスト電極５０５やＩＣチップ５０２、受動部品５０３などとが短絡するおそれがあった。 At this time, an external connection terminal 506 is provided on the end surface of the other end portion of the post electrode 505, and the molten solder that has moved through the gap between the post electrode 505 and the mold resin 504 has the external connection terminal 506. Since it is dammed up as a lid, it cannot move any further. Therefore, since the molten solder moves through the gap at the boundary between the wiring substrate 501 and the mold resin 504, the post electrode 505, another post electrode 505, the IC chip 502, the passive component 503, and the like that are disposed adjacent to each other. There was a risk of short circuit.
　この発明は、上記した課題に鑑みてなされたものであり、柱状の接続端子を配線基板に実装して層間接続導体および外部接続端子を形成することにより信頼性の高いモジュールを低コストで提供すると共に、このモジュールを備えるモジュール搭載部品を提供することを目的とする。 The present invention has been made in view of the above problems, and provides a highly reliable module at low cost by mounting columnar connection terminals on a wiring board to form interlayer connection conductors and external connection terminals. At the same time, it is an object to provide a module mounting component including this module.
　上記した目的を達成するために、本発明のモジュールは、配線基板の少なくとも一方主面に電子部品が実装されたモジュールにおいて、その一方端部が前記配線基板の一方主面にはんだにより接続されて実装されて層間接続導体を形成する柱状の接続端子と、前記配線基板の一方主面に前記電子部品および前記接続端子を被覆して設けられた第１樹脂層と、前記接続端子の他方端部の端面および、該端面の外縁部と前記第１樹脂層との境界部が、前記第１樹脂層の前記配線基板の一方主面との対向面に露出して形成された外部接続用の外部接続端子と備えていることを特徴としている（請求項１）。 In order to achieve the above object, the module of the present invention is a module in which an electronic component is mounted on at least one main surface of a wiring board, and one end thereof is connected to one main surface of the wiring board by solder. A columnar connection terminal that is mounted to form an interlayer connection conductor, a first resin layer that is provided on one main surface of the wiring board so as to cover the electronic component and the connection terminal, and the other end of the connection terminal And an outer edge for external connection formed such that a boundary portion between the outer edge portion of the end surface and the first resin layer is exposed on the surface of the first resin layer facing the one main surface of the wiring board. A connection terminal is provided (claim 1).
　また、前記接続端子の側面にめっきが施されていてもよい（請求項２）。 Moreover, the side surface of the connection terminal may be plated (Claim 2).
　また、前記外部接続端子を成す前記接続端子の他方端部の端面にめっきが施されていてもよい（請求項３）。 Further, the end surface of the other end of the connection terminal constituting the external connection terminal may be plated (Claim 3).
　また、前記めっきは金めっきであるとよい（請求項４）。 Further, the plating may be gold plating (Claim 4).
　また、前記外部接続端子にバンプが形成されているとよい（請求項５）。 Further, it is preferable that bumps are formed on the external connection terminals (claim 5).
　また、前記接続端子は、前記一方端部が前記配線基板上に形成されたランド電極にはんだにより接合されて実装されており、前記はんだは、前記一方端部の端面および外周面を鍔状に覆って形成されているとよい（請求項６）。 The connection terminal is mounted by soldering one end of the connection terminal to a land electrode formed on the wiring board, and the solder has an end surface and an outer peripheral surface of the one end in a bowl shape. It may be formed so as to cover (Claim 6).
　また、前記接続端子は、前記一方端部の径が前記他方端部の径よりも大径に形成されているとよい（請求項７）。 Further, the connection terminal may be formed such that the diameter of the one end is larger than the diameter of the other end (Claim 7).
　また、前記接続端子は、前記他方端部の径が前記一方端部の径よりも大径に形成されているとよい（請求項８）。 Further, the connection terminal may be formed such that the diameter of the other end is larger than the diameter of the one end (Claim 8).
　また、前記配線基板の他方主面に他の電子部品がさらに実装されているとよい（請求項９）。 Further, another electronic component may be further mounted on the other main surface of the wiring board (claim 9).
　また、前記配線基板の他方主面に前記他の電子部品を被覆して設けられた第２樹脂層をさらに備えていてもよい（請求項１０）。 The second main surface of the wiring board may further include a second resin layer provided so as to cover the other electronic component (claim 10).
　また、前記配線基板の他方主面に前記接続端子がさらに実装されており、前記第２樹脂層に、前記他方主面に実装された前記接続端子に接続されるように、電子部品がさらに実装されているとよい（請求項１１）。 The connection terminal is further mounted on the other main surface of the wiring board, and an electronic component is further mounted on the second resin layer so as to be connected to the connection terminal mounted on the other main surface. (Claim 11).
　また、本発明のモジュール搭載部品は、請求項１ないし１１のいずれかに記載のモジュールと、前記モジュールが実装される実装基板とを備え、前記モジュールは、前記外部接続端子が前記実装基板に接続されていることを特徴としている（請求項１２）。 Moreover, the module mounting component of this invention is equipped with the module in any one of Claim 1 thru | or 11, and the mounting board in which the said module is mounted, The said external connection terminal connects to the said mounting board in the said module. (Claim 12).
　請求項１の発明によれば、配線基板の一方主面に電子部品と共に実装されて、層間接続導体を形成する柱状の接続端子は、その一方端部が配線基板にはんだにより接続され、他方端部が、電子部品および接続端子を被覆して配線基板の一方主面に設けられた第１樹脂層の、配線基板の一方主面との対向面に露出している。そして、第１樹脂層の表面に露出した、接続端子の他方端部の端面および、該端面の外縁部と第１樹脂層との境界部により、外部接続用の外部接続端子が形成されている。 According to the first aspect of the present invention, the columnar connection terminal, which is mounted together with the electronic component on one main surface of the wiring board and forms the interlayer connection conductor, has one end connected to the wiring board by solder and the other end The portion is exposed on a surface of the first resin layer that covers the electronic component and the connection terminal and that is provided on the one main surface of the wiring board, facing the one main surface of the wiring board. An external connection terminal for external connection is formed by the end surface of the other end of the connection terminal exposed on the surface of the first resin layer and the boundary between the outer edge of the end surface and the first resin layer. .
　したがって、接続端子の他方端部の端面の外縁部と第１樹脂層との境界部が第１樹脂層の表面に露出して外部に開放されているため、例えば、モジュールが外部の実装基板にはんだリフローにより実装されるときに、接続端子を配線基板の一方主面に接続するはんだが溶融し、溶融したはんだが、接続端子と第１樹脂層との境界の隙間を伝って接続端子の他方端部側に移動した場合には、接続端子の他方端部側に移動した溶融はんだは、外部に開放されている接続端子の他方端部の端面の外縁部と第１樹脂層との境界部から排出される。したがって、溶融したはんだが、配線基板と第１樹脂層との界面の隙間を伝って移動することにより、隣接する電子部品や接続端子が短絡すること、すなわちはんだフラッシュを防止することができる。 Therefore, since the boundary part between the outer edge part of the end surface of the other end part of the connection terminal and the first resin layer is exposed to the surface of the first resin layer and opened to the outside, for example, the module is mounted on the external mounting board. When mounting by solder reflow, the solder that connects the connection terminal to one main surface of the wiring board melts, and the molten solder travels through the gap at the boundary between the connection terminal and the first resin layer, and the other of the connection terminals. When moved to the end side, the molten solder that has moved to the other end side of the connection terminal is the boundary between the outer edge of the end surface of the other end of the connection terminal that is open to the outside and the first resin layer. Discharged from. Therefore, when the molten solder moves through the gap at the interface between the wiring board and the first resin layer, it is possible to prevent adjacent electronic components and connection terminals from being short-circuited, that is, solder flash.
　また、層間接続導体は、柱状の接続端子の一方端部が配線基板の一方主面にはんだにより接続されて実装されることにより形成されており、接続端子は、電子部品を配線基板に実装する一般的な表面実装技術を用いて配線基板に実装することができる。したがって、柱状の接続端子が配線基板に実装されて層間接続導体が形成され、第１樹脂層の表面に露出した接続端子の他方端部により外部接続端子が形成されることで、信頼性の高いモジュールを低コストで提供することができる。 The interlayer connection conductor is formed by mounting one end portion of the columnar connection terminal by soldering to one main surface of the wiring board and mounting the electronic component on the wiring board. It can be mounted on a wiring board using a general surface mounting technique. Therefore, the columnar connection terminal is mounted on the wiring board to form the interlayer connection conductor, and the external connection terminal is formed by the other end of the connection terminal exposed on the surface of the first resin layer, so that the reliability is high. Modules can be provided at low cost.
　請求項２の発明によれば、接続端子の側面にめっきが施されているため、はんだの濡れ性が向上し、溶融したはんだが接続端子の側面を伝って移動し易くなり、溶融したはんだが、外部に開放されている接続端子の他方端部の端面の外縁部と第１樹脂層との境界部からより一層効率よく排出されるので、より信頼性の高いモジュールを提供することができる。 According to the invention of claim 2, since the side surface of the connection terminal is plated, the wettability of the solder is improved, and the molten solder is easily moved along the side surface of the connection terminal. Since the discharge is further efficiently performed from the boundary portion between the outer edge portion of the other end portion of the connection terminal opened to the outside and the first resin layer, a more reliable module can be provided.
　請求項３の発明によれば、外部接続端子を成す接続端子の他方端部の端面にめっきが施されているため、モジュールの外部に排出された溶融はんだが接続端子の他方端部の端面に集まり易くなるので、モジュール内から外部に排出された溶融はんだが、第１樹脂層の表面に広がるのを防止することができる。 According to the invention of claim 3, since the end surface of the other end portion of the connection terminal constituting the external connection terminal is plated, the molten solder discharged to the outside of the module is applied to the end surface of the other end portion of the connection terminal. Since it becomes easy to gather, it can prevent that the molten solder discharged | emitted outside from the inside of a module spreads on the surface of a 1st resin layer.
　請求項４の発明によれば、接続端子へのめっきが金により施されているため、はんだの濡れ性が非常に高く、溶融したはんだがモジュール内から外部にさらに効率よく排出されるので、より信頼性の高いモジュールを提供することができる。 According to the invention of claim 4, since the connection terminal is plated with gold, the wettability of the solder is very high, and the molten solder is more efficiently discharged from the inside of the module to the outside. A highly reliable module can be provided.
　請求項５の発明によれば、外部接続端子にバンプが形成されているので、バンプを溶融させることにより、モジュールを他の実装基板に容易に実装することができる。 According to the invention of claim 5, since the bump is formed on the external connection terminal, the module can be easily mounted on another mounting board by melting the bump.
　請求項６の発明によれば、接続端子は、その一方端部が配線基板上に形成されたランド電極にはんだにより接合されて実装されており、はんだは、接続端子の一方端部の端面および外周面を鍔状に覆って形成されている。したがって、接続端子の一方端部の外側に鍔状に広がったはんだが第１樹脂層に引っ掛かるので、接続端子が第１樹脂層からの抜け落ちるのを防止することができる。 According to the invention of claim 6, the connection terminal is mounted by soldering one end of the connection terminal to the land electrode formed on the wiring board, and the solder is connected to the end surface of the one end of the connection terminal and The outer peripheral surface is formed in a bowl shape. Therefore, since the solder spreading in a hook shape outside the one end of the connection terminal is caught by the first resin layer, it is possible to prevent the connection terminal from falling off from the first resin layer.
　請求項７の発明によれば、接続端子は、配線基板に接続される一方端部の径が他方端部の径よりも大径に形成されて、第１樹脂層に楔状に設けられており、配線基板に接続されている接続端子の一方端部の大径部分が第１樹脂層に引っ掛かるので、接続端子が第１樹脂層から抜け落ちるのを確実に防止することができる。 According to the invention of claim 7, the connection terminal is formed in a wedge shape in the first resin layer so that the diameter of one end connected to the wiring board is larger than the diameter of the other end. Since the large-diameter portion of one end of the connection terminal connected to the wiring board is caught by the first resin layer, it is possible to reliably prevent the connection terminal from falling out of the first resin layer.
　請求項８の発明によれば、接続端子は、第１樹脂層の表面に露出して外部接続端子を形成する他方端部の径が一方端部の径よりも大径に形成されているため、第１樹脂層の表面に大面積の外部接続端子を形成することができる。したがって、モジュールが外部の実装基板などに実装される際の電気的接続性および接合強度を向上することができる。 According to the invention of claim 8, the connection terminal is formed on the surface of the first resin layer so that the diameter of the other end part forming the external connection terminal is larger than the diameter of the one end part. A large area external connection terminal can be formed on the surface of the first resin layer. Therefore, electrical connectivity and bonding strength when the module is mounted on an external mounting substrate or the like can be improved.
　請求項９の発明によれば、配線基板の他方主面に他の電子部品がさらに実装されることにより、電子部品の実装密度が高められたモジュールを提供することができる。 According to the ninth aspect of the present invention, it is possible to provide a module in which the mounting density of electronic components is increased by further mounting other electronic components on the other main surface of the wiring board.
　請求項１０の発明によれば、配線基板の他方主面に他の電子部品を被覆して第２樹脂層が設けられているため、配線基板の他方主面に実装された他の電子部品を第２樹脂層により保護することができる。 According to the invention of claim 10, since the second resin layer is provided on the other main surface of the wiring substrate so as to cover the other main component, the other electronic components mounted on the other main surface of the wiring substrate are It can be protected by the second resin layer.
　請求項１１の発明によれば、配線基板の他方主面に接続端子がさらに実装されており、第２樹脂層に、他方主面に実装された接続端子に接続されるように、電子部品がさらに実装されることにより、電子部品の実装密度がさらに高められた実用的なモジュールを提供することができる。 According to the invention of claim 11, the connection terminal is further mounted on the other main surface of the wiring board, and the electronic component is connected to the second resin layer so as to be connected to the connection terminal mounted on the other main surface. Further, by mounting, it is possible to provide a practical module in which the mounting density of electronic components is further increased.
　請求項１２の発明によれば、請求項１ないし１１のいずれかに記載のモジュールの外部接続端子が実装基板に接続された実用的な構成のモジュール搭載部品を提供することができる。 According to the twelfth aspect of the present invention, it is possible to provide a module-mounted component having a practical configuration in which the external connection terminal of the module according to any of the first to eleventh aspects is connected to a mounting board.
本発明の第１実施形態にかかるモジュールを示す図である。It is a figure which shows the module concerning 1st Embodiment of this invention. 本発明の第１実施形態にかかるモジュールの製造方法を示す図である。It is a figure which shows the manufacturing method of the module concerning 1st Embodiment of this invention. 本発明の第１実施形態にかかるモジュール搭載部品を示す図である。It is a figure which shows the module mounting component concerning 1st Embodiment of this invention. モジュールの変形例を示す図である。It is a figure which shows the modification of a module. モジュールの変形例を示す図である。It is a figure which shows the modification of a module. 本発明の第２実施形態にかかるモジュールを示す図である。It is a figure which shows the module concerning 2nd Embodiment of this invention. 本発明の第３実施形態にかかるモジュールを示す図である。It is a figure which shows the module concerning 3rd Embodiment of this invention. 本発明の第４実施形態にかかるモジュールを示す図である。It is a figure which shows the module concerning 4th Embodiment of this invention. 本発明の第５実施形態にかかるモジュールを示す図である。It is a figure which shows the module concerning 5th Embodiment of this invention. 接続端子の変形例を示す要部拡大図である。It is a principal part enlarged view which shows the modification of a connection terminal. 従来のモジュールの一例を示す図である。It is a figure which shows an example of the conventional module.
　＜第１実施形態＞
　本発明の第１実施形態にかかるモジュールおよびモジュール搭載部品について、図１～図３を参照して説明する。図１は本発明の第１実施形態にかかるモジュールを示す図である。図２は本発明の第１実施形態にかかるモジュールの製造方法を示す図であり、（ａ）～（ｃ）はそれぞれ異なる工程を示す。図３は本発明の第１実施形態にかかるモジュール搭載部品を示す図である。 <First Embodiment>
A module and a module mounting component according to the first embodiment of the present invention will be described with reference to FIGS. FIG. 1 is a diagram showing a module according to the first embodiment of the present invention. FIG. 2 is a diagram showing a module manufacturing method according to the first embodiment of the present invention, and (a) to (c) show different processes. FIG. 3 is a diagram showing module mounting components according to the first embodiment of the present invention.
　（モジュール）
　この実施形態で説明するモジュールは、携帯電話や携帯情報端末などの通信携帯端末が備える実装基板に搭載されるものであり、配線基板１０１の少なくとも一方主面に各種の電子部品１０２が実装されることにより、Ｂｌｕｅｔｏｏｔｈ（登録商標）モジュールおよび無線ＬＡＮモジュールなどの各種の通信モジュール、アンテナスイッチモジュール、電源モジュールなどの高周波用回路モジュールとして形成される。 (module)
The module described in this embodiment is mounted on a mounting substrate included in a communication portable terminal such as a mobile phone or a portable information terminal, and various electronic components 102 are mounted on at least one main surface of the wiring substrate 101. Thus, various communication modules such as a Bluetooth (registered trademark) module and a wireless LAN module, an antenna switch module, and a high-frequency circuit module such as a power supply module are formed.
　図１に示すように、モジュール１００は、配線基板１０１と、配線基板１０１の一方主面に実装された電子部品１０２とを備えている。また、配線基板１０１の一方主面に形成されたランド電極１０１ａに、その一方端部がはんだＳを用いて接合されて接続されることにより柱状の接続端子１１が実装されており、実装された接続端子１１によりモジュール１００の層間接続導体が形成されている。 As shown in FIG. 1, the module 100 includes a wiring board 101 and an electronic component 102 mounted on one main surface of the wiring board 101. In addition, the columnar connection terminals 11 are mounted on the land electrode 101a formed on one main surface of the wiring board 101 by joining and connecting one end of the land electrode 101a with solder S. The connection terminal 11 forms an interlayer connection conductor of the module 100.
　また、配線基板１０１の一方主面には、電子部品１０２および接続端子１１を被覆して第１樹脂層１０３が設けられている。そして、モジュール１００には、接続端子１１の他方端部の端面および、該端面の外縁部と第１樹脂層１０３との境界部が、第１樹脂層１０３の配線基板１０１の一方主面との対向面に露出して形成された外部接続用の外部接続端子１１ａが設けられている。 Further, a first resin layer 103 is provided on one main surface of the wiring board 101 so as to cover the electronic component 102 and the connection terminal 11. In the module 100, the end surface of the other end of the connection terminal 11 and the boundary between the outer edge of the end surface and the first resin layer 103 are in contact with one main surface of the wiring substrate 101 of the first resin layer 103. An external connection terminal 11a for external connection formed to be exposed on the facing surface is provided.
　（モジュールの製造方法）
　層間接続導体を形成する柱状の接続端子１１および電子部品１０２が配線基板１０１に実装され樹脂封止されて成るモジュール１００の製造方法について説明する。なお、図２（ａ）～（ｂ）では、図１のモジュール１００の上下が逆に示されている。 (Module manufacturing method)
A method of manufacturing the module 100 in which the columnar connection terminals 11 and the electronic components 102 forming the interlayer connection conductor are mounted on the wiring substrate 101 and sealed with resin will be described. 2A and 2B, the module 100 of FIG. 1 is shown upside down.
　まず、図２（ａ）に示すように、モジュール１００の層間接続導体を形成する柱状の複数の接続端子１１と、各種のチップ部品やＩＣなどの電子部品１０２とが、配線基板１０１の一方主面の所定位置にはんだＳを用いた一般的な表面実装技術により実装される（実装工程）。なお、接続端子１１は、その一方端部が配線基板１０１に設けられたランド電極１０１ａにはんだＳにより接続されて実装される。 First, as shown in FIG. 2A, a plurality of columnar connection terminals 11 forming interlayer connection conductors of the module 100 and electronic components 102 such as various chip components and ICs are one main component of the wiring substrate 101. It is mounted by a general surface mounting technique using solder S at a predetermined position on the surface (mounting process). The connection terminal 11 is mounted with one end thereof connected to a land electrode 101 a provided on the wiring substrate 101 by solder S.
　また、配線基板１０１は、この実施形態では、複数のセラミックグリーンシートが積層されて焼成されて成る多層セラミック基板である。セラミックグリーンシートは、アルミナおよびガラスなどの混合粉末が有機バインダおよび溶剤などと一緒に混合されたスラリーがシート化されたものであり、セラミックグリーンシートの所定位置に、レーザ加工などによりビアホールが形成され、形成されたビアホールにＡｇやＣｕなどを含む導体ペーストが充填されて層間接続用のビア導体が形成され、導体ペーストによる印刷により種々の電極パターンが形成される。その後、各セラミックグリーンシートを積層、圧着されることによりセラミック積層体が形成されて、約１０００℃前後の低い温度で、所謂、低温焼成されることにより配線基板１０１が形成される。 Further, in this embodiment, the wiring substrate 101 is a multilayer ceramic substrate formed by laminating and firing a plurality of ceramic green sheets. A ceramic green sheet is a sheet of slurry in which a mixed powder of alumina and glass is mixed with an organic binder and solvent, and via holes are formed at predetermined positions on the ceramic green sheet by laser processing or the like. The formed via hole is filled with a conductor paste containing Ag, Cu or the like to form a via conductor for interlayer connection, and various electrode patterns are formed by printing with the conductor paste. Thereafter, the ceramic green sheets are laminated and pressure-bonded to form a ceramic laminate, and the wiring substrate 101 is formed by so-called low-temperature firing at a low temperature of about 1000 ° C.
　このように、配線基板１０１には、内部配線パターン、接続端子１１および電子部品１０２が実装されるランド電極１０１ａおよび外部接続用電極などの種々の電極パターンが設けられているが、配線基板１０１は、樹脂やポリマー材料などを用いたプリント基板、ＬＴＣＣ、アルミナ系基板、ガラス基板、複合材料基板、単層基板、多層基板などで形成することができ、モジュール１００の使用目的に応じて、適宜最適な材質を選択して配線基板１０１を形成すればよい。 As described above, the wiring board 101 is provided with various electrode patterns such as the internal wiring pattern, the land electrode 101a on which the connection terminal 11 and the electronic component 102 are mounted, and the external connection electrode. It can be formed with printed circuit board, LTCC, alumina substrate, glass substrate, composite material substrate, single layer substrate, multilayer substrate, etc. using resin or polymer material, etc. The wiring board 101 may be formed by selecting a suitable material.
　また、接続端子１１は、Ｃｕ、Ｃｕに０．１％～２０％の割合でＦｅが混合された合金、Ａｕ、Ａｇ、Ａｌなどの金属導体により形成される金属ピンを用いることができる。なお、ＣｕにＦｅが混合されて硬度が増した合金により接続端子１１を形成することで、接続端子１１が切削加工等されるときにバリ等が生じることを抑制することができるので、接続端子１１が切削等されたときの加工精度を向上することができる。また、所望の直径を有し、円形状または多角形状の断面形状を有する金属導体の線材が、所定の長さでせん断加工されることで、接続端子１１は、円柱状または多角柱状に形成される。 Further, the connection terminal 11 can be made of Cu, an alloy in which Fe is mixed in a proportion of 0.1% to 20%, or a metal pin formed of a metal conductor such as Au, Ag, or Al. In addition, since it can suppress that a burr | flash etc. arise when the connection terminal 11 is cut by forming the connection terminal 11 with the alloy in which Fe is mixed with Cu and the hardness is increased, the connection terminal Processing accuracy when 11 is cut or the like can be improved. Further, the connection terminal 11 is formed in a columnar shape or a polygonal column shape by shearing a metal conductor wire having a desired diameter and having a circular or polygonal cross-sectional shape with a predetermined length. The
　なお、接続端子１１の切削性や研削性、研磨精度の向上を図ると共に、接続端子１１に対するはんだや金属ろうなどの導電性接合材の濡れ状態や、接続端子１１にめっきが施されたときのめっき状態を劣化させないために、Ｃｕに１～１０％のＦｅが添加されたＣｕ－Ｆｅ合金を採用するのがより好ましい。 In addition, while improving the machinability, grindability, and polishing accuracy of the connection terminal 11, the wet state of the conductive bonding material such as solder or metal brazing to the connection terminal 11, or when the connection terminal 11 is plated. In order not to deteriorate the plating state, it is more preferable to employ a Cu—Fe alloy in which 1 to 10% Fe is added to Cu.
　次に、図２（ｂ）に示すように、配線基板１０１の一方主面に樹脂が充填されることにより、配線基板１０１の一方主面に実装された電子部品１０２および接続端子１１が第１樹脂層１０３により被覆されて封止される（封止工程）。第１樹脂層１０３は、エポキシ樹脂やフェノール樹脂、シアネート樹脂などの熱硬化性の樹脂に、酸化アルミニウムやシリカ（二酸化ケイ素）、二酸化チタンなどの無機フィラーが混合されて形成された複合樹脂により形成することができる。 Next, as shown in FIG. 2B, the electronic component 102 and the connection terminal 11 mounted on the one main surface of the wiring substrate 101 are first filled by resin filling one main surface of the wiring substrate 101. It is covered and sealed with the resin layer 103 (sealing process). The first resin layer 103 is formed of a composite resin formed by mixing an inorganic filler such as aluminum oxide, silica (silicon dioxide), or titanium dioxide with a thermosetting resin such as an epoxy resin, a phenol resin, or a cyanate resin. can do.
　例えば、ＰＥＴフィルム上に複合樹脂を成型して半硬化させた樹脂シートを用いて第１樹脂層１０３を形成する場合には、所望の厚みを有するスペーサ（型）が周囲に配置された状態の配線基板１０１に樹脂シートを被せ、樹脂の厚みがスペーサの厚みになるように樹脂シートを加熱プレスした後、配線基板１０１をオーブンにより加熱して樹脂を硬化させることにより、所望の厚みを有する第１樹脂層１０３を形成することができる。なお、第１樹脂層１０３は、液状の樹脂を用いたポッティング技術やトランスファーモールド技術、コンプレッションモールド技術など、樹脂層を形成する一般的な成型技術を用いて形成すればよい。 For example, when the first resin layer 103 is formed using a resin sheet obtained by molding and semi-curing a composite resin on a PET film, a spacer (mold) having a desired thickness is arranged around After covering the wiring board 101 with a resin sheet and heat-pressing the resin sheet so that the thickness of the resin becomes the thickness of the spacer, the wiring board 101 is heated in an oven to cure the resin. One resin layer 103 can be formed. The first resin layer 103 may be formed using a general molding technique for forming a resin layer, such as a potting technique using a liquid resin, a transfer molding technique, or a compression molding technique.
　次に、図２（ｃ）に示すように、ローラブレード等により第１樹脂層１０３の表面および接続端子１１の他方端部が研削されたり研磨されることにより、不要な樹脂が除去されて、第１樹脂層１０３の表面が平坦化されると共に、接続端子１１の他方端部が第１樹脂層１０３の表面に露出する（研磨または研削工程）。これにより、第１樹脂層１０３の表面に露出した、接続端子１１の他方端部の端面および、該端面の外縁部と第１樹脂層１０３との境界部により外部接続用の外部接続端子１１ａが形成されたモジュール１００が完成する。 Next, as shown in FIG. 2C, the surface of the first resin layer 103 and the other end of the connection terminal 11 are ground or polished by a roller blade or the like to remove unnecessary resin, The surface of the first resin layer 103 is flattened, and the other end of the connection terminal 11 is exposed on the surface of the first resin layer 103 (polishing or grinding process). Thus, the external connection terminal 11a for external connection is exposed by the end surface of the other end of the connection terminal 11 exposed on the surface of the first resin layer 103 and the boundary between the outer edge of the end surface and the first resin layer 103. The formed module 100 is completed.
　なお、接続端子１１の一方端部を配線基板１０１に接続するはんだＳの厚みなどの影響で、接続端子１１の配線基板１０１の一方主面からの高さにばらつきが生じている場合には、第１樹脂層１０３と一緒に接続端子１１の他方端部を研削または研磨することにより、接続端子１１の配線基板１０１からの高さを揃えることができる。また、第１樹脂層１０３の表面に露出した接続端子１１の他方端部に例えば金めっきやニッケル／金めっきを施してもよい。 When the height of the connection terminal 11 from one main surface of the wiring board 101 varies due to the influence of the thickness of the solder S that connects one end of the connection terminal 11 to the wiring board 101, By grinding or polishing the other end of the connection terminal 11 together with the first resin layer 103, the height of the connection terminal 11 from the wiring substrate 101 can be made uniform. Further, for example, gold plating or nickel / gold plating may be applied to the other end portion of the connection terminal 11 exposed on the surface of the first resin layer 103.
　また、封止工程において、各接続端子１１の他方端部が露出するように第１樹脂層１０３が形成される場合には、第１樹脂層１０３の表面を研磨または研削する工程は、必ずしも実行しなくともよい。 In the sealing step, when the first resin layer 103 is formed so that the other end of each connection terminal 11 is exposed, the step of polishing or grinding the surface of the first resin layer 103 is not necessarily executed. You don't have to.
　また、上記したように、モジュール１００を個別に製造してもよいが、複数のモジュール１００の集合体を形成した後に、個々のモジュール１００に個片化することによりモジュール１００を製造してもよい。 Further, as described above, the modules 100 may be manufactured individually. However, after the assembly of a plurality of modules 100 is formed, the modules 100 may be manufactured by dividing them into individual modules 100. .
　なお、モジュール１００の層間接続導体を形成する柱状の複数の接続端子１１が平板状の支持体（図示省略）のいずれか一方の主面に支持されて成る端子集合体を配線基板１０１に実装することにより、複数の接続端子１１を配線基板１０１に同時に実装してもよい。例えば、端子集合体は、支持体のいずれかの一方の面に接着層または粘着層からなる支持層が設けられており、この支持層により接続端子１１が支持されたものである。端子集合体を配線基板１０１に実装することで、複数の接続端子１１を容易に配線基板１０１に実装することができる。 Note that a terminal assembly in which a plurality of columnar connection terminals 11 forming interlayer connection conductors of the module 100 are supported on one main surface of a flat support (not shown) is mounted on the wiring board 101. Thus, the plurality of connection terminals 11 may be mounted on the wiring board 101 at the same time. For example, in the terminal assembly, a support layer made of an adhesive layer or an adhesive layer is provided on one surface of the support, and the connection terminal 11 is supported by this support layer. By mounting the terminal assembly on the wiring board 101, the plurality of connection terminals 11 can be easily mounted on the wiring board 101.
　また、支持体に支持層を設ける代わりに、磁性を有する材質の板状部材により支持体を形成してもよい。このようにすると、板状部材の磁力により接続端子１１の他方端部を吸着することで、支持体により接続端子１１を簡単に支持することができる。また、端子集合体が配線基板１０１に実装された後に、支持体を接続端子１１から容易に除去することができる。 Further, instead of providing a support layer on the support, the support may be formed of a plate member made of a magnetic material. If it does in this way, the connection terminal 11 can be easily supported by a support body by adsorb | sucking the other end part of the connection terminal 11 with the magnetic force of a plate-shaped member. In addition, after the terminal assembly is mounted on the wiring substrate 101, the support can be easily removed from the connection terminal 11.
　また、樹脂板に所定間隔で接続端子１１を挿入するための孔が格子状に形成されて成る支持体が準備され、支持体に形成された複数の孔のうち、モジュールの設計態様に応じて必要な位置に柱状の接続端子１１が他方端部側から挿入されることにより形成された端子集合体を用いて接続端子１１を配線基板１０１に実装してもよい。 In addition, a support body in which holes for inserting the connection terminals 11 into the resin plate at predetermined intervals is formed in a lattice shape is prepared, and among the plurality of holes formed in the support body, according to the design mode of the module The connection terminals 11 may be mounted on the wiring board 101 by using a terminal assembly formed by inserting the columnar connection terminals 11 from the other end side at necessary positions.
　このように構成すると、板状の支持体に設けられた孔に柱状の接続端子１１を挿入するだけで、端子集合体を低コストで容易に製造することができる。また、支持体に設けられた複数の孔のうち、必要な孔に接続端子１１を挿入することにより、モジュールの種類に応じた端子集合体を形成することができる。したがって、モジュールの種類ごとに支持体を設計する必要がないため、端子集合体の製造コストの低減を図ることができる。 With this configuration, the terminal assembly can be easily manufactured at low cost simply by inserting the columnar connection terminals 11 into the holes provided in the plate-like support. Further, by inserting the connection terminal 11 into a required hole among the plurality of holes provided in the support, a terminal assembly corresponding to the type of module can be formed. Therefore, since it is not necessary to design a support for each type of module, the manufacturing cost of the terminal assembly can be reduced.
　なお、モジュールの設計態様に応じて樹脂板の必要な位置にのみ孔を形成することにより支持体を形成してもよい。また、支持体は、例えば、樹脂を用いた射出成型や、樹脂板に孔を形成することにより形成することができる。 In addition, you may form a support body by forming a hole only in the required position of a resin board according to the design aspect of a module. The support can be formed, for example, by injection molding using a resin or by forming a hole in a resin plate.
　また、接続端子１１を形成する材質から成る金属板が打抜き加工やエッチング加工されることにより、複数の接続端子１１の他方端部が連結部の両側に連結された部材が形成され、連結部の両側の接続端子１１が折り曲げ加工されることにより形成された端子集合体を用いて接続端子１１を配線基板に実装してもよい。 Further, a metal plate made of a material forming the connection terminal 11 is stamped or etched to form a member in which the other end portions of the plurality of connection terminals 11 are connected to both sides of the connection portion. The connection terminals 11 may be mounted on the wiring board using a terminal assembly formed by bending the connection terminals 11 on both sides.
　このように構成すると、金属板を打抜き加工やエッチング加工することにより、複数の接続端子１１が連結部を介して連結された集合体を形成し、接続端子１１と連結部との連結部分を同じ方向に折り曲げ加工するだけで、低コストで容易に端子集合体を形成することができる。 If comprised in this way, the metal plate will be punched or etched to form an assembly in which a plurality of connecting terminals 11 are connected via connecting parts, and the connecting parts of connecting terminals 11 and connecting parts will be the same. A terminal assembly can be easily formed at low cost simply by bending in the direction.
　なお、端子集合体を配線基板１０１に実装することにより複数の接続端子１１を配線基板１０１上のランド電極１０１ａに実装した場合には、端子集合体が配線基板１０１に実装された後、端子集合体を形成する支持体を取り除いた後に、配線基板１０１の一方主面に樹脂を充填する封止工程を実行するとよい。また、端子集合体の支持体を取り除く前に、配線基板１０１の一方主面に樹脂を充填する封止工程を実行してもよいが、この場合には、第１樹脂層１０３の表面を研磨または研削する工程において、第１樹脂層１０３と一緒に端子集合体の支持体を研磨または研削することにより、端子集合体の支持体を除去するとよい。 When a plurality of connection terminals 11 are mounted on the land electrode 101a on the wiring board 101 by mounting the terminal assembly on the wiring board 101, the terminal assembly is mounted after the terminal assembly is mounted on the wiring board 101. After removing the support that forms the body, a sealing step of filling one main surface of the wiring board 101 with resin may be performed. In addition, before removing the terminal assembly support, a sealing step of filling one main surface of the wiring board 101 with resin may be performed. In this case, the surface of the first resin layer 103 is polished. Alternatively, in the grinding step, the terminal assembly support may be removed by polishing or grinding the terminal assembly support together with the first resin layer 103.
　（モジュール搭載部品）
　図３に示すように、この実施形態のモジュール搭載部品２００は、携帯電話や携帯情報端末などの通信携帯端末に搭載されるものであり、モジュール１００と、モジュール１００が実装される実装基板２０１とを備え、モジュール１００は、外部接続端子１１ａが実装基板２０１に形成された実装用電極２０２にはんだＳを用いて接続されることにより実装基板２０１に実装されている。 (Module mounted parts)
As shown in FIG. 3, the module mounting component 200 of this embodiment is mounted on a communication portable terminal such as a mobile phone or a portable information terminal, and includes a module 100 and a mounting substrate 201 on which the module 100 is mounted. The module 100 is mounted on the mounting substrate 201 by connecting the external connection terminals 11a to the mounting electrodes 202 formed on the mounting substrate 201 using solder S.
　なお、実装基板２０１には、他のモジュールや電子部品１０２が実装されていてもよく、はんだＳによる実装に替えて超音波振動を用いて各種の部品を実装基板２０１に実装してもよい。また、実装基板２０１の実装面をモールド樹脂により封止してもよい。また、実装基板２０１は、樹脂やポリマー材料などを用いたプリント基板、ＬＴＣＣ、アルミナ系基板、ガラス基板、複合材料基板、単層基板、多層基板などで形成することができ、モジュール搭載部品２００の使用目的に応じて、適宜最適な材質を選択して実装基板２０１を形成すればよい。 Note that another module or electronic component 102 may be mounted on the mounting substrate 201, and various components may be mounted on the mounting substrate 201 using ultrasonic vibration instead of mounting with the solder S. Further, the mounting surface of the mounting substrate 201 may be sealed with a mold resin. The mounting board 201 can be formed of a printed board using a resin or a polymer material, LTCC, alumina-based board, glass board, composite material board, single layer board, multilayer board, etc. The mounting substrate 201 may be formed by selecting an appropriate material as appropriate according to the purpose of use.
　以上のように、この実施形態では、配線基板１０１の一方主面に電子部品１０２と共に実装されて、層間接続導体を形成する柱状の接続端子１１は、その一方端部が、配線基板１０１にはんだＳにより接続され、他方端部が、電子部品１０２および接続端子１１を被覆して配線基板１０１の一方主面に設けられた第１樹脂層１０３の、配線基板１０１の一方主面との対向面に露出している。そして、第１樹脂層１０３の表面に露出した、接続端子１１の他方端部の端面および、該端面の外縁部と第１樹脂層１０３との境界部により、外部接続用の外部接続端子１１ａが形成されている。 As described above, in this embodiment, the columnar connection terminal 11 that is mounted together with the electronic component 102 on one main surface of the wiring board 101 and forms an interlayer connection conductor has one end thereof soldered to the wiring board 101. The first resin layer 103 that is connected by S and whose other end covers the electronic component 102 and the connection terminal 11 and is provided on one main surface of the wiring substrate 101 is opposed to the one main surface of the wiring substrate 101. Is exposed. The external connection terminal 11a for external connection is exposed by the end surface of the other end of the connection terminal 11 exposed on the surface of the first resin layer 103 and the boundary between the outer edge of the end surface and the first resin layer 103. Is formed.
　したがって、接続端子１１ａの他方端部の端面の外縁部と第１樹脂層１０３との境界部が第１樹脂層１０３の表面に露出して外部に開放されているため、モジュール１００が、例えば、図３に示すモジュール搭載部品２００の実装基板２０１にはんだリフローにより実装されるときに、接続端子１１を配線基板１０１の一方主面に接続するはんだＳが溶融し、溶融したはんだＳが、接続端子１１の側面と第１樹脂層１０３との境界の隙間を伝って接続端子１１の他方端部側に移動した場合には、接続端子１１の他方端部側に移動した溶融はんだＳは、外部に開放されている接続端子１１の他方端部の端面の外縁部と第１樹脂層１０３との境界部から排出される。したがって、溶融したはんだＳが、配線基板１０１の一方主面と第１樹脂層１０３との界面の隙間を伝って移動することにより、隣接する電子部品１０２や接続端子１１が短絡すること、すなわちはんだフラッシュを防止することができる。 Therefore, since the boundary between the outer edge of the end surface of the other end of the connection terminal 11a and the first resin layer 103 is exposed to the surface of the first resin layer 103 and opened to the outside, the module 100 is, for example, When the module mounting component 200 shown in FIG. 3 is mounted on the mounting board 201 by solder reflow, the solder S connecting the connection terminal 11 to one main surface of the wiring board 101 is melted, and the molten solder S is connected to the connection terminal. 11 moves to the other end side of the connection terminal 11 through the gap between the side surface of the first resin layer 103 and the first resin layer 103, the molten solder S moved to the other end side of the connection terminal 11 It is discharged from the boundary part between the outer edge part of the end surface of the other end part of the open connection terminal 11 and the first resin layer 103. Therefore, when the melted solder S moves through a gap at the interface between the one main surface of the wiring substrate 101 and the first resin layer 103, the adjacent electronic component 102 and the connection terminal 11 are short-circuited, that is, the solder. Flash can be prevented.
　また、モジュール１００の層間接続導体は、柱状の接続端子１１の一方端部が配線基板１０１の一方主面にはんだＳを用いて接続されて実装されることにより形成されており、接続端子１１は、電子部品１０２を配線基板１０１に実装する一般的な表面実装技術を用いて配線基板１０１に実装することができる。したがって、柱状の接続端子１１が配線基板１０１に実装されて層間接続導体が形成され、第１樹脂層１０３の表面に露出した接続端子１１の他方端部により外部接続端子１１ａが形成されることで、信頼性の高いモジュール１００を低コストで提供することができる。 Further, the interlayer connection conductor of the module 100 is formed by connecting one end portion of the columnar connection terminal 11 to one main surface of the wiring board 101 by using solder S and mounting the connection terminal 11. The electronic component 102 can be mounted on the wiring board 101 by using a general surface mounting technique for mounting the electronic component 102 on the wiring board 101. Accordingly, the columnar connection terminals 11 are mounted on the wiring substrate 101 to form interlayer connection conductors, and the external connection terminals 11 a are formed by the other end of the connection terminals 11 exposed on the surface of the first resin layer 103. Therefore, the highly reliable module 100 can be provided at a low cost.
　また、外部接続端子１１ａを成す接続端子１１の他方端部の端面にめっきが施されていると、該端面の濡れ性が向上しているため、モジュール１００の外部に排出された溶融はんだＳが接続端子１１の他方端部の端面に集まり易くなるので、モジュール１００内から外部に排出された溶融はんだＳが、第１樹脂層１０３の表面に広がるのを防止することができる。 Further, when the end surface of the other end portion of the connection terminal 11 constituting the external connection terminal 11a is plated, the wettability of the end surface is improved, so that the molten solder S discharged to the outside of the module 100 is removed. Since it becomes easy to gather on the end surface of the other end portion of the connection terminal 11, it is possible to prevent the molten solder S discharged from the inside of the module 100 from spreading on the surface of the first resin layer 103.
　また、モジュール１００の外部接続端子１１ａを、実装基板２０１の実装用電極２０２に接続して、モジュール１００を実装基板２０１に実装することにより、実用的な構成のモジュール搭載部品２００を提供することができる。 Further, by connecting the external connection terminal 11a of the module 100 to the mounting electrode 202 of the mounting substrate 201 and mounting the module 100 on the mounting substrate 201, it is possible to provide the module mounting component 200 having a practical configuration. it can.
　また、接続端子１１をＣｕ－Ｆｅ合金により形成してもよい。この構成を備えることにより、以下の効果を奏することができる。すなわち、Ｃｕ－Ｆｅ合金は、線膨張係数が約１７ｐｐｍ／℃のＣｕに、線膨張係数がＣｕよりも低い約１２ｐｐｍ／℃であるＦｅが添加されることにより線膨張係数がＣｕよりも低く、Ｃｕ－Ｆｅ合金から成る接続端子１１により形成される層間接続導体の線膨張係数と、セラミック材料やＦＲ－４規格の樹脂材料で形成される配線基板１０１の線膨張係数との差を小さくすることができる。したがって、Ｃｕ－Ｆｅ合金により形成された柱状の接続端子１１が配線基板１０１に実装されて層間接続導体が形成されることにより、加熱されたときに配線基板１０１および接続端子１１が熱膨脹することにより配線基板１０１と接続端子１１との間に生じる応力を抑制することができるので、例えば、配線基板１０１および接続端子１１の接続部分が破損するのを防止することができ、信頼性の高いモジュール１０１を提供することができる。 Further, the connection terminal 11 may be formed of a Cu—Fe alloy. By providing this configuration, the following effects can be achieved. That is, the Cu—Fe alloy has a linear expansion coefficient lower than that of Cu by adding Fe having a linear expansion coefficient of about 12 ppm / ° C., which is lower than Cu, to Cu having a linear expansion coefficient of about 17 ppm / ° C. To reduce the difference between the linear expansion coefficient of the interlayer connection conductor formed by the connection terminal 11 made of the Cu—Fe alloy and the linear expansion coefficient of the wiring substrate 101 formed of a ceramic material or FR-4 standard resin material. Can do. Accordingly, the columnar connection terminals 11 formed of a Cu—Fe alloy are mounted on the wiring board 101 to form an interlayer connection conductor, whereby the wiring board 101 and the connection terminals 11 are thermally expanded when heated. Since the stress generated between the wiring board 101 and the connection terminal 11 can be suppressed, for example, the connection portion between the wiring board 101 and the connection terminal 11 can be prevented from being damaged, and the highly reliable module 101 can be prevented. Can be provided.
　また、Ｃｕ－Ｆｅ合金から成る線材を所定の長さで切断して、所望の径および長さの接続端子１１を準備することにより、Ｃｕ－Ｆｅ合金は、ＣｕにＦｅが添加されることによりＣｕよりも硬度が高く、切削性や研削性に優れているため、線材が切断されて接続端子１１が形成される際に、接続端子１１の切断端にばりが形成されるのが抑制されるので、非常に高精度な形状を有する柱状の接続端子１１を準備することができる。 Further, by cutting a wire made of a Cu—Fe alloy at a predetermined length to prepare a connection terminal 11 having a desired diameter and length, the Cu—Fe alloy is obtained by adding Fe to Cu. Since the hardness is higher than Cu and excellent in machinability and grindability, it is suppressed that a flash is formed at the cut end of the connection terminal 11 when the wire is cut and the connection terminal 11 is formed. Therefore, the columnar connection terminal 11 having a very high precision shape can be prepared.
　また、配線基板１０１の一方主面に、電子部品１０２が実装されると共に接続端子１１の一方端部が配線基板１０１に接続されるように接続端子１１が実装され、配線基板１０１の一方主面に実装された電子部品１０２および接続端子１１が第１樹脂層１０３により封止される。そして、第１樹脂層１０３および接続端子１１の他方端部が研磨または研削されることにより、第１樹脂層１０３の表面に接続端子１１の他方端部が露出するが、接続端子１１を形成するＣｕ－Ｆｅ合金は硬度が高く、切削性や研削性に優れているため、接続端子１１の他方端部が研磨または研削される際に該他方端部にばりが形成されるのが抑制される。 In addition, the electronic component 102 is mounted on one main surface of the wiring board 101 and the connection terminal 11 is mounted so that one end of the connection terminal 11 is connected to the wiring board 101. The electronic component 102 and the connection terminal 11 mounted on are sealed with the first resin layer 103. Then, the other end portion of the first resin layer 103 and the connection terminal 11 is polished or ground, so that the other end portion of the connection terminal 11 is exposed on the surface of the first resin layer 103, but the connection terminal 11 is formed. Since the Cu—Fe alloy has high hardness and is excellent in machinability and grindability, it is suppressed that a flash is formed at the other end when the other end of the connection terminal 11 is polished or ground. .
　したがって、各接続端子１１の他方端部は、第１樹脂層１０３の表面に露出してモジュール１００の外部接続用端子１１ａとして機能するが、第１樹脂層１０３の表面に露出する接続端子１１の他方端部に形成されたばりにより各接続端子１１が短絡するのが防止されるため、Ｃｕ－Ｆｅ合金により形成された柱状の接続端子１１が配線基板１０１に実装されて層間接続導体が形成されることにより信頼性の高いモジュール１００を提供することができる。 Therefore, the other end of each connection terminal 11 is exposed on the surface of the first resin layer 103 and functions as the external connection terminal 11a of the module 100, but the connection terminal 11 exposed on the surface of the first resin layer 103 is exposed. Since the connection terminals 11 are prevented from being short-circuited by the flash formed at the other end, the columnar connection terminals 11 formed of a Cu—Fe alloy are mounted on the wiring board 101 to form an interlayer connection conductor. Thus, the module 100 with high reliability can be provided.
　また、接続端子１１がＣｕ－Ｆｅ合金により形成されることにより、研磨または研削工程において、接続端子１１の他方端部にばりが形成されるのが抑制されて、形成されたばりにより各接続端子１１が短絡するのが防止されるので、配線基板１０１に実装される複数の接続端子１１間の距離を縮めることができ、各接続端子１１が配線基板１０１に近接配置されて実装され、端子間の距離が縮められることにより、小型化が図られたモジュール１００を提供することができる。また、複数の接続端子１１を配線基板１０１に近接配置して実装することができるので、モジュール１００の設計の自由度を高めることができる。 Further, since the connection terminal 11 is formed of a Cu—Fe alloy, it is possible to suppress the formation of flash at the other end of the connection terminal 11 in the polishing or grinding process. 11 is prevented from being short-circuited, the distance between the plurality of connection terminals 11 mounted on the wiring board 101 can be reduced, and each connection terminal 11 is mounted close to the wiring board 101 and mounted between the terminals. Thus, the module 100 can be provided with a reduced size. In addition, since the plurality of connection terminals 11 can be mounted close to the wiring substrate 101, the degree of freedom in designing the module 100 can be increased.
　また、封止工程の後に第１樹脂層１０３の表面を研削や研磨により、第１樹脂層１０３の表面を平坦化することができると共に、モジュール１００の低背化を図ることができる。 Further, the surface of the first resin layer 103 can be flattened by grinding or polishing after the sealing step, and the height of the module 100 can be reduced.
　また、研磨または研削工程により、第１樹脂層１０３の表面と共に接続端子１１の他方端部を削ることで、第１樹脂層１０３の表面に接続端子１１の他方端部により形成される外部接続用端子１１ａを容易に形成することができる。 Further, by polishing or grinding the surface of the first resin layer 103 and the other end of the connection terminal 11, the external connection is formed on the surface of the first resin layer 103 by the other end of the connection terminal 11. The terminal 11a can be easily formed.
　（モジュールの変形例）
　図４および図５を参照してモジュール１００の変形例について説明する。図４および図５はそれぞれモジュールの変形例を示す図である。 (Modification of module)
A modification of the module 100 will be described with reference to FIGS. 4 and 5. 4 and 5 are diagrams showing modifications of the modules.
　図４に示すモジュール１００ａが、上記したモジュール１００と異なるのは、側面にめっき１１ｂが施された接続端子１１が配線基板１０１に実装されている点である。その他の構成は上記したモジュール１００と同一の構成であるため、その構成については同一符号を付すことによりその構成の説明は省略する。 4 differs from the module 100 described above in that the connection terminals 11 having side surfaces plated with 11b are mounted on the wiring board 101. FIG. Since the other configuration is the same as that of the module 100 described above, the same reference numerals are given to the configuration, and the description of the configuration is omitted.
　このように構成すると、接続端子１１の側面にめっき１１ｂが施されているため、はんだＳの濡れ性が向上し、溶融したはんだＳが接続端子１１の側面を伝って移動し易くなり、溶融したはんだＳが、外部に開放されている接続端子１１の他方端部の端面の外縁部と第１樹脂層１０３との境界部からより一層効率よく排出されるので、より信頼性の高いモジュール１００を提供することができる。 If comprised in this way, since the plating 11b is given to the side surface of the connection terminal 11, the wettability of the solder S will improve and it will become easy for the molten solder S to move along the side surface of the connection terminal 11, and it was fuse | melted. Since the solder S is more efficiently discharged from the boundary portion between the outer edge portion of the other end portion of the connection terminal 11 opened to the outside and the first resin layer 103, the module 100 with higher reliability can be obtained. Can be provided.
　なお、接続端子１１の他方端部の端面により形成される外部接続端子１１ａにめっきを施す場合には、図２（ｃ）を参照して説明した工程において、第１樹脂層１０３が研削または研磨される際に、接続端子１１の他方端部の端面に施されためっき１１ｂが除去されるため、当該他方端部が研削または研磨されて第１樹脂層１０３の表面に露出した後に、露出した接続端子の他方端部の端面にめっきを施すとよい。 When plating is performed on the external connection terminal 11a formed by the end surface of the other end of the connection terminal 11, the first resin layer 103 is ground or polished in the process described with reference to FIG. In this case, since the plating 11b applied to the end surface of the other end of the connection terminal 11 is removed, the other end is ground or polished and exposed to the surface of the first resin layer 103, and then exposed. Plating may be applied to the end face of the other end of the connection terminal.
　また、接続端子１１へのめっきとして、金めっきやニッケル／金めっき、スズめっき等を施すことができるが、特に金めっきを施すことにより、はんだＳの濡れ性が非常に高く、溶融したはんだがモジュール内から外部にさらに効率よく排出されるので、より信頼性の高いモジュール１００を提供することができる。 In addition, gold plating, nickel / gold plating, tin plating, or the like can be performed as the plating on the connection terminal 11, but the wettability of the solder S is extremely high by applying the gold plating in particular, and the molten solder Since it is more efficiently discharged from the inside of the module to the outside, the module 100 with higher reliability can be provided.
　図５に示すモジュール１００ｂが、上記したモジュール１００と異なるのは、外部接続端子１１ａに、バンプＢが形成されている点である。その他の構成は上記したモジュール１００と同一の構成であるため、その構成については同一符号を付すことによりその構成は説明を省略する。 5 is different from the module 100 described above in that bumps B are formed on the external connection terminals 11a. Since other configurations are the same as those of the module 100 described above, the same reference numerals are given to the configurations, and the description thereof is omitted.
　このように構成すると、外部接続端子１１ａにバンプＢが形成されているので、バンプＢを溶融させることにより、モジュールＢを、図３に示されているモジュール搭載部品２００の実装基板２０１のような外部の基板に容易に実装することができる。なお、バンプＢは、例えばはんだにより形成することができる。また、図４を参照して説明したモジュール１００ａの外部接続端子１１ａにバンプＢを形成してもよい。 With this configuration, since the bump B is formed on the external connection terminal 11a, by melting the bump B, the module B becomes like the mounting substrate 201 of the module mounting component 200 shown in FIG. It can be easily mounted on an external substrate. The bump B can be formed by, for example, solder. Further, the bump B may be formed on the external connection terminal 11a of the module 100a described with reference to FIG.
　＜第２実施形態＞
　本発明の第２実施形態にかかるモジュールについて、図６を参照して説明する。図６は本発明の第２実施形態にかかるモジュールを示す図である。 <Second Embodiment>
A module according to a second embodiment of the present invention will be described with reference to FIG. FIG. 6 is a diagram showing a module according to the second embodiment of the present invention.
　この実施形態にかかるモジュールが、上記した第１実施形態と異なるのは、図６に示すように、モジュール１００ｃの配線基板１０１の他方主面に他の電子部品１０２がさらに実装されている点である。その他の構成は上記した第１実施形態と同様の構成であるため、同一符号を付すことによりその構成の説明は省略する。 The module according to this embodiment is different from the first embodiment described above in that another electronic component 102 is further mounted on the other main surface of the wiring board 101 of the module 100c as shown in FIG. is there. Since other configurations are the same as those in the first embodiment, description of the configuration is omitted by giving the same reference numerals.
　したがって、配線基板１０１の他方主面に電子部品１０２がさらに実装されることにより、モジュール１００ａに実装される電子部品１０２の実装密度を高めることができ、電子部品１０２の実装密度が高められた実用的な構成のモジュール１００ａを提供することができる。 Therefore, by further mounting the electronic component 102 on the other main surface of the wiring board 101, the mounting density of the electronic component 102 mounted on the module 100a can be increased, and the mounting density of the electronic component 102 is increased. A module 100a having a typical configuration can be provided.
　＜第３実施形態＞
　本発明の第３実施形態にかかるモジュールについて、図７を参照して説明する。図７は本発明の第３実施形態にかかるモジュールを示す図である。 <Third Embodiment>
A module according to a third embodiment of the present invention will be described with reference to FIG. FIG. 7 is a diagram showing a module according to the third embodiment of the present invention.
　この実施形態にかかるモジュールが、上記した第２実施形態と異なるのは、図７に示すように、モジュール１００ｄの配線基板１０１の他方主面に実装された電子部品１０２が、電子部品１０２を被覆して設けられた第２樹脂層１０４により封止される点である。その他の構成は上記した第１および第２実施形態と同様の構成であるため、同一符号を付すことによりその構成の説明は省略する。 The module according to this embodiment differs from the second embodiment described above in that the electronic component 102 mounted on the other main surface of the wiring board 101 of the module 100d covers the electronic component 102 as shown in FIG. The second resin layer 104 is sealed by the second resin layer 104. Since other configurations are the same as those in the first and second embodiments described above, the description of the configurations is omitted by giving the same reference numerals.
　以上のように、上記した第２実施形態と同様に、配線基板１０１の他方主面に電子部品１０２が実装され、配線基板１０１の他方主面に実装された電子部品１０２が第２樹脂層１０４により封止されることにより、モジュール１００ｄに実装される電子部品１０２の実装密度を高めることができるので、実用的である。 As described above, similarly to the second embodiment described above, the electronic component 102 is mounted on the other main surface of the wiring board 101, and the electronic component 102 mounted on the other main surface of the wiring board 101 is the second resin layer 104. Since the mounting density of the electronic components 102 mounted on the module 100d can be increased by sealing with the above, it is practical.
　また、配線基板１０１の他方主面に電子部品１０２を被覆して第２樹脂層１０４が設けられているため、配線基板１０１の他方主面に実装された電子部品１０２を第２樹脂層１０４により保護することができる。 In addition, since the second resin layer 104 is provided so as to cover the other main surface of the wiring substrate 101 with the electronic component 102, the electronic component 102 mounted on the other main surface of the wiring substrate 101 is formed by the second resin layer 104. Can be protected.
　＜第４実施形態＞
　本発明の第４実施形態にかかるモジュールについて、図８を参照して説明する。図８は本発明の第４実施形態にかかるモジュールを示す図である。 <Fourth embodiment>
A module according to a fourth embodiment of the present invention will be described with reference to FIG. FIG. 8 is a diagram showing a module according to the fourth embodiment of the present invention.
　この実施形態にかかるモジュールが、上記した第３実施形態と異なるのは、図８に示すように、モジュール１００ｅの配線基板１０１の他方主面に設けられた第２樹脂層１０４に金属シールド層１０５が設けられている点である。その他の構成は上記した第１～第３実施形態と同様の構成であるため、同一符号を付すことによりその構成の説明は省略する。なお、金属シールド層１０５は、配線基板１０１に設けられたＧＮＤ用配線と電気的に接続されるのが望ましい。 The module according to this embodiment is different from the third embodiment described above, as shown in FIG. 8, in which the metal shield layer 105 is formed on the second resin layer 104 provided on the other main surface of the wiring substrate 101 of the module 100e. Is a point provided. Since other configurations are the same as those in the first to third embodiments, description thereof will be omitted by assigning the same reference numerals. Note that the metal shield layer 105 is preferably electrically connected to the GND wiring provided on the wiring board 101.
　このように構成すると、第２樹脂層１０４に金属シールド層１０５が設けられているため、特に、第２樹脂層１０４に封止される電子部品１０２に外部からノイズが伝搬するのが防止されると共に、第２樹脂層１０４に封止される電子部品１０２から電磁波などが輻射するのを防止することができる。 If comprised in this way, since the metal shield layer 105 is provided in the 2nd resin layer 104, it is prevented especially that a noise propagates from the exterior to the electronic component 102 sealed by the 2nd resin layer 104. At the same time, electromagnetic waves and the like can be prevented from being radiated from the electronic component 102 sealed in the second resin layer 104.
　＜第５実施形態＞
　本発明の第５実施形態にかかるモジュールについて、図９を参照して説明する。図９は本発明の第５実施形態にかかるモジュールを示す図である。 <Fifth Embodiment>
A module according to a fifth embodiment of the present invention will be described with reference to FIG. FIG. 9 is a diagram showing a module according to the fifth embodiment of the present invention.
　この実施形態にかかるモジュールが、図７を参照して説明した第３実施形態と異なるのは、図９に示すように、モジュール１００ｆの配線基板１０１の他方主面に端子集合体１０が実装されることにより、第２樹脂層１０４に接続端子１１による層間接続導体が設けられている点である。 The module according to this embodiment differs from the third embodiment described with reference to FIG. 7 in that the terminal assembly 10 is mounted on the other main surface of the wiring board 101 of the module 100f as shown in FIG. Thus, an interlayer connection conductor by the connection terminal 11 is provided on the second resin layer 104.
　また、この実施形態では、第２樹脂層１０４に設けられた接続端子１１により形成された層間接続導体に接続されるように、第２樹脂層１０４にさらに電子部品１０２が実装されている。その他の構成は上記した第１～第４実施形態と同様の構成であるため、同一符号を付すことによりその構成の説明は省略する。 In this embodiment, an electronic component 102 is further mounted on the second resin layer 104 so as to be connected to the interlayer connection conductor formed by the connection terminals 11 provided on the second resin layer 104. Since other configurations are the same as those in the first to fourth embodiments described above, description of the configurations is omitted by giving the same reference numerals.
　このように構成すると、配線基板１０１の他方主面にさらに接続端子１１を実装することにより、第２樹脂層１０４に接続端子１１による層間接続導体を形成することができる。また、第２樹脂層１０４に、第２樹脂層１０４に設けられた接続端子１１に接続されるように電子部品１０２がさらに実装されているため、モジュール１００ｄに実装される電子部品１０２の実装密度をさらに高めることができるので、実用的である。 With this configuration, the connection terminal 11 is further mounted on the other main surface of the wiring substrate 101, whereby an interlayer connection conductor using the connection terminal 11 can be formed on the second resin layer 104. Further, since the electronic component 102 is further mounted on the second resin layer 104 so as to be connected to the connection terminal 11 provided on the second resin layer 104, the mounting density of the electronic component 102 mounted on the module 100d Is practical because it can be further increased.
　なお、配線基板１０１の他方主面に実装されて第２樹脂層１０４の表面に露出する接続端子１１の他方端部の端面を、第１樹脂層１０３に設けられている接続端子１１の他方端部の端面と同様に構成してもよく、このようにすると、配線基板１０１の他方主面側においても、上記した第１実施形態と同様の効果を奏することができる。 The end surface of the other end of the connection terminal 11 mounted on the other main surface of the wiring substrate 101 and exposed on the surface of the second resin layer 104 is the other end of the connection terminal 11 provided on the first resin layer 103. The same configuration as that of the end surface of the part may be used, and in this way, the same effect as that of the first embodiment described above can be obtained also on the other main surface side of the wiring substrate 101.
　＜接続端子の変形例＞
　接続端子の変形例について図１０を参照して説明する。図１０は（ａ）～（ｃ）はそれぞれ異なる接続端子の変形例を示す。なお、図１０（ａ）～（ｃ）はそれぞれ要部拡大図であり、上記した第１～第５実施形態と同様の構成については、同一符号を付すことによりその構成の説明は省略する。また、以下で説明する接続端子の変形例は、配線基板１０１の一方主面および他方主面のいずれに実装されても同様の効果を奏することができるが、以下では、接続端子の変形例が配線基板１０１の一方主面に実装された場合についてのみ説明する。 <Modification of connection terminal>
A modification of the connection terminal will be described with reference to FIG. 10A to 10C show modified examples of different connection terminals. FIGS. 10 (a) to 10 (c) are enlarged views of main parts, and the same components as those in the first to fifth embodiments are denoted by the same reference numerals, and the description of the components is omitted. In addition, the modification example of the connection terminal described below can achieve the same effect regardless of whether it is mounted on one of the main surface and the other main surface of the wiring board 101. Only the case where it is mounted on one main surface of the wiring board 101 will be described.
　図１０（ａ）に示す例では、配線基板１０１の一方主面に、接続端子１１の断面積よりも大面積のランド電極１０１ｂが設けられており、接続端子１１は、はんだＳによりランド電極１０１ｂに実装される。このように構成すると、はんだＳは、接続端子１１の断面積よりも大面積のランド電極１０１ｂ全体に広っており、ランド電極１０１ｂ全体に広がることにより接続端子１１の一方端部の端面および外周面を鍔状に覆って形成されているはんだＳが第１樹脂層１０３に引っ掛かるため、接続端子１１の第１樹脂層１０３から抜け落ちるのを防止することができる。なお、接続端子１１と実装用電極１０１ｂとの間にもはんだなどの接合剤Ｓが配置されていてもよい。 In the example shown in FIG. 10A, a land electrode 101b having a larger area than the cross-sectional area of the connection terminal 11 is provided on one main surface of the wiring board 101. The connection terminal 11 is connected to the land electrode 101b by solder S. To be implemented. With this configuration, the solder S spreads over the entire land electrode 101b having a larger area than the cross-sectional area of the connection terminal 11, and spreads over the entire land electrode 101b, whereby the end surface and the outer periphery of one end of the connection terminal 11 are spread. Since the solder S formed so as to cover the surface like a bowl is caught by the first resin layer 103, it is possible to prevent the solder S from falling off from the first resin layer 103 of the connection terminal 11. A bonding agent S such as solder may be disposed between the connection terminal 11 and the mounting electrode 101b.
　図１０（ｂ）に示す例では、接続端子１１ｃは、一方端部の径が他方端部の径よりも大径に形成されることによりテーパ状に形成されている。また、配線基板１０１の一方主面に、接続端子１１ｃの大径側の断面積よりも大面積のランド電極１０１ｂが設けられている。そして、接続端子１１ｃの大径側の一方端部がはんだＳによりランド電極１０１ｂに実装される。このように構成すると、接続端子１１ｃは、第１樹脂層１０３に楔状に設けられるため、接続端子１１ｃの大径部分が第１樹脂層１０３に引っ掛かると共に、接続端子１１ｃの大径側の断面積よりも大面積のランド電極１０１ｂ全体に広がることにより接続端子１１ｃの一方端部の端面および外周面を鍔状に覆って形成されたはんだＳが樹脂層１０３に引っ掛かるため、接続端子１１ｃが第１樹脂層１０３からの抜け落ちるのを確実に防止することができる。なお、接続端子１１ｃと実装用電極１０１ｂとの間にもはんだなどの接合剤Ｓが配置されていてもよい。実装用電極１０１ｂの面積は接続端子１１ｃの大径側の断面積と同等であってもよい。 In the example shown in FIG. 10B, the connection terminal 11c is formed in a tapered shape by forming the diameter of one end portion larger than the diameter of the other end portion. A land electrode 101b having a larger area than the cross-sectional area of the connection terminal 11c on the large diameter side is provided on one main surface of the wiring board 101. Then, one end portion on the large diameter side of the connection terminal 11c is mounted on the land electrode 101b with solder S. If comprised in this way, since the connection terminal 11c is provided in a wedge shape in the 1st resin layer 103, while the large diameter part of the connection terminal 11c is hooked on the 1st resin layer 103, the cross-sectional area of the large diameter side of the connection terminal 11c Since the solder S formed so as to cover the end surface and the outer peripheral surface of one end portion of the connection terminal 11c in a bowl shape by being spread over the land electrode 101b having a larger area than the land electrode 101b, the connection terminal 11c becomes the first terminal. It is possible to reliably prevent the resin layer 103 from falling off. A bonding agent S such as solder may be disposed between the connection terminal 11c and the mounting electrode 101b. The area of the mounting electrode 101b may be equal to the cross-sectional area on the large diameter side of the connection terminal 11c.
　図１０（ｃ）に示す例では、接続端子１１ｄは、他方端部の径が一方端部の径よりも大径に形成されることによりテーパ状に形成されている。また、配線基板１０１の一方主面に、接続端子１１ｄの小径側の一方端部の断面積よりも大面積のランド電極１０１ｂが設けられている。そして、接続端子１１ｄの小径側がはんだＳによりランド電極１０１ｂに実装される。このように構成すると、接続端子１１ｄの小径側の断面積よりも大面積のランド電極１０１ｂ全体に広がることにより接続端子１１ｄの一方端部の端面および外周面を鍔状に覆って形成されたはんだＳが樹脂層１０３に引っ掛かるため、接続端子１１ｄの樹脂層１０３からの抜けを防止できる。なお、接続端子１１ｄと実装用電極１０１ｂとの間にもはんだなどの接合剤Ｓが配置されていてもよい。 In the example shown in FIG. 10 (c), the connection terminal 11d is formed in a tapered shape by forming the diameter of the other end portion larger than the diameter of the one end portion. In addition, a land electrode 101b having a larger area than the cross-sectional area of one end portion on the small diameter side of the connection terminal 11d is provided on one main surface of the wiring board 101. The small diameter side of the connection terminal 11d is mounted on the land electrode 101b with solder S. With this configuration, the solder formed so as to cover the end surface and the outer peripheral surface of one end of the connection terminal 11d in a bowl shape by spreading over the entire land electrode 101b having a larger area than the cross-sectional area of the connection terminal 11d on the small diameter side. Since S is caught on the resin layer 103, the connection terminal 11d can be prevented from coming off from the resin layer 103. Note that a bonding agent S such as solder may be disposed between the connection terminal 11d and the mounting electrode 101b.
　また、接続端子１１ｄの大径側の他方端部が第１樹脂層１０３の表面に露出することにより、大面積のランド状の外部接続用端子１１ａを容易にモジュールに形成することができる、モジュールがマザー基板などに実装されるときの電気的接続性および接合強度の向上を図ることができる。 Further, the other end portion on the large-diameter side of the connection terminal 11d is exposed on the surface of the first resin layer 103, so that the land-shaped external connection terminal 11a having a large area can be easily formed in the module. Can be improved in electrical connectivity and bonding strength when mounted on a mother board or the like.
　なお、本発明は上記した各実施形態に限定されるものではなく、その趣旨を逸脱しない限りにおいて、上記したもの以外に種々の変更を行なうことが可能であり、上記した構成をどのように組合わせてもよい。 The present invention is not limited to the above-described embodiments, and various modifications other than those described above can be made without departing from the spirit of the present invention. You may combine them.
　本発明は、モジュールの配線基板に柱状の接続端子を表面実装技術を用いて実装することにより、モジュールの層間接続導体を形成する技術に広く適用することができ、種々の電子部品を配線基板に搭載することにより、種々の機能を有するモジュールを構成することができる。 The present invention can be widely applied to a technique for forming an interlayer connection conductor of a module by mounting columnar connection terminals on the circuit board of the module using surface mounting technology, and various electronic components can be applied to the wiring board. By mounting, modules having various functions can be configured.
　１１，１１ｃ，１１ｄ　　接続端子
　１１ａ　　外部接続端子
　１１ｂ　　めっき
　１００，１００ａ，１００ｂ，１００ｃ，１００ｄ，１００ｅ，１００ｆ　　モジュール
　１０１　　配線基板
　１０１ａ，１０１ｂ　　ランド電極
　１０２　　電子部品
　１０３　　第１樹脂層
　１０４　　第２樹脂層
　２００　　モジュール搭載部品
　２０１　　実装基板
　Ｂ　　バンプ
　Ｓ　　はんだ 11, 11c, 11d Connection terminal 11a External connection terminal 11b Plating 100, 100a, 100b, 100c, 100d, 100e, 100f Module 101 Wiring board 101a, 101b Land electrode 102 Electronic component 103 First resin layer 104 Second resin layer 200 Module Mounted parts 201 Mounting board B Bump S Solder

Claims (12)

  1. 　配線基板の少なくとも一方主面に電子部品が実装されたモジュールにおいて、
    　その一方端部が前記配線基板の一方主面にはんだにより接続されて実装されて層間接続導体を形成する柱状の接続端子と、
    　前記配線基板の一方主面に前記電子部品および前記接続端子を被覆して設けられた第１樹脂層と、
    　前記接続端子の他方端部の端面および、該端面の外縁部と前記第１樹脂層との境界部が、前記第１樹脂層の前記配線基板の一方主面との対向面に露出して形成された外部接続用の外部接続端子と
    を備えていることを特徴とするモジュール。     In a module in which electronic components are mounted on at least one main surface of the wiring board,
    A columnar connection terminal having one end thereof connected to one main surface of the wiring board by solder and mounted to form an interlayer connection conductor;
    A first resin layer provided on one main surface of the wiring board so as to cover the electronic component and the connection terminal;
    An end surface of the other end portion of the connection terminal and a boundary portion between the outer edge portion of the end surface and the first resin layer are exposed on a surface facing the one main surface of the wiring board of the first resin layer. And an external connection terminal for external connection.
  2. 　前記接続端子の側面にめっきが施されていることを特徴とする請求項１に記載のモジュール。 The module according to claim 1, wherein the side surface of the connection terminal is plated.
  3. 　前記外部接続端子を成す前記接続端子の他方端部の端面にめっきが施されていることを特徴とする請求項１または２に記載のモジュール。 3. The module according to claim 1 or 2, wherein the end surface of the other end of the connection terminal constituting the external connection terminal is plated.
  4. 　前記めっきは金めっきであることを特徴とする請求項２または３に記載のモジュール。 The module according to claim 2 or 3, wherein the plating is gold plating.
  5. 　前記外部接続端子にバンプが形成されていることを特徴とする請求項１ないし４のいずれかに記載のモジュール。 5. The module according to claim 1, wherein a bump is formed on the external connection terminal.
  6. 　前記接続端子は、前記一方端部が前記配線基板上に形成されたランド電極にはんだにより接合されて実装されており、
    　前記はんだは、前記一方端部の端面および外周面を鍔状に覆って形成されていることを特徴とする請求項１ないし５のいずれかに記載のモジュール。     The connection terminal is mounted by soldering the one end to a land electrode formed on the wiring board,
    6. The module according to claim 1, wherein the solder is formed so as to cover an end surface and an outer peripheral surface of the one end portion in a bowl shape.
  7. 　前記接続端子は、前記一方端部の径が前記他方端部の径よりも大径に形成されていることを特徴とする請求項１または６のいずれかに記載のモジュール。 7. The module according to claim 1, wherein the connecting terminal is formed such that a diameter of the one end is larger than a diameter of the other end.
  8. 　前記接続端子は、前記他方端部の径が前記一方端部の径よりも大径に形成されていることを特徴とする請求項１ないし６のいずれかに記載のモジュール。 The module according to any one of claims 1 to 6, wherein the connection terminal is formed such that the diameter of the other end is larger than the diameter of the one end.
  9. 　前記配線基板の他方主面に他の電子部品がさらに実装されていることを特徴とする請求項１ないし８のいずれかに記載のモジュール。 9. The module according to claim 1, wherein another electronic component is further mounted on the other main surface of the wiring board.
  10. 　前記配線基板の他方主面に前記他の電子部品を被覆して設けられた第２樹脂層をさらに備えることを特徴とする請求項９に記載のモジュール。 The module according to claim 9, further comprising a second resin layer provided on the other main surface of the wiring board so as to cover the other electronic component.
  11. 　前記配線基板の他方主面に前記接続端子がさらに実装されており、前記第２樹脂層に、前記他方主面に実装された前記接続端子に接続されるように、電子部品がさらに実装されていることを特徴とする請求項１０に記載のモジュール。 The connection terminal is further mounted on the other main surface of the wiring board, and an electronic component is further mounted on the second resin layer so as to be connected to the connection terminal mounted on the other main surface. The module according to claim 10.
  12. 　請求項１ないし１１のいずれかに記載のモジュールと、
    　前記モジュールが実装される実装基板とを備え、
    　前記モジュールは、前記外部接続端子が前記実装基板に接続されていることを特徴とするモジュール搭載部品。     A module according to any of claims 1 to 11,
    A mounting substrate on which the module is mounted,
    The module mounting component, wherein the module has the external connection terminal connected to the mounting board.
PCT/JP2012/072553 2011-12-26 2012-09-05 Module and component equipped with module WO2013099360A1 (en)

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JPH0637414A (en) * 1992-07-14 1994-02-10 Toshiba Corp Ceramic circuit board
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