JP4957163B2 - Composite parts - Google Patents

Description

  The present invention relates to a composite part, and more particularly to a composite part formed by joining a frame-like base to a flat base.

  In order to mount electronic components at high density, composite components are provided in which chip-shaped electronic components are mounted on both sides or one side of a flat substrate.

  For example, as shown in an exploded perspective view of FIG. 17A and a cross-sectional view of FIG. 17B, a composite part in which a frame-like base 2 is attached to one main surface of a flat base 1 has been proposed. On one main surface of the flat substrate 1, the electronic component 3 is mounted inside the frame-shaped substrate 2, the sealing material 4 is filled inside the frame-shaped substrate 2, and the electronic component 3 is filled with the sealing material 4. Seal. An output terminal 5 is provided on the frame-shaped substrate 2 and is electrically connected to the electronic component 3. The output terminal 5 is formed by plating the inner periphery of a through hole (through hole) that penetrates the frame-shaped substrate 2 and cutting the through hole in half to expose the plating. Alternatively, the plated through hole may be filled with solder and protruded in a bump shape.

In this composite component, the output terminal 5 provided on the frame-shaped base 2 is connected to a circuit board (for example, a mother board) and mounted on the circuit board. The flat substrate 1 can be mounted with another electronic component 6 on the surface opposite to the side where the electronic component 3 is mounted. (For example, see Patent Documents 1 to 4)
JP-A-6-216314 Japanese Patent Laid-Open No. 7-50357 JP 2000-101348 A JP 2001-339137 A

  Thus, when joining a composite part formed by combining a flat substrate and a frame substrate to a circuit board, for example, a plated portion on the inner periphery of the through hole of the frame substrate of the composite component is formed on the pad portion of the printed wiring board. When joining with solder or conductive paste, joining may occur in a largely warped state due to the influence of the difference in thermal expansion coefficient α between the printed wiring board and the composite part.

  Further, if the printed wiring board or the composite part is thinned for the purpose of reducing the height, the rigidity is lowered and the warpage is further increased. Therefore, it is difficult to reduce the product height.

  In addition, in terms of heat cycle reliability, a printed circuit board, for example, a printed wiring board pad part, is printed with a solder or a conductive paste when the plated part on the inner periphery of the through hole in the frame-shaped substrate of the composite part is joined. Due to the effect of the difference in coefficient of thermal expansion α between the wiring board and the composite part, stress is applied to the joint between the printed wiring board and the composite part, causing cracks and breaks, causing electrical signal conduction failure and connection failure. It may become.

  Furthermore, in composite parts for portable devices, it is required to improve the bonding reliability against impact stress when dropped.

  In view of such a situation, the present invention is intended to provide a composite component that can reduce warpage generated in a state of being bonded to a circuit board with a simple configuration and can improve bonding reliability. .

  In order to solve the above problems, the present invention provides a composite part configured as follows.

The composite part includes (1) a flat substrate having a main surface on which a plurality of surface electrodes are arranged, (2) a first main surface on which a plurality of first surface electrodes are arranged, and a plurality of second surface electrodes. And a frame-like substrate having a second main surface arranged. The composite part is formed in the flat plate shape via a plurality of the surface electrodes arranged on the main surface of the flat substrate and the first surface electrode arranged on the first main surface of the frame-shaped substrate. The base body and the frame-shaped base body are bonded together. The frame-shaped substrate is a resin molded in a state where a connecting member in which a first piece and a second piece are continuous at both ends of an intermediate piece and a portion to be the connecting member are inserted into a mold. And a frame member. The first surface electrode and the second surface electrode are formed by the first piece and the second piece of the connection member, and are exposed from the frame member made of resin. The frame member of the frame-shaped substrate is formed with a slit communicating with the second main surface between the second surface electrodes.

  According to the said structure, a frame-shaped base | substrate becomes easy to deform | transform by forming a slit. Therefore, the warp that occurs in the state of being bonded to the circuit board can be mitigated by the deformation of the frame-shaped substrate. Further, even if thermal stress or impact stress is applied in a state where the composite component is bonded to the circuit board, it can be mitigated by deformation of the frame-like substrate, so that the bonding reliability is improved.

Moreover, the manufacturing process of the frame-shaped substrate can be simplified, the manufacturing cost can be reduced, and the degree of freedom in selecting the material for the connection member and the frame member is increased.

  A slit can be easily formed in the resin frame member. In addition, since the resin frame member is easily deformed compared to ceramic or the like, the effect of alleviating warpage occurring in a state where the composite part is joined and the effect of improving the joining reliability are high.

Preferably, the frame member of the frame-like substrate, that has a first surface electrode and the second surface electrode is formed by punching and bending a thin metal plate.

In this case, thermal stress and impact stress can be absorbed by the elastic deformation of the connecting member, and the joining reliability can be improved .

  Preferably, the connection member has flexibility.

  In this case, the relative angle or distance between the first surface electrode and the second surface electrode changes when the connecting member bends following the deformation of the frame member or when the connecting member bends alone. Therefore, warpage can be alleviated without lowering the bonding reliability.

  Preferably, the second surface electrode of the frame-shaped substrate is a terminal electrode for connecting the composite component to a circuit board.

  In this case, the stress acting on the joint portion between the composite component and the circuit board can be relaxed, and the joint reliability can be improved.

  Preferably, the flat substrate is a ceramic multilayer substrate formed by laminating a plurality of ceramic layers.

  The ceramic multilayer substrate is suitable for composite parts because the mounting density can be increased by forming an electric circuit therein. The ceramic multilayer substrate is more fragile than an alumina substrate or the like, but by forming a slit in the frame, it is possible to relieve thermal stress and impact stress and prevent the substrate from being broken.

  The composite component of the present invention can alleviate the warpage of the composite component that occurs in a state of being bonded to the circuit board by a simple configuration in which a slit is formed in the frame-shaped substrate, and can improve the bonding reliability. .

  Hereinafter, examples of the present invention will be described with reference to FIGS.

  <Basic Configuration> First, the configuration of the composite component 10 common to each embodiment will be described with reference to FIG.

  As shown in the cross-sectional view of FIG. 16A and the enlarged cross-sectional view of the main part of FIG. 16B, in the composite component 10, the frame body 20 is bonded to the one main surface 12b of the flat substrate 12.

  A chip-like electronic component 52 such as an IC chip is mounted on one main surface 12 b of the substrate 12, and a terminal of the chip-like electronic component 52 and a pad 17 provided on the one main surface 12 b of the substrate 12 are connected by a bonding wire 53. It is connected. Note that a chip-like electronic component, such as a surface-mounted component (SMD), to be connected by other than wire bonding may be mounted on the one main surface 12b of the substrate 12.

  Chip-like electronic components 40 and 42 such as chip capacitors and IC chips are mounted on the other main surface 12a of the substrate 12 as necessary, and terminals of the chip-like electronic components 40 and 42 are obtained by solder reflow or flip-chip bonding. And a terminal 18 provided on the other main surface 12a of the substrate 12 are connected.

  The board | substrate 12 should just be a structure which can mount an electronic component in single side | surface or both surfaces for density increase. The substrate 12 is, for example, a ceramic multilayer substrate in which a plurality of ceramic layers are stacked. The ceramic multilayer substrate is preferable as the substrate 12 of the composite component 10 because the mounting density can be increased by forming the in-plane conductor pattern 14 and the via-hole conductor 13 to configure the electric circuit therein. However, the substrate 12 is not limited to a ceramic multilayer substrate, and may be a substrate using a material other than ceramic (for example, a printed wiring board, a flexible printed wiring board, an alumina substrate, etc.) even if it is a ceramic substrate having only one layer. Also good.

  In the frame 20, a plurality of connection members 30 are arranged on a frame member 22 made of an insulating material (for example, resin).

  The frame member 22 has a through hole 23 in the center, and extends in a frame shape along the peripheral edge portion of the one main surface 12 b of the rectangular substrate 12. A concave portion (cavity) is formed by the through hole 23 of the frame member 22, and the above-described chip-shaped electronic component 52 and the pad 17 are arranged on the one main surface 12 b of the substrate 12 which becomes the bottom surface of the concave portion. The recess (cavity) is filled with a sealing material 58, and the chip-shaped electronic component 52 and the bonding wire 53 are sealed by the sealing material 58.

  The connection members 30 are arranged on the four sides of the frame member 22 so as to face each other through the through holes 23 of the frame member 22. Each connecting member 30 is a member having a substantially U-shaped cross section in which two bent portions 33 and 35 are formed by bending a belt-shaped metal thin plate at a right angle, and a first piece 32 and a second piece are respectively formed at both ends of the intermediate piece 34. The piece 36 is continuous. The intermediate piece 34 penetrates the inside of the frame member 22. The first piece 32 is a surface electrode that extends along the first main surface 22 a facing the substrate 12 of the frame member 22. The second piece 36 is a surface electrode that extends along the second main surface 22 b on the opposite side of the frame member 22 from the substrate 12 and is exposed to the outside. The first piece 32 and the second piece 36 extend in a direction in which the connection member 30 is opposed to each other through the through hole 23 of the frame member 22.

  The end portions on the same side of the first piece 32 and the second piece 36 of the connection member 30, that is, the end portions on the through hole 23 side of the frame member 22 are respectively continuous with both ends of the intermediate piece 34. That is, the first piece 32 and the second piece 36 are arranged so that the respective tips 31 and 37 face the outside, and the intermediate piece 34 is arranged on the inside.

  The first piece 32 and the second piece 36 have different lengths. That is, the tip 37 of the second piece 36 does not reach the outer peripheral surface 24 of the frame member 22, but the tip 31 of the first piece 32 reaches the outer peripheral surface 24 of the frame member 22.

  The first piece 32 of the connection member 30 is joined to the terminal 16 provided on the one main surface 12 b of the substrate 12 by the solder 19. Thereby, the frame body 20 is joined to the one main surface 12 b side of the substrate 12 through the first piece 32, the solder 19, and the terminal 16.

  16B, the second piece 36 of the connection member 30 exposed on the surface 22a opposite to the substrate 12 of the frame member 22 is a circuit substrate such as a mother substrate. It is joined to a surface electrode 62 such as 60 joining lands via solder 66 or conductive paste. As a result, the terminal 16 provided on the one main surface 12 b of the substrate 12 is electrically connected to the surface electrode 62 of the circuit substrate 60 through the solder 19, the connection member 30, and the solder 66.

  The thickness of the metal thin plate used for the connecting member 30 is preferably 50 μm to 300 μm.

  If the thickness of the metal thin plate used for the connection member 30 is less than 50 μm, the variation during bending becomes large, and the variation in the position and height of the first piece 32 and the second piece 36 becomes large. When the variation in the position and height of the first piece 32 and the second piece 36 increases, the alignment accuracy between the frame 20 and the substrate 12 decreases.

  In order to reliably bond the frame 20 and the substrate 12, the size of the substrate 12 can be reduced by enlarging the terminal 16 of the substrate 12 to be bonded to the first piece 32 in consideration of a margin for the positional deviation of the first piece 32. As a result, downsizing of the composite part 10 is impaired.

  If the height of the first piece 32 or the second piece 36 varies, for example, the solder thickness varies between the substrate 12 and the frame body 20 or between the frame body 20 and the circuit board 60, resulting in improved bonding reliability. Damaged. Increasing the height dimension allowance for the height variation inhibits the reduction of the height of the composite component 10.

  Further, the vicinity of the bent portions 33 and 35 of the connection member 30 is repeatedly subjected to fatigue due to thermal stress and impact stress. However, if the thickness is small, the fatigue reliability is liable to be deteriorated, so that the joint reliability is impaired.

  When the thickness of the metal thin plate used for the connecting member 30 exceeds 300 μm, the bending process becomes difficult, and the variation in bending angle and the variation in height become large. Further, the interval between the punching and bending is reduced, and the length (the dimension in the direction in which the first piece 32, the intermediate piece 34, and the second piece 36 are continuous) and the width of the first piece 32, the intermediate piece 34, and the second piece 36. Since (the dimension in a direction perpendicular to the direction in which the first piece 32, the intermediate piece 34, and the second piece 36 are continuous) cannot be reduced, the composite component 10 is prevented from being reduced in size and height.

  The connection member 30 is made of Ni / Sn, Ni / Au, Ni / solder in order to improve wettability with solder and conductive adhesive used for bonding to the substrate 12 and the circuit board 60 and to increase bonding strength. Etc. may be plated. Such plating may be performed on the entire surface of the connection member 30 or only on the bonding surface of the first piece 32 and the second piece 36.

  The connection member 30 formed by bending a thin metal plate by plastic working is easily elastically deformed in three directions of X, Y, and Z. Since the connecting member 30 has flexibility, it can follow the deformation of the frame member 22.

  <Example 1> Example 1 will be described with reference to FIGS.

  As shown in the perspective view of FIG. 1A, in the frame body 20, the second piece 36 of the connecting member 30 that is hatched is exposed on the second main surface 22b opposite to the substrate 12. A slit 26 is formed in the frame member 22 of the frame body 20. The slit 26 communicates with the second main surface 22 b on the opposite side of the substrate 12 between the exposed second pieces 36 of the connection member 30. The slit 26 is a bottomed groove that penetrates between the outer peripheral surface 24 and the inner peripheral surface 25 of the frame member 22 but does not reach the first main surface 22a of the frame member 22 on the substrate 12 side.

  It is not essential that the slits 26 are formed between the second pieces 36 of all the connecting members 30 as shown in FIG. For example, as shown in the perspective view of FIG. 1B, the slit 26 may be formed only between the second pieces 36 of some of the connection members 30. In this case, it is preferable that at least one slit 26 is formed on each side of the frame member 22 so that the frame body 20a is easily deformed in all directions.

  As shown in the side view of FIG. 3, the frame body 20 of the composite component 10 a is joined to the substrate 12 such that the slit 26 is disposed on the side opposite to the substrate 12.

  When the slit 26 penetrating between the outer peripheral surface 24 and the inner peripheral surface 25 of the frame member 22 is provided in the frame member 22, the sealing material 58 flows out from the slit 26. In order to prevent this, as shown in the cross-sectional view of FIG. 2, a dam 59 is formed in advance along the inner peripheral surface 25 of the frame 20 inside the frame 20 joined to the substrate 12. The sealing material 58 is filled inside the dam 59. The dam 59 is formed by applying an epoxy resin that has high thixotropy and does not wet and spread.

  As in the composite part 10b shown in the cross-sectional view of FIG. 4, when there is no wire bond mounting inside the frame 20 on the one main surface 12b side of the substrate 12, that is, the surface mounting part 50, Au such as IC or FET, When only the flip chip mounting parts 54 and 56 by solder bumps are mounted, the structure without the sealing material 58 can be obtained regardless of whether or not the underfill resin 55 is filled in the flip chip mounting.

  As shown in FIGS. 2 and 4, chip-like electronic components 40 and 42 and electronic components 44 that are flip-chip mounted by Au or solder bumps are mounted on the other main surface 12 a of the substrate 12. A metal case 46 is bonded to the other main surface 12a of the substrate 12 as necessary. This is for making the mounter easy to adsorb when mounting the composite parts 10a, 10b on a circuit board such as a mother board, and for electromagnetic shielding especially when used for high frequency.

  When the magnetic shield is not required, as in the composite component 10c shown in the cross-sectional view of FIG. 5, the other main surface 12a of the substrate 12 is thermoset such as the epoxy resin 48 so as to cover the mounting components 40, 42, and 44. An adhesive resin is applied or transfer molding is performed to flatten the top surface 49.

  As shown in the cross-sectional view of FIG. 6, the composite component 10a is joined to a circuit board 60 such as a mother board and mounted on both surfaces 12a and 12b of the board 12, and the metal case 40, 42, 44, 50, 52 and the metal case. 46 is electrically connected to the circuit board 60.

  Next, the manufacturing process of the composite component 10a will be described with reference to FIGS.

  First, the substrate 12 and the frame body 20 are prepared.

  In the case of a ceramic multilayer substrate, the substrate 12 is formed by stacking a plurality of ceramic layers, for example. As shown in the cross-sectional view of FIG. 16 (a), the in-plane conductor pattern 14 and via-hole conductor are formed inside using a conductive paste mainly composed of Ag, Ag / Pd, Ag / Pt, Cu, CuO, or the like. 13 is formed. Since such a configuration uses Ag or Cu having low resistance, the signal loss is small and it is put into practical use as a high-frequency component or module. A terminal 16 and a pad 17 are formed on one main surface 12b of the substrate 12, and a terminal 18 serving as a bonding electrode (bonding land) is formed on the other main surface 12a. The terminals 16 and 18 and the pad 17 are plated with Ni / Sn, Ni / Au, Ni / Pd / Au, or Ni / solder as necessary.

Specifically, an unfired ceramic green sheet having a thickness of about 10 to 200 μm in which portions to be the in-plane conductor pattern 14 and the via-hole conductor pattern 13 are formed, and a constraint of sintering at a temperature higher than the firing temperature of the ceramic green sheet Prepare with layers. The green ceramic green sheet includes a low-temperature sintered ceramic material, and the sintering temperature is 1050 ° C. or lower. Specific examples of the low-temperature sintered ceramic material include a glass composite LTCC (Low Temperature Co-fired Ceramic) material obtained by mixing borosilicate glass with ceramic powder such as alumina or forsterite, ZnO-MgO-Al. Crystallized glass-based LTCC material using ₂ O ₃ —SiO ₂ -based crystallized glass, BaO—Al ₂ O ₃ —SiO ₂ -based ceramic powder and Al ₂ O ₃ —CaO—SiO ₂ —MgO—B ₂ O ₃ Non-glass type LTCC material using a ceramic ceramic powder or the like. The constraining layer is made of a material containing alumina. Next, the unfired ceramic green sheet and the constraining layer are laminated in an appropriate order to form a composite laminate in which constraining layers are laminated on both main surfaces of a laminate in which a plurality of unfired ceramic green sheets are laminated. . Next, after firing this composite laminate at the sintering temperature of the ceramic green sheet, the unsintered constraining layer is removed, and the substrate 12 formed by sintering the unfired ceramic green sheet is taken out.

  The frame body 20 is produced by embedding the connecting member 30 formed by punching and bending a metal thin plate in the frame member 22 by resin molding.

  That is, as shown in the plan view of FIG. 7, a metal thin plate such as bronze, white, or Ni alloy is punched out with a mold, and a plurality of strip-like portions 74 whose tips 76 face each other are provided inside the frame portion 72. A plate member 70 is formed.

  Next, as shown in the perspective view of the main part in FIG. 8, the tip 76 side of the opposed band-like part 74 is bent twice at a right angle, and the part that becomes the connection member 30 indicated by the solid line is connected to the frame part 72. Form as it is.

  Next, as shown in FIG. 9, a resin is molded into a portion to be the connection member 30 to form a frame member 22. At this time, the portion to be the first piece 32 and the portion to be the second piece 36 of the connecting member 30 are along the inner surface of the mold, and the portion to be the intermediate piece 34 is separated from the inner surface of the mold so that the LCP ( Resin molding is performed by injection molding of a thermoplastic resin such as liquid crystal polymer) or PPS (polyphenylene sulfide), or by transfer molding of a thermosetting resin such as an epoxy resin.

  Preferably, the slit 26 is formed at the same time as the resin molding. In this case, a post-process for forming the slit 26 in the frame member 22 by cutting or the like becomes unnecessary.

  As shown in the cross-sectional view of FIG. 10, the part on the frame part 72 side of the belt-like part 74 that protrudes from the molded resin (that is, the frame member 22) is cut along the outer peripheral surface 24 of the frame member 22. Thereby, the tip 31 of the first piece 32 reaches the outer peripheral surface 24 of the frame member 22.

  Next, as shown in the cross-sectional view of FIG. 11, the substrate 12 and the frame member 22 are joined and components are mounted.

  That is, as shown in FIG. 11A, a conductive paste containing solder, Ag or the like is printed on the terminals 16 and 18 (see FIG. 16A) of the one main surface 12b of the substrate 12, and the frame 20 In addition, the conductive paste is thermally cured in a state where the surface mount component 50 is mounted and the first piece 32 of the connection member 30 of the frame 20 and the surface electrode of the surface mount component 50 are in contact with the conductive paste. The frame body 20 and the surface mount component 50 are joined to the substrate 12 by the solder solidified by the paste. Note that the frame 20 and the surface-mounted component 50 may be joined in any order without being joined to the substrate 12 at the same time.

  After joining the substrate 12 and the frame body 20, cleaning is performed to remove dirt on the pad 17 (see FIG. 16A) provided on the one main surface 12 b of the substrate 12.

  Next, as shown in FIG. 11 (b), a chip-like electronic component 52 such as an IC or FET is attached to the one main surface 12b of the substrate 12 from the through-hole 23 of the frame 20, epoxy resin or conductive resin, or the like. And connected between the terminal of the chip-shaped electronic component 50 and the pad 17 (see FIG. 16A) provided on the one main surface 12b of the substrate 12 by a bonding wire 53 such as Au, Al, or Cu. To do. The pad 17 (see FIG. 16A) is usually plated with Ni / Au or Ni / Pd / Au in order to increase the bonding strength.

  Next, as shown in FIG. 11C, along the inner peripheral surface 25 of the frame body 20, an epoxy resin having a high thixotropy and a non-wetting property is applied to form a dam 59.

  Next, as shown in FIG. 11 (d), the inside of the dam 59 is filled with an epoxy resin sealing material 58 having low thixotropy and thermally cured, so that the chip-shaped electronic component 50, the bonding wire 53, and the pad 17 are filled. Is covered with a sealing material 58 and sealed.

  Note that the height of the dam 59 and the sealing material 58 does not exceed the frame body 20. This is to prevent the dam 59 and the sealing material 58 from interfering with the circuit board 60 (see FIG. 16) when the composite component 10 is joined to the circuit board 60 (see FIG. 16).

  When the sealing material 58 is cured, it is turned upside down as shown in FIG. 11 (e), and the terminal 18 (see FIG. 16 (a)) on the other main surface 12a of the substrate 12 contains conductive material such as solder and Ag. Printing paste, mounting chip-like electronic components 40 and 42 such as chip capacitors, reflowing or thermosetting, or flip-chip bonding chip-like electronic components 44 such as IC chips via solder balls, The terminals of the chip-shaped electronic components 40, 42, and 44 are joined to the terminals of the other main surface 12a of the substrate 12. If necessary, an underfill resin 45 made of an epoxy resin is filled between the chip-shaped electronic component 44 that has been flip-chip bonded and the other main surface 12a of the substrate 12, and is thermally cured.

When the metal case 46 is used, as shown in FIG. 11 (f), after joining the chip-like electronic components 40, 42, 44, the metal case 46 made of white or phosphor bronze is used as the other main substrate 12. It is mounted on the surface 12a or the side surface and joined. Bonding of the metal case 46 includes a tower mounting step of electronic chip components 40, 42 and 44 may be performed simultaneously.

  Thus, the composite part 10a is completed.

  By forming slits in the frame bodies 20 and 22a of the composite parts 10a, 10b, and 10c, the frame body can be easily deformed. As a result, it is possible to suppress warpage caused by the influence of the difference in thermal expansion coefficient α by deformation of the frame body at the time of soldering or the like for mounting the composite component on the circuit board. In addition, the composite component can be bonded to a thin circuit board having low rigidity, and the height of a product in which the composite component and the circuit board are bonded can be reduced.

  Furthermore, since the frame can be deformed at the time of a drop impact, the impact stress can be absorbed, so that it is possible to improve the bonding reliability between the connecting member and the board in the composite part and the bonding reliability between the composite part and the circuit board. it can. In particular, in the case where the substrate has a lower bending strength than an alumina substrate or the like, and is a brittle ceramic multilayer substrate including glass or the like, the effect of preventing the substrate from being destroyed by relaxing thermal stress and impact stress is great.

  In terms of heat cycle reliability, the thermal stress due to the difference in coefficient of thermal expansion α between the circuit board and the composite part can be absorbed by deformation of the frame body, and cracks and breaks in joints such as solder and electrical signal conduction Defects and connection defects can be suppressed.

  Since the connecting member disposed in the frame member of the frame of the composite part is a continuous metal terminal bent so as to be plastically deformed, it is elastically deformed in any of the X, Y, and Z directions. In addition, the resin constituting the frame member and the connection member that is a metal terminal are not basically joined, and the connection member is elastically deformed freely in the X, Y, and Z directions even after resin molding. Therefore, the connection member can follow the deformation of the frame member. Therefore, when joining the frame body to the substrate, reflow when mounting the composite component on a circuit board such as a mother board, it can absorb the thermal stress due to the difference in thermal expansion coefficient α of each part due to the heat during the heat cycle, High bonding reliability. In addition, the bonding reliability against impact stress at the time of drop impact is high.

  Since the frame of the composite part is formed, bent, and resin-molded so as to cover the thin metal plate, the process can be simplified and the manufacturing cost can be reduced.

  The substrate of the composite component and the circuit board are bonded together by a connecting member that is basically a bent metal terminal. That is, the stress is absorbed by the elastic deformation of the metal to improve the strength. Therefore, the degree of freedom in selecting the material for the connection member is high.

  Further, the frame body does not need to be firmly joined with the molding resin of the frame member and the metal terminal of the connection member. That is, the flexibility of the resin material of the frame member is high. Inexpensive materials, easy-to-bend materials, and easy-to-mold materials can be selected and are industrially useful.

  Apply epoxy resin with high thixotropy and low wettability along the inner peripheral surface of the frame to form a dam, and fill the inside with an epoxy resin sealant with low thixotropy Can do. Since the dam prevents the sealing material from leaking from the frame, the sealing material does not enter the slit of the frame member to prevent the deformation of the frame member.

  <Example 2> Example 2 will be described with reference to FIG.

  The second embodiment has the same configuration as the first embodiment except that the frame is divided into a plurality of parts. That is, as shown in the perspective view of FIG. 12 (a), two sets of L-shaped members 20p, each having a slit 26 formed between the second pieces 36 hatched and exposed on the second main surface 22b, In a state where the frame divided into 20q is arranged in a rectangular shape, it is bonded to a substrate (not shown). Alternatively, as shown in the perspective view of FIG. 12 (b), two pairs of I-shaped members 20s, each having a slit 26 formed between the second pieces 36 with hatching exposed on the second main surface 22b, In a state where the frame divided into 20t is arranged in a rectangular shape, it is bonded to a substrate (not shown). In any case, gaps 28p, 28q are provided between adjacent members 20p, 20q; 20s, 20t so that deformation does not affect between adjacent members 20p, 20q; 20s, 20t. Is preferred.

  In the second embodiment, in addition to the same effects as those of the first embodiment, warping caused by the difference in the thermal expansion coefficient α can be more effectively suppressed by dividing into a plurality of pieces and separating them into a frame shape.

  <Example 3> Example 3 will be described with reference to FIG.

  As shown in the perspective view of FIG. 13, in the frame body 20b, in addition to the slit 26 formed on the second main surface 22b side, a slit 27 is also formed on the first main surface 22a side. Thereby, the frame body 20b becomes easier to deform, and in particular, it becomes easier to bend and deform.

  <Example 4> Example 4 will be described with reference to FIG.

  As shown in the perspective view of FIG. 14, a slit 28 is formed along the inner peripheral surface 25 of the frame 20c.

  In the first embodiment, as shown in FIG. 1, the slit 26 penetrating between the outer peripheral surface 24 and the inner peripheral surface 25 of the frame 20 is formed. It is necessary to form a dam so that the material 58 does not flow out. On the other hand, in the fourth embodiment, the slit 28 does not communicate with the through hole 23 side of the frame 20c and the outside, so that the dam 59 (see FIG. 2) as in the first embodiment is not necessary.

  <Example 5> Example 5 will be described with reference to FIG.

  In Example 5, the frame 20x is not a resin molded body. A resin substrate is used for the frame member 22x, a through hole 23x is formed by punching, a slit 26x is formed by a dicer, and a through hole 22v is formed by a laser or the like. The surface electrode 32x on the first main surface 22 and the surface electrode 36x on the second main surface 22m are formed by plating or transfer of a metal film. The surface electrodes 32x and 36x are electrically connected through a via-hole conductor in which the through-hole 22v is filled with the conductive material 34x or through a through-hole conductor formed by plating the inner peripheral surface of the through-hole 22v. The

  <Summary> As described above, with a simple configuration in which a slit is formed between the surface electrodes provided on the second main surface opposite to the substrate of the frame, in a state of being bonded to the circuit board. The warping that occurs can be mitigated. Further, thermal stress and impact stress acting on the joint portion between the composite component and the circuit board can be relaxed, and the joint reliability between the composite component and the circuit board can be improved.

  The present invention is not limited to the above-described embodiment, and can be implemented with various modifications.

  For example, the shape of the connecting member is arbitrary, and instead of bending the bent portion at a right angle, a shape with a rounded shape may be used. Further, the intermediate piece may be bent into a square shape. Alternatively, the first piece and the second piece may be obliquely connected with an intermediate piece, and the connecting member may be formed in a Z-shaped cross section.

  In addition, the substrate of the composite component (that is, the flat substrate) may be a substrate in which a plurality of terminals connected to the frame (that is, the frame substrate) are provided on the same plane, and the frame is connected to the substrate. A convex portion or a concave portion may be provided in a portion other than the flat portion.

It is a perspective view of a frame. Example 1 It is sectional drawing of a composite component. Example 1 It is a side view of a composite part. (Example) It is sectional drawing which shows the composite component without a sealing material. Example 1 It is sectional drawing which shows the composite component without a metal case. Example 1 It is sectional drawing which shows the state in which the composite component was mounted. Example 1 It is a top view of a plate member. Example 1 It is a perspective view which shows the bending state of a board member. Example 1 It is a perspective view which shows the state at the time of resin mold molding. Example 1 It is sectional drawing of a frame. Example 1 It is sectional drawing which shows the manufacturing process of composite components. Example 1 It is a perspective view of a frame. (Example 2) It is a perspective view of a frame. (Example 3) It is a perspective view of a frame. Example 4 It is a partial cross section perspective view of a frame. (Example 5) It is (a) sectional drawing of a composite component, (b) It is a principal part expanded sectional view. (Examples 1-5) It is (a) disassembled perspective view of composite component, (b) sectional drawing. (Conventional example)

Explanation of symbols

10 Composite parts 12 Substrate (flat substrate)
12a Other main surface 12b One main surface 16 Terminal (surface electrode)
20 frame (frame-shaped substrate)
22 frame member 22a surface (first main surface)
22b surface (second main surface)
23 Through hole 30 Connection member 32 First piece (first surface electrode)
34 Intermediate piece 36 Second piece (second surface electrode)

Claims (5)

A flat substrate having a main surface on which a plurality of surface electrodes are disposed;
A frame-shaped substrate having a first main surface on which a plurality of first surface electrodes are arranged and a second main surface on which a plurality of second surface electrodes are arranged;
The flat substrate and the frame shape through the plurality of surface electrodes arranged on the main surface of the flat substrate and the first surface electrode arranged on the first main surface of the frame substrate. It is a composite part that is bonded to a substrate,
The frame-shaped substrate is
A connecting member in which the first piece and the second piece are respectively continuous at both ends of the intermediate piece;
A frame member that is a resin molded in a state where the portion to be the connection member is inserted into the mold
Have
The first surface electrode and the second surface electrode are formed by the first piece and the second piece of the connection member, and are exposed from the frame member made of resin,
A composite part , wherein a slit communicating with the second main surface is formed between the second surface electrodes in the frame member of the frame-shaped base. The frame member of the frame-like substrate, characterized by the Turkey have said second surface electrode and the first surface electrode is formed by punching and bending a metal sheet, the composite of claim 1 parts. The composite part according to claim 2 , wherein the connection member has flexibility. The composite part according to any one of claims 1 to 3 , wherein the second surface electrode of the frame-shaped base is a terminal electrode for connecting the composite part to a circuit board. The flat base body is characterized in that a ceramic multilayer substrate formed by laminating a plurality of ceramic layers, the composite component according to any one of claims 1-3.

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