JP4725817B2 - Manufacturing method of composite substrate - Google Patents

Manufacturing method of composite substrate Download PDF

Info

Publication number
JP4725817B2
JP4725817B2 JP2008515459A JP2008515459A JP4725817B2 JP 4725817 B2 JP4725817 B2 JP 4725817B2 JP 2008515459 A JP2008515459 A JP 2008515459A JP 2008515459 A JP2008515459 A JP 2008515459A JP 4725817 B2 JP4725817 B2 JP 4725817B2
Authority
JP
Japan
Prior art keywords
piece
substrate
substrate body
main surface
composite
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2008515459A
Other languages
Japanese (ja)
Other versions
JPWO2007132612A1 (en
Inventor
範夫 酒井
幸男 山本
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Murata Manufacturing Co Ltd
Original Assignee
Murata Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Murata Manufacturing Co Ltd filed Critical Murata Manufacturing Co Ltd
Priority to JP2008515459A priority Critical patent/JP4725817B2/en
Publication of JPWO2007132612A1 publication Critical patent/JPWO2007132612A1/en
Application granted granted Critical
Publication of JP4725817B2 publication Critical patent/JP4725817B2/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49811—Additional leads joined to the metallisation on the insulating substrate, e.g. pins, bumps, wires, flat leads
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49861—Lead-frames fixed on or encapsulated in insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/562—Protection against mechanical damage
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/93—Batch processes
    • H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
    • H01L25/165—Containers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3421—Leaded components
    • H05K3/3426—Leaded components characterised by the leads
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73201—Location after the connecting process on the same surface
    • H01L2224/73203—Bump and layer connectors
    • H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/93—Batch processes
    • H01L2224/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L2224/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49805—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers the leads being also applied on the sidewalls or the bottom of the substrate, e.g. leadless packages for surface mounting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01006—Carbon [C]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/014—Solder alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/153—Connection portion
    • H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
    • H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/153—Connection portion
    • H01L2924/1532—Connection portion the connection portion being formed on the die mounting surface of the substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/156—Material
    • H01L2924/15786—Material with a principal constituent of the material being a non metallic, non metalloid inorganic material
    • H01L2924/15787—Ceramics, e.g. crystalline carbides, nitrides or oxides
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901—Structure
    • H01L2924/1904—Component type
    • H01L2924/19041—Component type being a capacitor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/191—Disposition
    • H01L2924/19101—Disposition of discrete passive components
    • H01L2924/19105—Disposition of discrete passive components in a side-by-side arrangement on a common die mounting substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/35—Mechanical effects
    • H01L2924/351—Thermal stress
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10742—Details of leads
    • H05K2201/1075—Shape details
    • H05K2201/10757—Bent leads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10742—Details of leads
    • H05K2201/10886—Other details
    • H05K2201/10924—Leads formed from a punched metal foil
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10742—Details of leads
    • H05K2201/10886—Other details
    • H05K2201/10946—Leads attached onto leadless component after manufacturing the component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10954—Other details of electrical connections
    • H05K2201/10977—Encapsulated connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1572—Processing both sides of a PCB by the same process; Providing a similar arrangement of components on both sides; Making interlayer connections from two sides
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
    • H05K3/0052—Depaneling, i.e. dividing a panel into circuit boards; Working of the edges of circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Combinations Of Printed Boards (AREA)
  • Structure Of Printed Boards (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)

Description

本発明は複合基板及びその製造方法に関し、詳しくは、基板本体の一方主面に接続部材を接合してなる複合基板及びその製造方法に関する。   The present invention relates to a composite substrate and a method for manufacturing the same, and more particularly to a composite substrate formed by bonding a connecting member to one main surface of a substrate body and a method for manufacturing the same.

高密度に電子部品を実装するため、基板本体の両面又は片面にチップ状電子部品を搭載したモジュール部品が提供されている。このようなモジュール部品を他の回路基板に実装するに当たり、モジュール部品の基板本体に枠状の部材やケースを取り付けることが提案されている。この場合、基板本体と他の回路基板との間の電気的接続のため、枠状の部材やケースには配線パターンが形成され、配線パターンの一端が基板本体に接合され、配線パターンの他端が他の回路基板に接合される。   In order to mount electronic components at high density, module components are provided in which chip-shaped electronic components are mounted on both sides or one side of a substrate body. In mounting such a module component on another circuit board, it has been proposed to attach a frame-like member or case to the substrate body of the module component. In this case, for electrical connection between the board body and another circuit board, a wiring pattern is formed on the frame-like member or case, one end of the wiring pattern is joined to the board body, and the other end of the wiring pattern Are bonded to other circuit boards.

例えば特許文献１には、プリント配線板の片面に取着する絶縁体の封止枠の外縁に、スルーホールを半分に切断した平面半円状の端子用凹部を設け、この端子用凹部の内周にめっきを施すことによって、プリント配線板のパッド部と導通接続される外部入出力端子を形成することが開示されている。   For example, in Patent Document 1, a planar semicircular terminal recess having a through hole cut in half is provided on the outer edge of an insulating sealing frame attached to one side of a printed wiring board. It is disclosed that an external input / output terminal that is conductively connected to a pad portion of a printed wiring board is formed by plating the periphery.

また、特許文献２には、成形樹脂材のケース本体から端子面が露出する電子部品搭載用ケースを作製するため、プレス加工により折り曲げたターミナルを、上下一対の金型にアライメントして配置し、樹脂をインサート成形することが開示されている。
特開平６−２１６３１４号公報 特開２００４−２６６０１３号公報 Further, in Patent Document 2, in order to produce an electronic component mounting case in which a terminal surface is exposed from a case body of a molded resin material, a terminal bent by pressing is arranged in alignment with a pair of upper and lower molds, It is disclosed to insert-mold a resin.
JP-A-6-216314 Japanese Patent Laid-Open No. 2004-266013

モジュール部品の基板本体とモジュール部品が実装される他の回路基板との熱膨張率又は線膨張係数に差があると、温度変化によって、枠状の部材やケースに形成した配線パターンやターミナルと基板本体や他の回路基板との接合部分に熱応力が作用する。また、これらの接合部分には、落下衝撃によって衝撃応力が作用する。   If there is a difference in thermal expansion coefficient or linear expansion coefficient between the board body of the module component and another circuit board on which the module component is mounted, the wiring pattern, terminal, and board formed on the frame-shaped member or case due to temperature change Thermal stress acts on the junction with the main body and other circuit boards. Also, impact stress acts on these joints due to drop impact.

特許文献１のように、プリント配線板のパッド部と導通接続される外部入出力端子をめっきで形成した場合には、めっき膜の厚みが薄く（せいぜい５０μｍ）、めっき膜に接続される端子やめっき膜と端子との間のハンダや導電性ペーストは、プリント配線板の主面に対して垂直方向に一直線上に配列され接合されるため、熱応力や衝撃応力に対する接合信頼性が低い。   When the external input / output terminal electrically connected to the pad portion of the printed wiring board is formed by plating as in Patent Document 1, the thickness of the plating film is thin (at most 50 μm), and the terminal connected to the plating film Since the solder and conductive paste between the plating film and the terminal are aligned and bonded in a line perpendicular to the main surface of the printed wiring board, the bonding reliability against thermal stress and impact stress is low.

また、スルーホールに湿式めっきにより成膜すると、めっき液が膜内に残留しやすい。そのため、封止枠の接合、他の回路基板への接合、封止枠内に充填した封止樹脂の硬化などの後工程で温度が１００℃以上になると、残留していためっき液が急激に膨張して、めっき膜に亀裂が入ったり、スルーホールに充填したはんだ内にボイドが発生したりして、熱応力や衝撃応力に対する接合信頼性が低下することがある。   In addition, when the through hole is formed by wet plating, the plating solution tends to remain in the film. Therefore, when the temperature reaches 100 ° C. or higher in the subsequent process such as bonding of the sealing frame, bonding to another circuit board, curing of the sealing resin filled in the sealing frame, the remaining plating solution rapidly The expansion may cause cracks in the plating film or voids in the solder filled in the through holes, which may reduce the bonding reliability against thermal stress and impact stress.

また、封止枠を形成するために、スルーホールを形成し、スルーホール内周面にめっきを施し、あるいははんだを充填するなど、工程が煩雑で製造コストが高くなる。   In addition, in order to form the sealing frame, a through hole is formed, the inner peripheral surface of the through hole is plated, or a solder is filled, so that the process is complicated and the manufacturing cost increases.

また、封止枠内に封止樹脂を充填すると、封止樹脂の硬化収縮によってプリント配線板が反りやすいため、良品率が低く、硬化温度プロファイルを厳密に管理する必要がある。   Further, when the sealing resin is filled in the sealing frame, the printed wiring board is likely to warp due to the curing shrinkage of the sealing resin, so that the yield rate is low and it is necessary to strictly manage the curing temperature profile.

特許文献２のように、折り曲げたターミナルを配置してインサート成形する場合、ターミナルの強度が小さいと、樹脂を充填するときの圧力でターミナルが変形し、最悪、隣接するターミナルに接触してショートする。そのため、小型化しようとしても、ターミナルの幅及び隣接するターミナルとの間の間隔は数百μｍ程度、ケースの枠の幅も数百μｍ程度が限界となる。   When a bent terminal is placed and insert-molded as in Patent Document 2, if the strength of the terminal is small, the terminal is deformed by the pressure when filling the resin, and in the worst case, it contacts with an adjacent terminal and short-circuits. . Therefore, even when trying to reduce the size, the width of the terminal and the interval between the adjacent terminals are limited to about several hundred μm, and the width of the case frame is limited to about several hundred μm.

また、インサート成形のための金型が必要であるため、初期コストが大きい。   Moreover, since a mold for insert molding is required, the initial cost is high.

また、成形樹脂とターミナルの金属との熱膨張率の差によって、ケースがねじれたり反ったりして成形され、それを他の回路基板に接合すると、接合信頼性が低下する。特に端子数が多くなると、接合信頼性の低下が著しい。   Further, when the case is molded by twisting or warping due to the difference in thermal expansion coefficient between the molding resin and the metal of the terminal, and joining it to another circuit board, the joining reliability is lowered. In particular, when the number of terminals is increased, the bonding reliability is significantly reduced.

さらに、圧力で、折り曲げられたターミナル上にも成形樹脂が流れ込み、ハンダ付けできなくなり、そこと他の部材との接合信頼性は低い。   Further, the molding resin also flows onto the bent terminal due to the pressure and cannot be soldered, and the bonding reliability between the resin and other members is low.

インサート成形では、樹脂を注入するためのゲート部分が残るため、その部分を成形後に切り取る必要があり、工程が多くなる。さらに、この切断工程において、幅の細い封止枠にはクラックが入りやすく、最悪の場合には破断する。   In insert molding, since a gate portion for injecting resin remains, it is necessary to cut off the portion after molding, which increases the number of processes. Further, in this cutting process, the narrow sealing frame is easily cracked, and in the worst case, it is broken.

また、封止枠を基板にはんだ付けするためのリフロー時に、熱膨張係数の差により基板が反り、品質の低下を招くことがある。特に、セラミック基板に、樹脂成形した封止枠を接合する場合、セラミック基板の熱膨張係数が５〜１１ｐｐｍ／℃、封止枠に用いる樹脂の熱膨張係数が２０〜２００ｐｐｍ／℃であり、熱膨張係数の差が大きくなるため、品質低下傾向が顕著となる。   In addition, during reflow for soldering the sealing frame to the substrate, the substrate may be warped due to a difference in thermal expansion coefficient, leading to deterioration in quality. In particular, when a resin-molded sealing frame is bonded to a ceramic substrate, the thermal expansion coefficient of the ceramic substrate is 5 to 11 ppm / ° C., and the thermal expansion coefficient of the resin used for the sealing frame is 20 to 200 ppm / ° C. Since the difference between the expansion coefficients becomes large, the tendency of quality deterioration becomes remarkable.

本発明は、かかる実情に鑑み、簡単な構成で接合部分の熱応力や衝撃応力を緩和することができ、簡単に製造することができる複合基板及びその製造方法を提供しようとするものである。   In view of such a situation, the present invention is intended to provide a composite substrate that can relieve thermal stress and impact stress at a joint portion with a simple configuration and can be easily manufactured, and a method for manufacturing the same.

本発明は、上記課題を解決するために、以下のように構成した複合基板の製造方法を提供する。   In order to solve the above problems, the present invention provides a method for manufacturing a composite substrate configured as follows.

複合基板の製造方法は、第１の工程と第２の工程とを備える。前記第１の工程において、基板本体の一方主面に、金属薄板の折り曲げ加工により形成され中間片の両端にそれぞれ第１片と第２片とが連続する複数の接続部材のそれぞれの前記第１片を接合するとともに、前記基板本体の前記一方主面にチップ状電子部品を搭載する。前記第２の工程において、前記チップ状電子部品の少なくとも一部と少なくとも前記接続部材のそれぞれの前記第１片とを覆い、かつ、少なくとも前記接続部材のそれぞれの前記第２片の前記基板本体とは反対側の面が露出するように、前記基板本体の前記一方主面に樹脂層を形成する。前記第１の工程と前記第２の工程とは、複数個分の前記基板本体を含む集合基板の状態で、複数個分の前記複合基板についてまとめて行う。前記第２の工程の後に、複合基板の製造方法は、前記複合基板の分割線に沿って前記樹脂層にスリットを形成する工程を、さらに備える。 The method for manufacturing a composite substrate includes a first step and a second step. In the first step, each of the first connecting members is formed by bending a thin metal plate on one main surface of the substrate body, and the first piece and the second piece are respectively connected to both ends of the intermediate piece. While joining the pieces, chip-like electronic components are mounted on the one main surface of the substrate body. In the second step, at least a part of the chip-shaped electronic component and at least the first piece of each of the connection members are covered, and at least the substrate body of each of the second pieces of the connection members; A resin layer is formed on the one main surface of the substrate body so that the opposite surface is exposed. The first step and the second step are collectively performed for a plurality of the composite substrates in a state of a collective substrate including a plurality of the substrate bodies. After the second step, the method for manufacturing a composite substrate further includes a step of forming a slit in the resin layer along a dividing line of the composite substrate.

上記の方法で製造された複合基板は、樹脂層から露出している接続部材の第２片の基板本体とは反対側の面が、外部回路基板に接続される。このとき、温度変化や衝撃力等により、接続部材と基板本体との接合部分や接続部材と外部回路基板との接合部分に生じる熱応力や衝撃応力等を、金属薄板の折り曲げ加工により形成された接続部材が弾性変形することによって、緩和することができる。そのため、接合信頼性を向上することができる。   In the composite substrate manufactured by the above method, the surface of the connecting member exposed from the resin layer on the side opposite to the substrate body of the second piece is connected to the external circuit substrate. At this time, due to temperature change, impact force, etc., the thermal stress or impact stress generated at the joint portion between the connection member and the substrate body or the joint portion between the connection member and the external circuit board was formed by bending the thin metal plate. The connection member can be relaxed by elastic deformation. As a result, the bonding reliability can be improved.

上記方法によれば、第２の工程における樹脂層の形成によって、接続部材の埋め込みと基板本体の一方主面に搭載されたチップ状電子部品の固定とを同時に行うことができ、基板本体と外部回路基板との間に間隔を確保するための別部材（以下、単に「別部材」ともいう。）を基板本体の一方主面に接合する場合よりも構成が簡単であり、製造工程も簡単になる。複数個分の複合基板の樹脂層が連続することによって発生する集合基板の反りを、樹脂層にスリットを形成することによって防ぐことができる。 According to the above method, by forming the resin layer in the second step, the connection member can be embedded and the chip-like electronic component mounted on the one main surface of the substrate body can be simultaneously performed. The structure is simpler than the case of joining another member (hereinafter also simply referred to as “another member”) for securing a gap to the circuit board to one main surface of the board body, and the manufacturing process is also simplified. Become. The warpage of the collective substrate caused by the continuous resin layers of a plurality of composite substrates can be prevented by forming slits in the resin layer.

さらに、別部材を基板本体の一方主面に接合する場合よりも、複合基板を小型化することができる。別部材の寸法のばらつきや別部材を基板本体に接合する位置のばらつき等を考慮して、寸法に余裕を持たせ、大きくする必要がないからである。   Furthermore, the composite substrate can be reduced in size compared to the case where another member is joined to the one main surface of the substrate body. This is because there is no need to increase the size and to increase the size in consideration of the variation in the size of the different member and the variation in the position where the different member is joined to the substrate body.

好ましくは、前記第２の工程において、前記チップ状電子部品の少なくとも一部と少なくとも前記接続部材のそれぞれの前記第１片とを覆い、かつ、少なくとも前記接続部材のそれぞれの前記第２片の前記基板本体とは反対側の面が露出するように、前記基板本体の前記一方主面に液状の樹脂を塗布し、硬化させることにより、前記樹脂層を形成する。   Preferably, in the second step, at least a part of the chip-shaped electronic component and at least the first piece of each of the connection members are covered, and at least the second piece of each of the connection members is The resin layer is formed by applying and curing a liquid resin on the one main surface of the substrate body so that the surface opposite to the substrate body is exposed.

圧力を加えて樹脂を成形すると、接続部材が変形したり、接続部材の露出面に樹脂が付着するなどの不都合が生じやすいが、液状の樹脂を塗布することで、このような不都合が生じることなく、樹脂層を容易に形成することができる。また、別部材を形成し、基板本体に接合する場合に比べ、工程が簡単になる。   When resin is molded by applying pressure, inconveniences such as deformation of the connecting member and adhesion of the resin to the exposed surface of the connecting member are likely to occur, but such inconvenience occurs when liquid resin is applied. And the resin layer can be easily formed. Further, the process is simplified as compared with the case where another member is formed and bonded to the substrate body.

好ましくは、複合基板の製造方法は、前記基板本体の他方主面に他のチップ状電子部品を搭載する工程を、さらに備える。   Preferably, the method for manufacturing a composite substrate further includes a step of mounting another chip-shaped electronic component on the other main surface of the substrate body.

この場合、複合基板の実装密度を高めることができる。   In this case, the mounting density of the composite substrate can be increased.

好ましくは、前記基板本体は、１０５０℃以下で焼結する複数のセラミック層を積層してなる積層体の内部に導体パターンを有するセラミック多層基板である。   Preferably, the substrate body is a ceramic multilayer substrate having a conductor pattern inside a laminate formed by laminating a plurality of ceramic layers sintered at 1050 ° C. or lower.

この場合、セラミック多層基板により複合基板の実装密度を高めつつ、接合信頼性を向上することができる。また、セラミック多層基板は他の種類の基板に比べて熱膨張係数が小さいため熱応力が大きくなりやすい上、脆い。したがって、熱応力や衝撃応力からセラミック多層基板自体の破壊を防止する効果が大きい。   In this case, it is possible to improve the bonding reliability while increasing the mounting density of the composite substrate by the ceramic multilayer substrate. Moreover, since the ceramic multilayer substrate has a smaller coefficient of thermal expansion than other types of substrates, the thermal stress tends to increase and is fragile. Therefore, the effect of preventing the destruction of the ceramic multilayer substrate itself from thermal stress and impact stress is great.

好ましくは、前記第１の工程において、前記接続部材は、前記第１片及び前記第２片が前記中間片に関して、すなわち、中間片−第１片の接続部と中間片−第２片の接続部とを結ぶ仮想線に関して、同じ側に延在する。前記接続部材は、前記中間片同士が対向し、かつ、前記第１片及び前記第２片が前記中間片同士の間よりも外側に延在するように、前記第１片が前記基板本体の前記一方主面の前記端子に接合される。   Preferably, in the first step, the connection member is configured such that the first piece and the second piece are related to the intermediate piece, that is, the connection part between the intermediate piece-first piece and the intermediate piece-second piece. The imaginary line connecting the parts extends to the same side. The connection member has the first piece of the substrate body such that the intermediate pieces face each other, and the first piece and the second piece extend outside the space between the intermediate pieces. It is joined to the terminal on the one main surface.

対向する接続部材の中間片間の距離は、第１片及び第２片が中間片同士の間に延在する場合よりも、第１片及び第２片が中間片同士の間よりも外側に延在する場合の方が短くなるため、接続部材と基板本体や外部回路との接合部分に生じる熱応力や衝撃応力等も小さくなる。その結果、接合信頼性は、第１片及び第２片が中間片同士の間に延在する場合よりも、第１片及び第２片が中間片同士の間よりも外側に延在する場合の方が向上する。   The distance between the intermediate pieces of the connecting members facing each other is greater than the distance between the first piece and the second piece than the case where the first piece and the second piece extend between the intermediate pieces. Since the extension is shorter, thermal stress, impact stress, and the like generated at the joint between the connection member and the substrate body or external circuit are also reduced. As a result, the bonding reliability is greater when the first piece and the second piece extend outside than between the intermediate pieces than when the first piece and the second piece extend between the intermediate pieces. Will improve.

好ましくは、前記第１の工程において、前記接続部材は、前記第１片及び前記第２片が前記中間片に関して、すなわち、中間片−第１片の接続部と中間片−第２片の接続部とを結ぶ仮想線に関して、互いに反対側に延在する。前記接続部材は、前記中間片同士が対向し、かつ、前記第１片又は前記第２片の一方同士が前記中間片同士の間よりも外側に延在し、かつ、前記第１片又は前記第２片の他方同士が前記中間片同士の間に延在するように、前記第１片が前記基板本体の前記一方主面の前記端子に接合される。   Preferably, in the first step, the connection member is configured such that the first piece and the second piece are related to the intermediate piece, that is, the connection part between the intermediate piece-first piece and the intermediate piece-second piece. The virtual lines connecting the parts extend to the opposite sides. The connecting member is configured such that the intermediate pieces are opposed to each other, and one of the first piece or the second piece extends to the outside than between the intermediate pieces, and the first piece or the The first piece is joined to the terminal on the one main surface of the substrate body such that the other of the second pieces extends between the intermediate pieces.

この場合、複合基板が接続される外部回路基板が湾曲しても、接続部材の第２片は、樹脂層から離れて弾性変形して、あるいは樹脂層を押圧するように弾性変形して、接合部分の応力を緩和する。第１片は、回動が樹脂層によって阻止される。これにより、接続部材と基板本体や外部回路との接合部分に無理な力が作用しないようにして、接合信頼性を高めることができる。   In this case, even if the external circuit board to which the composite board is connected is curved, the second piece of the connecting member is elastically deformed away from the resin layer, or elastically deformed so as to press the resin layer, and joined. Relieve stress at the part. The first piece is prevented from rotating by the resin layer. Thereby, it is possible to improve the bonding reliability by preventing an excessive force from acting on the bonding portion between the connection member and the substrate body or the external circuit.

好ましくは、前記接続部材は、前記第１片の面積が、前記第２片の面積よりも大きい。   Preferably, the connecting member has an area of the first piece larger than an area of the second piece.

この場合、接続部材の第１片と基板本体の端子との間の接合部分の面積を大きくして、接続部材の第１片と基板本体の端子との間の接合強度を向上させることができる。   In this case, the area of the joining portion between the first piece of the connection member and the terminal of the board body can be increased, and the joining strength between the first piece of the connection member and the terminal of the board body can be improved. .

本発明によれば、簡単な構成で接合部分の熱応力や衝撃応力を緩和することができるので、接合信頼性を向上することができる。また、簡単に製造することができ、製造コストを低減することができる。   According to the present invention, since the thermal stress and impact stress at the joint portion can be relaxed with a simple configuration, the joint reliability can be improved. Moreover, it can manufacture easily and can reduce manufacturing cost.

複合基板の断面図底面図である。（実施例１）It is sectional drawing bottom view of a composite substrate. Example 1 複合基板の要部拡大断面図底面図である。（実施例１）It is a principal part expanded sectional view bottom view of a composite substrate. Example 1 接続部材の製造工程を示す平面図である。（実施例１）It is a top view which shows the manufacturing process of a connection member. Example 1 接続部材の製造工程を示す斜視図である。（実施例１）It is a perspective view which shows the manufacturing process of a connection member. Example 1 接続部材の断面図である。（実施例１、変形例１〜３）It is sectional drawing of a connection member. (Example 1, Modifications 1-3) 基板本体上への接続部材の配置を示す斜視図である。（実施例１）It is a perspective view which shows arrangement | positioning of the connection member on a board | substrate body. Example 1 複合基板の作製工程を示す断面図である。（実施例１）It is sectional drawing which shows the preparation process of a composite substrate. Example 1 複合基板の作製工程を示す断面図である。（実施例２）It is sectional drawing which shows the preparation process of a composite substrate. (Example 2) 複合基板の作製工程を示す断面図である。（実施例３）It is sectional drawing which shows the preparation process of a composite substrate. (Example 3) 複合基板の作製工程を示す断面図である。（実施例４）It is sectional drawing which shows the preparation process of a composite substrate. Example 4 複合基板の作製工程を示す断面図である。（実施例５）It is sectional drawing which shows the preparation process of a composite substrate. (Example 5) 複合基板の作製工程を示す断面図である。（実施例６）It is sectional drawing which shows the preparation process of a composite substrate. (Example 6) 複合基板の作製工程を示す断面図である。（実施例７）It is sectional drawing which shows the preparation process of a composite substrate. (Example 7) 複合基板の断面図である。（実施例２）It is sectional drawing of a composite substrate. (Example 2) 複合基板の変形の説明図である。It is explanatory drawing of a deformation | transformation of a composite substrate. 複合基板の変形の説明図である。It is explanatory drawing of a deformation | transformation of a composite substrate.

符号の説明Explanation of symbols

２，４，６ 複合基板
１０ 基板本体
１０ａ 一方主面
２０，２２ チップ状電子部品
２４ 樹脂層
２６，２７，２８ チップ状電子部品
３０ 接続部材
３２ 第１片
３４ 中間片
３６ 第２片2, 4, 6 Composite substrate 10 Substrate body 10a One main surface 20, 22 Chip-shaped electronic component 24 Resin layer 26, 27, 28 Chip-shaped electronic component 30 Connection member 32 First piece 34 Intermediate piece 36 Second piece

以下、本発明の実施の形態について、図１〜図１６を参照しながら説明する。   Hereinafter, embodiments of the present invention will be described with reference to FIGS.

＜実施例＞ 図１〜図１３を参照しながら、複合基板について説明する。   <Example> A composite substrate will be described with reference to FIGS.

図１（ａ）、図１（ｂ）の断面図に示すように、複合基板２，４は、平板状の基板本体１０の主面１０ａ，１０ｂにチップ状電子部品２０，２２；２６，２７，２８が搭載され、基板本体１０の一方主面１０ａには、複合基板２，４を外部回路基板７０に接続するための入出力端子である接続部材３０が接合されている。   As shown in the cross-sectional views of FIGS. 1A and 1B, the composite substrates 2 and 4 have chip-like electronic components 20 and 22; 26 and 27 on the main surfaces 10 a and 10 b of the flat substrate body 10. , 28 are mounted, and a connecting member 30 that is an input / output terminal for connecting the composite substrates 2, 4 to the external circuit substrate 70 is joined to the one main surface 10 a of the substrate body 10.

基板本体１０は、高密度化のために、片面又は両面に電子部品を実装可能な構造であればよい。基板本体１０は、プリント基板、フレキシブルプリント配線板、アルミナ基板、セラミック基板など、特に種類は限定されない。   The substrate body 10 may have any structure as long as electronic components can be mounted on one side or both sides for high density. The board body 10 is not particularly limited in type, such as a printed board, a flexible printed wiring board, an alumina board, or a ceramic board.

基板本体１０の一方主面１０ａには、チップコンデンサ等の表面実装部品（ＳＭＤ）であるチップ状電子部品２０が、基板本体１０の一方主面１０ａの端子（図示せず）にはんだ実装される。また、ＩＣチップ等のチップ状電子部品２２がダイボンドされ、その端子（図示せず）と基板本体１０の一方主面１０ａに設けられたパッド（図示せず）とが、Ａｕ、Ａｌ、Ｃｕなどのボンディングワイヤー２３によって接続されている。   A chip-like electronic component 20, which is a surface mounted component (SMD) such as a chip capacitor, is solder-mounted on one main surface 10 a of the substrate body 10 to a terminal (not shown) on the one main surface 10 a of the substrate body 10. . A chip-like electronic component 22 such as an IC chip is die-bonded, and a terminal (not shown) and a pad (not shown) provided on one main surface 10a of the substrate body 10 are Au, Al, Cu, or the like. Are connected by a bonding wire 23.

基板本体１０の他方主面１０ｂには、必要に応じて、チップコンデンサやＩＣチップ等のチップ状電子部品２６，２７，２８が搭載される。例えば、表面実装部品であるチップ状電子部品２６，２７がはんだ実装され、ＩＣチップ等であるチップ状電子部品２８がＡｕ又ははんだのバンプ２９によりフリップチップ実装される。   Chip-like electronic components 26, 27, and 28 such as a chip capacitor and an IC chip are mounted on the other main surface 10b of the substrate body 10 as necessary. For example, chip-shaped electronic components 26 and 27 that are surface-mounted components are solder-mounted, and chip-shaped electronic components 28 that are IC chips or the like are flip-chip mounted by Au or solder bumps 29.

基板本体１０の他方主面１０ｂには、図１（ａ）に示す複合基板２のように、必要に応じて金属ケース４０が接合される。金属ケース４０は、基板本体１０の側面に接合されてもよい。金属ケース４０は、複合基板２を外部回路基板７０に実装する際にマウンターが複合基板２を吸着し易いようにするためと、特に高周波用に用いられる場合の電磁シールド用である。   A metal case 40 is bonded to the other main surface 10b of the substrate body 10 as necessary, as in the composite substrate 2 shown in FIG. The metal case 40 may be bonded to the side surface of the substrate body 10. The metal case 40 is used for making the mounter easily adsorb the composite substrate 2 when the composite substrate 2 is mounted on the external circuit substrate 70, and for electromagnetic shielding particularly when used for high frequency.

電磁シールドが不要な場合には、図１（ｂ）に示す複合基板４のように、基板本体１０の他方主面１０ｂに、チップ状電子部品２６，２７，２８を被覆するように、エポキシ樹脂等の熱硬化性樹脂を塗布したり、トランスファー成形して樹脂層４２を形成し、マウンターの吸着ノズルで吸着できるように、樹脂層４２の表面４３（図において上面）を平らにする。   When the electromagnetic shield is unnecessary, as in the composite substrate 4 shown in FIG. 1B, the other main surface 10b of the substrate body 10 is coated with an epoxy resin so as to cover the chip-like electronic components 26, 27, and 28. A resin layer 42 is formed by applying a thermosetting resin or the like by transfer molding, and the surface 43 (upper surface in the figure) of the resin layer 42 is flattened so that it can be adsorbed by the adsorption nozzle of the mounter.

接続部材３０は、帯状の金属薄板が断面コ字に折り曲げて形成され、中間片３４の両端にそれぞれ第１片３２と第２片３６とが連続している。   The connecting member 30 is formed by bending a band-shaped metal thin plate into a U-shaped cross section, and a first piece 32 and a second piece 36 are continuous with both ends of the intermediate piece 34, respectively.

図２の要部拡大図に示すように、接続部材３０の第１片３２は、基板本体１０の一方主面１０ａに設けられた端子１６にはんだ１８（導電性接着剤等でもよい）で接続される。接続部材３０の第２片３６は基板本体１０の一方主面１０ａから離れて延在している。   2, the first piece 32 of the connection member 30 is connected to the terminal 16 provided on the one main surface 10a of the substrate body 10 with solder 18 (which may be a conductive adhesive or the like). Is done. The second piece 36 of the connection member 30 extends away from the one main surface 10 a of the substrate body 10.

図１に示したように、基板本体１０の一方主面１０ａにおいて、接続部材３０は、基板本体１０の一方主面１０ａの周縁部に配置され、接続部材３０よりも内側にチップ状電子部品２０，２２を配置する。もっとも、基板本体１０の一方主面１０ａの周縁部のうち接続部材３０が配置されていない部分に、チップ状電子部品を配置することも可能である。   As shown in FIG. 1, on one main surface 10 a of the substrate body 10, the connection member 30 is disposed on the peripheral edge portion of the one main surface 10 a of the substrate body 10, and the chip-shaped electronic component 20 is located inside the connection member 30. , 22 are arranged. But it is also possible to arrange | position a chip-shaped electronic component in the part in which the connection member 30 is not arrange | positioned among the peripheral parts of the one main surface 10a of the board | substrate body 10. FIG.

基板本体１０の一方主面１０ａには、基板本体１０の一方主面１０ａに搭載されたチップ状電子部品２０，２２やボンディングワイヤー２３を覆う樹脂層２４が形成されている。樹脂層２４は、チップ状電子部品２０，２２やボンディングワイヤー２３を封止し、機械的破壊や、熱や水といった外部環境から保護する。なお、チップ状電子部品は、その少なくとも一部が樹脂層に覆われていればよい。   On one main surface 10 a of the substrate body 10, a resin layer 24 that covers the chip-like electronic components 20 and 22 and the bonding wires 23 mounted on the one main surface 10 a of the substrate body 10 is formed. The resin layer 24 seals the chip-shaped electronic components 20 and 22 and the bonding wire 23 and protects them from an external environment such as mechanical destruction and heat and water. Note that at least a part of the chip-shaped electronic component only needs to be covered with the resin layer.

樹脂層２４は、基板本体１０の一方主面１０ａ全体に同一樹脂材料で形成されており、接続部材３０の第２片３６より基板本体１０側に、形成されている。接続部材３０は、その大部分が樹脂層２４内に埋もれているため、例えば座屈しにくくなるなど、機械的強度が樹脂層２４によって補強されている。   The resin layer 24 is formed of the same resin material on the entire main surface 10 a of the substrate body 10, and is formed closer to the substrate body 10 than the second piece 36 of the connection member 30. Since most of the connecting member 30 is buried in the resin layer 24, the mechanical strength is reinforced by the resin layer 24, for example, it becomes difficult to buckle.

接続部材３０は、少なくとも第２片３６の基板本体１０とは反対側の面３７が樹脂層２４から露出し、この面３７が、図２に示したように、外部回路基板７０の表面電極７２に、はんだ７４（導電性接着剤等でもよい）で接合される。   In the connection member 30, at least a surface 37 of the second piece 36 opposite to the substrate body 10 is exposed from the resin layer 24, and the surface 37 is a surface electrode 72 of the external circuit substrate 70 as shown in FIG. 2. And solder 74 (which may be a conductive adhesive or the like).

図１（ａ）の複合基板２のように、基板本体１０に金属ケース４０が接合される場合には、金属ケース４０も外部回路基板７０に電気的に接続されるようにする。   When the metal case 40 is joined to the substrate body 10 as in the composite substrate 2 in FIG. 1A, the metal case 40 is also electrically connected to the external circuit board 70.

接続部材３０によって、基板本体１０と外部回路基板７０との間の間隔を広げ、外部回路基板７０に対向する基板本体１０の一方主面１０ａにチップ状電子部品２０，２２を搭載して、複合基板２，４を高密度化することができる。   The connecting member 30 widens the space between the board body 10 and the external circuit board 70, and the chip-like electronic components 20 and 22 are mounted on the one main surface 10 a of the board body 10 facing the external circuit board 70. The density of the substrates 2 and 4 can be increased.

接続部材３０は、例えば図３の平面図に示すように、リン青銅や洋白、Ｎｉ合金の金属薄板３９を金型で打ち抜いて、共通部分３８につながった複数の帯状の部分３１を形成した後、帯状の部分３１を、例えば図４の斜視図に示すように、２箇所の屈曲部３３，３５で折り曲げることにより、中間片３４に関して同じ側に第１片３２と第２片３６とが延在するように形成する。このとき、屈曲部３３，３５で直角に折り曲げ、第１片３２と第２片３６とが対向する領域の外側よりも外側に中間片３４がはみ出ないようにする。このように折り曲げると、接続部材３０、ひいては複合基板を小型化することができる。   For example, as shown in the plan view of FIG. 3, the connecting member 30 is formed by punching a thin metal plate 39 of phosphor bronze, white or nickel alloy with a mold to form a plurality of strip-shaped portions 31 connected to the common portion 38. Thereafter, as shown in the perspective view of FIG. 4, for example, the first piece 32 and the second piece 36 are formed on the same side with respect to the intermediate piece 34 by bending the belt-like portion 31 at two bent portions 33 and 35. It is formed to extend. At this time, the bent portions 33 and 35 are bent at a right angle so that the intermediate piece 34 does not protrude beyond the outside of the region where the first piece 32 and the second piece 36 face each other. When bent in this way, the connection member 30 and thus the composite substrate can be reduced in size.

各接続部材３０は、図４に示したように共通部分３８につながったままの状態で複数個をまとめて基板本体１０の一方主面１０ａ上に配置した後、共通部分３８と各接続部材３０との間を切断して共通部分３８を各接続部材３０から分離しても、共通部分３８と各接続部材３０との間を切断して１個ずつに分離した接続部材３０を、基板本体１０の一方主面１０ａに配置してもよい。   As shown in FIG. 4, a plurality of connection members 30 are connected to the common portion 38 and arranged on one main surface 10 a of the substrate body 10, and then the common portion 38 and each connection member 30 are connected. Even if the common portion 38 is separated from each connection member 30 by cutting between the connection portions 30, the connection members 30 separated by one by cutting between the common portion 38 and each connection member 30 are separated from each other. You may arrange | position to the one main surface 10a.

接続部材３０は、図５（ａ）の断面図に示すように、断面コ字状に折り曲げ加工されているが、接続部材の折り曲げ形状はこれに限らない。接続部材は、少なくとも１箇所で屈曲し、基板本体に接合される第１片と、外部回路基板に接合される第２片とを有する形状であればよい。   As shown in the cross-sectional view of FIG. 5A, the connecting member 30 is bent into a U-shaped cross section, but the bent shape of the connecting member is not limited thereto. The connection member may be bent in at least one place and may have a shape having a first piece joined to the substrate body and a second piece joined to the external circuit board.

接続部材は、１箇所で屈曲する場合には、金属薄板の帯状の部分を、例えば１箇所のみを円弧状に屈曲させて塑性変形させ、断面Ｕ字状に形成する。   When the connecting member is bent at one place, the strip-like portion of the thin metal plate is plastically deformed by bending, for example, only one place into an arc shape to form a U-shaped cross section.

２箇所で屈曲する場合には、例えば２箇所で折り曲げ、第１片と第２片とが対向する空間内に中間片が延在するように接続部材を形成すると、容易に小型化を図ることができる。例えば図５（ｂ）の断面図に示す接続部材３０ａのように、第１片３２ａと第２片３６ａとが中間片３４ａに関して互いに反対側に延在する断面Ｚ字状であってもよい。   In the case of bending at two places, for example, when the connecting member is formed so that the intermediate piece extends in the space where the first piece and the second piece face each other, the size can be easily reduced. Can do. For example, like the connection member 30a shown in the cross-sectional view of FIG. 5B, the first piece 32a and the second piece 36a may have a Z-shaped cross section that extends on the opposite side with respect to the intermediate piece 34a.

屈曲部を増やすことにより、各方向のばね定数の組み合わせを変えることができる。例えば図５（ｃ）の断面図に示す接続部材３０ｂのように、中間位置に屈曲部３４ｘが形成された断面く字状の中間片３４ｂの同じ側に第１片３２ｂと第２片３６ｂとが延在する断面Σ字状に形成してもよい。   By increasing the number of bent portions, the combination of spring constants in each direction can be changed. For example, as in the connection member 30b shown in the cross-sectional view of FIG. 5C, the first piece 32b and the second piece 36b are formed on the same side of the intermediate piece 34b having a cross-section with a bent portion 34x formed at the intermediate position. May be formed in a Σ-shaped cross section.

また、１箇所につき一つの接続部材を用いる代わりに、図５（ｄ）の断面図に示すように、中間片３４の同じ側に第１片３２ｃと第２片３６ｃとが延在する断面コ字状の２つの接続部材３０ｃ，３０ｃを、中間片３４ｃ同士が背中合わせになるように組み合わせて１箇所に用いてもよい。この場合、フェールセーフにより、折り曲げ疲労破壊に対する信頼性を向上させることができる。   Further, instead of using one connecting member for each location, as shown in the cross-sectional view of FIG. 5D, the cross-sectional core in which the first piece 32c and the second piece 36c extend on the same side of the intermediate piece 34. Two character-shaped connecting members 30c, 30c may be combined and used at one place so that the intermediate pieces 34c are back to back. In this case, the reliability against bending fatigue failure can be improved by fail-safe.

接続部材を形成するために用いる金属薄板の厚みは、５０μｍ〜３００μｍが好ましい。   The thickness of the thin metal plate used for forming the connection member is preferably 50 μm to 300 μm.

金属薄板の厚みが５０μｍ未満では、折り曲げ加工時のばらつきが大きくなり、第１片や第２片の位置や高さのばらつきが大きくなってしまう。基板本体に接続する第１片の位置のばらつきに対応するため、基板本体側の端子を大きくすると、基板本体の小型化、ひいては複合基板の小型化を損ねる。第２片の高さがばらつくと、例えば、第２片と外部回路基板との間を接合するはんだの厚みがばらつき、接合信頼性が損なわれる。接続部材の高さ寸法の余裕を大きくすると、複合基板の低背化を阻害する。さらに、熱応力や衝撃応力により、接続部材の屈曲部近傍は繰り返し疲労を受けるが、接続部材の厚みが小さいと疲労破壊しやすいため、接合信頼性を損ねる。   If the thickness of the metal thin plate is less than 50 μm, the variation during bending becomes large, and the variation in the position and height of the first piece and the second piece becomes large. In order to cope with variations in the position of the first piece connected to the substrate body, if the terminal on the substrate body side is enlarged, the substrate body and the composite substrate are reduced in size. If the height of the second piece varies, for example, the thickness of the solder that joins between the second piece and the external circuit board varies, and joint reliability is impaired. When the margin of the height dimension of the connecting member is increased, the composite substrate is prevented from being lowered. Further, the vicinity of the bent portion of the connecting member is repeatedly fatigued due to thermal stress and impact stress, but if the thickness of the connecting member is small, fatigue failure is likely to occur, so that the joint reliability is impaired.

接続部材に用いる金属薄板の厚みが３００μｍを越えると、折り曲げ加工が難しくなり、曲げ角度のばらつき、高さのばらつきが大きくなる。また、打ち抜きや折り曲げの間隔を小さくし、接続部材の高さＨや長さＷ（図４参照）を小さくすることができないため、複合基板の小型化、低背化を阻害する。   When the thickness of the metal thin plate used for the connecting member exceeds 300 μm, the bending process becomes difficult, and the variation in bending angle and the variation in height become large. In addition, since the interval between punching and bending cannot be reduced and the height H and length W (see FIG. 4) of the connecting member cannot be reduced, the composite substrate can be prevented from being reduced in size and height.

接続部材には、基板本体や外部回路基板との接合に使用されるはんだや導電性接着剤との濡れ性をよくし、接合強度を高めるため、Ｎｉ／Ｓｎ、Ｎｉ／Ａｕ、Ｎｉ／はんだなどをめっきしてもよい。このようなめっきは、接続部材の全面に施しても、第１片や第２片の接合面のみに施してもよい。   Ni / Sn, Ni / Au, Ni / solder, etc. for connecting member to improve wettability with solder and conductive adhesive used for bonding to substrate body and external circuit board, and to increase bonding strength May be plated. Such plating may be performed on the entire surface of the connection member or only on the bonding surface of the first piece and the second piece.

接続部材は、金属薄板の折り曲げ加工以外の方法で形成することも考えられる。   It is conceivable that the connecting member is formed by a method other than the bending process of the metal thin plate.

しかし、例えばめっきにより形成する場合、スルーホール内にめっき液が残っていると複合基板を外部回路基板に接合する工程で、残っていためっき液が加熱され、気化して急激に膨張することによって、スルーホール付近に亀裂が発生したり、はんだにボイドが発生したりすることがある。接続部材を金属薄板の折り曲げ加工で形成する場合には、このようなことがないため、接合信頼性を向上することができる。   However, for example, when forming by plating, if the plating solution remains in the through hole, the remaining plating solution is heated, vaporized, and rapidly expanded in the step of joining the composite substrate to the external circuit board. In some cases, cracks may occur in the vicinity of the through hole, and voids may occur in the solder. In the case where the connecting member is formed by bending a thin metal plate, this is not the case, so that the joining reliability can be improved.

複合基板は、複数個分の基板本体となる部分を含む集合基板を用いて、複数個分を同時に作製することができる。その場合、例えば図６の斜視図に示すように、接続部材３０は、端子１１が形成された基板本体１０の集合基板の一方主面１０ａに配置される。図６では、破線で示した分割線１４を境界とする複合基板４個分１２ａ，１２ｂ，１２ｃ，１２ｄを図示しているが、集合基板は、これより多い個数分を含んでも、少ない個数分を含んでもよい。   A plurality of composite substrates can be manufactured at the same time by using a collective substrate including a portion that becomes a plurality of substrate bodies. In this case, for example, as shown in the perspective view of FIG. 6, the connection member 30 is disposed on the one main surface 10 a of the collective substrate of the substrate body 10 on which the terminals 11 are formed. In FIG. 6, four composite boards 12a, 12b, 12c, and 12d with the dividing line 14 shown by a broken line as a boundary are illustrated, but the aggregate board includes a larger number than this, but a smaller number. May be included.

図６では、接続部材３０は、矩形の基板本体１０の一対の辺に沿ってのみ配置されている。接続部材３０は、基板本体１０の一方主面１０ａの周縁部に複数個が配置されていればよく、図６の例に限定されない。例えば、矩形の基板本体１０の一方主面１０ａの対向する二対の各辺に沿って、それぞれ１個以上が配置されてもよい。また、矩形の基板本体１０の一方主面１０ａの四隅の計４箇所のみに配置されても、あるいは、矩形の基板本体１０の一方主面１０ａの四隅のうち対角位置の２箇所のみに配置されてもよい。また、４辺のそれぞれに接続部材を配してもよい。   In FIG. 6, the connection member 30 is disposed only along a pair of sides of the rectangular substrate body 10. The connection member 30 should just be arrange | positioned in the peripheral part of the one main surface 10a of the board | substrate body 10, and is not limited to the example of FIG. For example, one or more pieces may be arranged along each of two opposing sides of the one main surface 10a of the rectangular substrate body 10. Also, the four main corners 10a of the rectangular substrate body 10 may be arranged at only four corners, or the four corners of the one main surface 10a of the rectangular substrate body 10 may be arranged at two diagonal positions. May be. Moreover, you may arrange | position a connection member to each of 4 sides.

次に、複合基板の作製工程について、図７〜図１３の断面図を参照しながら説明する。   Next, a manufacturing process of the composite substrate will be described with reference to cross-sectional views of FIGS.

（ａ） 図７に示すように、複数個分の基板本体１０（１個分を符号１２で示す）となる部分を含む集合基板の一方主面１０ａの端子１６（図２参照）に、はんだ、Ａｇ等を含む導電性ペースト（図示せず）を印刷し、表面実装部品であるチップ状電子部品２０と接続部材３０とを搭載し、リフローもしくは熱硬化して、接続部材３０の第１片３２を基板本体１０の一方主面１０ａの端子１６（図２参照）に接合する。接合後、洗浄を行って、基板本体１０の一方主面１０ａに設けたワイヤーボンディング用のパッド（図示せず）の汚れを除去する。   (A) As shown in FIG. 7, solder is applied to terminals 16 (see FIG. 2) on one main surface 10 a of the collective board including a portion that becomes a plurality of board main bodies 10 (one is indicated by reference numeral 12). A conductive paste (not shown) containing Ag, etc. is printed, the chip-like electronic component 20 which is a surface-mounted component, and the connection member 30 are mounted, reflowed or thermally cured, and the first piece of the connection member 30 32 is joined to the terminal 16 (see FIG. 2) on the one main surface 10a of the substrate body 10. After bonding, cleaning is performed to remove dirt on a wire bonding pad (not shown) provided on one main surface 10a of the substrate body 10.

（ｂ） 次いで、図８に示すように、ＩＣ、ＦＥＴなどのチップ状電子部品２２を、エポキシ系樹脂又は導電性樹脂等で基板本体１０の集合基板の一方主面１０ａに搭載し、熱硬化し、チップ状電子部品２２の端子（図示せず）と、基板本体１０の一方主面１０ａに設けたパッド（図示せず）との間を、Ａｕ、Ａｌ、Ｃｕなどのボンディングワイヤー２３によって接続する。   (B) Next, as shown in FIG. 8, a chip-like electronic component 22 such as an IC or FET is mounted on one main surface 10a of the aggregate substrate of the substrate body 10 with an epoxy resin or a conductive resin, and is thermoset. Then, a terminal (not shown) of the chip-like electronic component 22 and a pad (not shown) provided on the one main surface 10a of the substrate body 10 are connected by a bonding wire 23 such as Au, Al, or Cu. To do.

なお、基板本体１０側の端子１６（図２参照）やボンディングワイヤー２３によって接続するパッド（図示せず）には、接合強度を上げるべく、通常、Ｎｉ／Ａｕ、又はＮｉ／Ｐｄ／Ａｕめっきが施されている。   Note that Ni / Au or Ni / Pd / Au plating is usually applied to the terminals 16 (see FIG. 2) on the substrate body 10 side and pads (not shown) connected by the bonding wires 23 in order to increase the bonding strength. It has been subjected.

（ｃ） 次いで、図９に示すように、基板本体１０の集合基板の一方主面１０ａの全面に、樹脂層２４を形成するため、液状のエポキシ系樹脂等の封止樹脂を塗布した後、加熱して硬化させる。   (C) Next, as shown in FIG. 9, after a sealing resin such as a liquid epoxy resin is applied to form the resin layer 24 on the entire surface of the one main surface 10a of the collective substrate of the substrate body 10, Heat to cure.

封止樹脂を塗布するとき、封止樹脂の高さが接続部材３０の第２片３６を越えないようにして、封止樹脂が、接続部材３０の露出すべき第２片３６の基板本体１０とは反対側の面３７にまで濡れ広がらないようにすることが好ましい。封止樹脂が、接続部材３０の露出すべき第２片３６の基板本体１０とは反対側の面３７にまで濡れ広がると、この面３７にはんだが付かなくなり、外部回路基板７０（図１、図２参照）と接合できなくなるからである。   When the sealing resin is applied, the height of the sealing resin does not exceed the second piece 36 of the connection member 30 so that the sealing resin is exposed to the substrate body 10 of the second piece 36 to be exposed of the connection member 30. It is preferable not to wet and spread to the surface 37 on the opposite side. When the sealing resin wets and spreads to the surface 37 opposite to the substrate body 10 of the second piece 36 to be exposed of the connecting member 30, the surface 37 is not soldered, and the external circuit board 70 (FIG. 1, FIG. This is because it becomes impossible to join with (see FIG. 2).

このような封止樹脂の濡れ広がりを確実に防ぐため、第２片３６の露出させるべき部分（外部回路基板７０との接続端子となる部分、すなわち第２片３６の基板本体１０とは反対側の面３７）に、離型剤や撥水剤を塗布することが好ましい。   In order to surely prevent such spreading of the sealing resin, the portion to be exposed of the second piece 36 (the portion serving as a connection terminal with the external circuit board 70, that is, the side opposite to the substrate body 10 of the second piece 36) It is preferable to apply a release agent or a water repellent to the surface 37).

封止樹脂の硬化収縮率は高々０．５％以下であるため、接続部材３０が封止樹脂によって変形しないが、封止樹脂の硬化によって集合基板が反る場合がある。このような場合には、集合基板が反らない程度に封止樹脂を予備硬化させた状態で、図１０に示すように、複合基板の分割線１４に沿って、封止樹脂の樹脂層２４にスリット２１を形成した後、封止樹脂をさらに加熱して本硬化させる。これによって、スリット２１は、封止樹脂が完全に硬化する前のやわらかい状態のときに、容易に加工することができる。スリット２１を形成しておくと、後の工程で個々の基板に分割する作業も容易になる。例えば、１００℃で１時間加熱して封止樹脂を予備硬化させた後、スリット２１を形成し、さらに、１５０℃で３時間加熱して、封止樹脂を完全に硬化させる。   Since the curing shrinkage rate of the sealing resin is at most 0.5%, the connecting member 30 is not deformed by the sealing resin, but the collective substrate may be warped by the curing of the sealing resin. In such a case, in a state where the sealing resin is pre-cured to such an extent that the collective substrate does not warp, as shown in FIG. 10, along the dividing line 14 of the composite substrate, the resin layer 24 of the sealing resin. After the slits 21 are formed, the sealing resin is further heated to be fully cured. Thereby, the slit 21 can be easily processed when it is in a soft state before the sealing resin is completely cured. If the slits 21 are formed, an operation of dividing the substrates into individual substrates in a later process becomes easy. For example, after preliminarily curing the sealing resin by heating at 100 ° C. for 1 hour, the slits 21 are formed and further heated at 150 ° C. for 3 hours to completely cure the sealing resin.

樹脂層２４は、液状の封止樹脂の代わりに、Ｂステージ状態（半硬化状態）にある樹脂シートを用いても形成することができる。この場合、樹脂シートは、基板本体１０に搭載されたチップ状電子部品２０，２２や接続部材３０の上に配置した後、基板本体１０側に押し込むことにより、基板本体１０の一方主面１０ａ上に隙間なく配置した後に、加熱して硬化させる。接続部材３０の露出すべき第２片３６の基板本体１０とは反対側の面３７などに付着し残った樹脂シートは、硬化前に、あるいは硬化後に取り除く。   The resin layer 24 can also be formed by using a resin sheet in a B-stage state (semi-cured state) instead of the liquid sealing resin. In this case, the resin sheet is placed on the chip-like electronic components 20 and 22 and the connection member 30 mounted on the substrate body 10 and then pushed into the substrate body 10 side, whereby the resin sheet is placed on the one main surface 10a of the substrate body 10. After being arranged in the gap without any gap, it is cured by heating. The resin sheet remaining on the surface 37 of the second member 36 to be exposed of the connecting member 30 on the side opposite to the substrate body 10 is removed before or after curing.

（ｄ） 次いで、図１１に示すように、基板本体１０の集合基板を上下反転し、基板本体１０の他方主面１０ｂに、はんだ、Ａｇ等を含む導電性ペースト（図示せず）を印刷し、チップコンデンサ等のチップ状電子部品２６，２７を搭載してリフローもしくは熱硬化して、あるいはＩＣチップ等のチップ状電子部品２８をはんだボール２９を介してフリップチップボンディングして、基板本体１０の他方主面１０ｂの端子（図示せず）にチップ状電子部品２６，２７，２８を接合する。必要に応じて、フリップチップボンディングしたチップ状電子部品２８と基板本体１０の他方主面１０ｂとの間に、エポキシ系樹脂からなるアンダーフィル樹脂２５を充填、熱硬化する。   (D) Next, as shown in FIG. 11, the assembly substrate of the substrate body 10 is turned upside down, and a conductive paste (not shown) containing solder, Ag, etc. is printed on the other main surface 10 b of the substrate body 10. The chip-like electronic components 26 and 27 such as a chip capacitor are mounted and reflowed or thermally cured, or the chip-like electronic component 28 such as an IC chip is flip-chip bonded via a solder ball 29 to Chip-shaped electronic components 26, 27, and 28 are joined to terminals (not shown) on the other main surface 10b. If necessary, an underfill resin 25 made of an epoxy resin is filled between the chip-shaped electronic component 28 that has been flip-chip bonded and the other main surface 10b of the substrate body 10 and thermally cured.

これによって、基板両面に部品実装された高密度モジュールとなる。   As a result, a high-density module having components mounted on both sides of the board is obtained.

（ｅ） 次いで、金属ケース４０を用いる場合には、図１２に示すように、洋白、りん青銅等からなる金属ケース４０を、基板本体１０の他方主面１０ｂに搭載し、接合する。この工程は、上記（ｄ）の工程と同時に行われてもよい。   (E) Next, when using the metal case 40, as shown in FIG. 12, the metal case 40 made of white, phosphor bronze or the like is mounted on the other main surface 10b of the substrate body 10 and joined. This step may be performed simultaneously with the step (d).

（ｆ） 次いで、ダイシングソー、レーザー、ブレイク等の手段で、分割線１４に沿って集合基板を切断し、図１３に示すように、個々の複合基板６に分割する。以上により、複合基板６が完成する。   (F) Next, the collective substrate is cut along the dividing line 14 by means such as a dicing saw, a laser, or a break, and divided into individual composite substrates 6 as shown in FIG. Thus, the composite substrate 6 is completed.

完成した複合基板は、外部回路基板７０に実装する場合、図２に示したように、接続部材３０の第２片３６の基板本体１０とは反対側の面３７に露出している部分を、プリント配線板等の外部回路基板７０の接合用ランド等の表面電極７２に、はんだ７４等で接合する。これによって、基板本体１０の一方主面１０ａに設けられた端子１６は、はんだ１８、接続部材３０、はんだ７４を介して、外部回路基板７０の表面電極７２と電気的に接続される。   When the completed composite board is mounted on the external circuit board 70, as shown in FIG. 2, the part exposed on the surface 37 on the opposite side of the board body 10 of the second piece 36 of the connection member 30, A solder 74 or the like is bonded to a surface electrode 72 such as a bonding land of an external circuit board 70 such as a printed wiring board. As a result, the terminal 16 provided on the one main surface 10 a of the substrate body 10 is electrically connected to the surface electrode 72 of the external circuit board 70 via the solder 18, the connection member 30, and the solder 74.

複合基板は、接続部材３０の弾性変形によって、熱応力や衝撃応力を緩和することができるため、接合信頼性を向上することができる。特に、基板本体１０が、アルミナ基板などと比べて曲げ強度が低く、ガラス等を含み脆いセラミック基板の場合、熱応力や衝撃応力の緩和により、基板本体の破壊を防止する効果も大きい。   Since the composite substrate can relieve thermal stress and impact stress by elastic deformation of the connecting member 30, it can improve the bonding reliability. In particular, when the substrate body 10 is a ceramic substrate having a low bending strength compared to an alumina substrate or the like and including glass or the like, the substrate body 10 has a great effect of preventing the substrate body from being broken by relaxing thermal stress and impact stress.

すなわち、接続部材３０は、塑性変形するように折り曲げられた連続する金属端子であるので、ＸＹＺ方向のいずれにも弾性変形する。また、樹脂層２４と接続部材３０とは基本的に接合しておらず、樹脂層２４もＸＹＺ方向に弾性変形する。   That is, since the connection member 30 is a continuous metal terminal bent so as to be plastically deformed, it is elastically deformed in any of the XYZ directions. Further, the resin layer 24 and the connecting member 30 are basically not joined, and the resin layer 24 is also elastically deformed in the XYZ directions.

接続部材３０が弾性変形可能であると、複合基板を外部回路基板７０に接合するときのリフロー、その後のヒートサイクル時の熱により、各部の線膨張係数αの差により熱応力が発生しても、接続部材３０や樹脂層２４の弾性変形によって、熱応力を吸収することができる。同様に、落下衝撃時などの衝撃応力も、弾性変形で吸収することができる。そのため、接合信頼性が向上する。   If the connecting member 30 is elastically deformable, even if thermal stress occurs due to differences in the linear expansion coefficient α of each part due to reflow when the composite board is joined to the external circuit board 70 and heat during the subsequent heat cycle. The thermal stress can be absorbed by elastic deformation of the connecting member 30 and the resin layer 24. Similarly, an impact stress such as a drop impact can be absorbed by elastic deformation. As a result, the bonding reliability is improved.

＜実施例２＞ 実施例２の複合基板８について、図１４を参照しながら説明する。   Example 2 A composite substrate 8 of Example 2 will be described with reference to FIG.

図１４の断面図に示すように、複合基板８は、実施例１と同様に、平板状の基板本体５０の両方の主面５０ａ，５０ｂに、チップ状電子部品６０；６２，６４が搭載されている。また、基板本体５０の一方主面５０ａには接続部材３０が接合され、樹脂層２４が形成されている。   As shown in the cross-sectional view of FIG. 14, the composite substrate 8 has chip-like electronic components 60; 62, 64 mounted on both main surfaces 50a, 50b of the flat substrate body 50, as in the first embodiment. ing. Further, the connecting member 30 is joined to the one main surface 50 a of the substrate body 50, and the resin layer 24 is formed.

基板本体５０の一方主面５０ａには、接続部材３０を接合する端子５６や、チップ状電子部品６０の接合用パッド５７が形成され、他方主面５０ｂには、チップ状電子部品６２，６４の接合電極（接合用ランド）となる端子５８が形成されている。端子５６，５８やパッド５７には、必要に応じて、Ｎｉ／Ｓｎ、Ｎｉ／Ａｕ、Ｎｉ／Ｐｄ／Ａｕ、Ｎｉ／はんだをめっきする。   A terminal 56 for joining the connection member 30 and a bonding pad 57 for the chip-shaped electronic component 60 are formed on one main surface 50a of the substrate body 50, and chip-shaped electronic components 62, 64 are formed on the other main surface 50b. A terminal 58 to be a bonding electrode (bonding land) is formed. The terminals 56 and 58 and the pads 57 are plated with Ni / Sn, Ni / Au, Ni / Pd / Au, or Ni / solder as necessary.

実施例１と異なり、複合基板８の基板本体５０は、複数のセラミック層を積層された多層セラミック基板である。基板本体５０の内部には、Ａｇ、Ａｇ／Ｐｄ、Ａｇ／Ｐｔ、Ｃｕ、ＣｕＯなどを主成分とする導電性ペーストを用いて面内導体パターン５２やビアホール導体パターン５４が形成されている。このような構成は、低抵抗のＡｇやＣｕを使うので、信号損失が小さく、高周波用の部品あるいはモジュールとして実用化されている。   Unlike Example 1, the substrate body 50 of the composite substrate 8 is a multilayer ceramic substrate in which a plurality of ceramic layers are laminated. An in-plane conductor pattern 52 and a via-hole conductor pattern 54 are formed inside the substrate body 50 using a conductive paste mainly composed of Ag, Ag / Pd, Ag / Pt, Cu, CuO, or the like. Since such a configuration uses Ag or Cu having low resistance, the signal loss is small and it is put into practical use as a high-frequency component or module.

基板本体５０は、以下のようにして作製する。   The substrate body 50 is manufactured as follows.

すなわち、面内導体パターン５２やビアホール導体パターン５４等が形成され厚さ１０〜２００μｍ程度の未焼成セラミックグリーンシートと、このセラミックグリーンシートの焼成温度よりも高温で焼結する拘束層とを準備する。未焼成セラミックグリーンシートは低温焼結セラミックス材料を含み、焼結温度は１０５０℃以下である。低温焼結セラミック材料としては、具体的には、アルミナやフォルステライト等のセラミック粉末にホウ珪酸系ガラスを混合してなるガラス複合系ＬＴＣＣ（Ｌｏｗ Ｔｅｍｐｅｒａｔｕｒｅ Ｃｏ−ｆｉｒｅｄ Ｃｅｒａｍｉｃ）材料、ＺｎＯ−ＭｇＯ−Ａｌ２Ｏ３−ＳｉＯ２系の結晶化ガラスを用いた結晶化ガラス系ＬＴＣＣ材料、ＺｎＯ−ＭｇＯ−Ａｌ２Ｏ３−ＳｉＯ２系の結晶化ガラスを用いた結晶化ガラス系ＬＴＣＣ材料、ＢａＯ−Ａｌ２Ｏ３−ＳｉＯ２系セラミック粉末やＡｌ２Ｏ３−ＣａＯ−ＳｉＯ２−ＭｇＯ−Ｂ２Ｏ３系セラミック粉末等を用いた非ガラス系ＬＴＣＣ材料等、が挙げられる。That is, an in-plane conductor pattern 52, a via-hole conductor pattern 54, and the like are formed, and an unfired ceramic green sheet having a thickness of about 10 to 200 μm and a constraining layer that is sintered at a temperature higher than the firing temperature of the ceramic green sheet are prepared. . The green ceramic green sheet includes a low-temperature sintered ceramic material, and the sintering temperature is 1050 ° C. or lower. Specific examples of the low-temperature sintered ceramic material include a glass composite LTCC (Low Temperature Co-fired Ceramic) material obtained by mixing borosilicate glass with ceramic powder such as alumina and forsterite, ZnO-MgO-Al. Crystallized glass-based LTCC material using 2 O 3 —SiO 2 -based crystallized glass, Crystallized glass-based LTCC material using ZnO—MgO—Al 2 O 3 —SiO 2 -based crystallized glass, BaO—Al Non-glass-type LTCC materials using 2 O 3 —SiO 2 ceramic powder, Al 2 O 3 —CaO—SiO 2 —MgO—B 2 O 3 ceramic powder, and the like.

次いで、未焼成セラミックグリーンシートと拘束層とを適宜な順序で積層して、複数枚の未焼成セラミックグリーンシートを積層した積層体の両主面に拘束層が積層された複合積層体を形成する。   Next, the unfired ceramic green sheet and the constraining layer are laminated in an appropriate order to form a composite laminate in which constraining layers are laminated on both main surfaces of a laminate in which a plurality of unfired ceramic green sheets are laminated. .

次いで、この複合積層体を、セラミックグリーンシートの焼結温度よりも高く、拘束層の焼結温度よりも低い温度で焼成した後、焼結していない拘束層を除去して、未焼成セラミックグリーンシートが焼結して形成された基板本体５０を取り出す。   Next, the composite laminate is fired at a temperature higher than the sintering temperature of the ceramic green sheet and lower than the sintering temperature of the constraining layer, and then the unsintered constraining layer is removed to obtain an unfired ceramic green. The substrate body 50 formed by sintering the sheet is taken out.

このようにして作製された基板本体５０の一方主面５０ａに、実施例１と同様に、チップ状電子部品６０と接続部材３０が接合された後、樹脂層２４が形成される。必要に応じて、基板本体５０の他方主面５０ｂに、チップ状電子部品６２，６４が搭載される。   The resin layer 24 is formed after the chip-like electronic component 60 and the connection member 30 are bonded to the one main surface 50a of the substrate body 50 thus manufactured, as in the first embodiment. If necessary, chip-shaped electronic components 62 and 64 are mounted on the other main surface 50 b of the substrate body 50.

複合基板８は、基板本体５０がセラミック多層基板であるので、複合基板８の実装密度を高めつつ、接合信頼性を向上することができる。また、セラミック多層基板は他の種類の基板に比べて脆いため、熱応力や衝撃応力からセラミック多層基板自体の破壊を防止する効果が大きい。   Since the substrate body 50 of the composite substrate 8 is a ceramic multilayer substrate, it is possible to improve the bonding reliability while increasing the mounting density of the composite substrate 8. In addition, since the ceramic multilayer substrate is more fragile than other types of substrates, the effect of preventing the ceramic multilayer substrate itself from being destroyed due to thermal stress or impact stress is great.

＜接続部材の構成１＞ 断面コ字状の接続部材３０は、実施例１（図１参照）のように対向する中間片３４同士が外側になるように配置しても、実施例２（図１４参照）のように対向する中間片３４同士が内側になるように配置してもよい。接合信頼性の観点からは、中間片３４同士が内側になるように配置することが好ましい。以下、図１５を参照しながら説明する。   <Configuration 1 of Connecting Member> Even if the connecting member 30 having a U-shaped cross section is disposed so that the intermediate pieces 34 facing each other are on the outside as in the first embodiment (see FIG. 1), the second embodiment (FIG. 14), the intermediate pieces 34 facing each other may be disposed inside. From the viewpoint of bonding reliability, it is preferable to arrange the intermediate pieces 34 to be inside. Hereinafter, a description will be given with reference to FIG.

基板本体５０の線膨張係数α１が、外部回路基板７０の線膨張係数α２よりも小さいとき、図１５（Ａ）に示すように、接続部材３０は、例えば複合基板を外部回路基板７０に接合するためのリフロー工程や、使用時の温度上昇によって外部回路基板７０側が広がり、接続部材３０の第２片３６と外部回路基板７０との間の接合部分に、せん断力Ｆｓや曲げモーメントＭｓが作用する。このせん断力Ｆｓや曲げモーメントＭｓは、対向して配置されている接続部材３０の中間片３４間の距離Ｌに略比例する。図示したように対向する接続部材３０の中間片３４同士が内側に配置されていると、中間片３４間の距離Ｌは、図１のように対向する接続部材３０の中間片３４同士が外側に配置されている場合よりも小さくなる。そのため、接続部材３０の第２片３６と外部回路基板７０との間の接合部分に作用するせん断力Ｆｓや曲げモーメントＭｓが小さくなり、接合信頼性が向上する。When the linear expansion coefficient α 1 of the substrate body 50 is smaller than the linear expansion coefficient α 2 of the external circuit board 70, the connection member 30 may, for example, connect the composite board to the external circuit board 70 as shown in FIG. The external circuit board 70 side spreads due to the reflow process for joining and the temperature rise during use, and the shearing force Fs and bending moment Ms are applied to the joining portion between the second piece 36 of the connecting member 30 and the external circuit board 70. Works. The shearing force Fs and the bending moment Ms are substantially proportional to the distance L between the intermediate pieces 34 of the connecting members 30 arranged to face each other. As shown in the drawing, when the intermediate pieces 34 of the connecting members 30 facing each other are arranged inside, the distance L between the intermediate pieces 34 is set so that the intermediate pieces 34 of the connecting members 30 facing each other are outside as shown in FIG. It becomes smaller than the case where it is arranged. For this reason, the shearing force Fs and the bending moment Ms acting on the joint portion between the second piece 36 of the connection member 30 and the external circuit board 70 are reduced, and the joining reliability is improved.

接続部材３０の第１片３２と基板本体５０との接合部分についても同様であり、対向する接続部材３０の中間片３４同士が内側に配置されていると、図１のように対向する接続部材３０の中間片３４同士が外側に配置されている場合よりも、中間片３４間の距離Ｌが小さくなり、接合部分に作用するせん断力や曲げモーメントが小さくなるため、接合信頼性が向上する。   The same applies to the joint portion between the first piece 32 of the connection member 30 and the substrate body 50. When the intermediate pieces 34 of the connection member 30 facing each other are arranged inside, the connection members facing each other as shown in FIG. Compared with the case where 30 intermediate pieces 34 are arranged on the outside, the distance L between the intermediate pieces 34 becomes smaller, and the shearing force and bending moment acting on the joining portion become smaller, so that the joining reliability is improved.

また、金属と樹脂は接着しにくいため、金属薄板を折り曲げ加工した接続部材３０は、樹脂層２４に埋設されていても、樹脂層２４に接着していなかったり、接着していても接着部分が簡単に剥離したりするので、容易に弾性変形することができる。   In addition, since the metal and the resin are difficult to bond, the connecting member 30 obtained by bending the metal thin plate is embedded in the resin layer 24, is not bonded to the resin layer 24, or has a bonded portion even if bonded. Since it peels easily, it can be easily elastically deformed.

そのため、図１５（Ｂ）に示すように、外部回路基板７０の表面７１が凸状に湾曲した場合、接続部材３０は、第２片３６が大略第２の屈曲部３５を中心に回動し、樹脂層２４との間に隙間が形成されるように弾性変形する。これによって、接続部材３０の第２片３６と外部回路基板７０との間の接合部分に無理な力が作用しないようにすることができ、接合信頼性を高めることができる。   Therefore, as shown in FIG. 15B, when the surface 71 of the external circuit board 70 is curved in a convex shape, the connection member 30 is such that the second piece 36 rotates about the second bent portion 35. The resin layer 24 is elastically deformed so that a gap is formed between them. Thereby, it is possible to prevent an excessive force from acting on a joint portion between the second piece 36 of the connection member 30 and the external circuit board 70, and it is possible to improve joint reliability.

また、接続部材３０の第１片３２と基板本体５０との接合部分については、接続部材３０の第１片３２が大略第１の屈曲部３３を中心に、基板本体５０から離れる方向に回動しようとする。しかし、樹脂層２４によってこの回動が阻止され、接続部材３０の第１片３２と基板本体５０との間の接合部分に無理な力が作用しないようにすることができる。   In addition, with respect to the joint portion between the first piece 32 of the connection member 30 and the substrate body 50, the first piece 32 of the connection member 30 rotates about the first bent portion 33 in the direction away from the substrate body 50. try to. However, this rotation is prevented by the resin layer 24, and an excessive force can be prevented from acting on the joint portion between the first piece 32 of the connection member 30 and the substrate body 50.

また、図１５（Ｃ）に示すように、外部回路基板７０の表面７１が凹状に湾曲した場合、樹脂層２４の弾性変形と接続部材３０の弾性変形とにより、接続部材３０の第２片３６と外部回路基板７０との間の接合部分と、接続部材３０の第１片３２と基板本体５０との間の接合部分に作用する力を緩和することができる。   As shown in FIG. 15C, when the surface 71 of the external circuit board 70 is concavely curved, the second piece 36 of the connection member 30 is caused by the elastic deformation of the resin layer 24 and the elastic deformation of the connection member 30. The force acting on the joint portion between the first circuit board 32 and the external circuit board 70 and the joint portion between the first piece 32 of the connection member 30 and the substrate body 50 can be reduced.

このとき、接続部材３０の第１の屈曲部３３付近に応力が集中するが、樹脂層２４があるので接合が補強され、応力集中が緩和され、接合信頼性をより高めることができる。   At this time, stress concentrates in the vicinity of the first bent portion 33 of the connecting member 30, but since the resin layer 24 is present, the joining is reinforced, the stress concentration is relaxed, and the joining reliability can be further improved.

また、複合基板を外部回路基板７０に実装するときや、落下等の衝撃が加わったとき、図１５（Ｄ）に示すように、複合基板を外部回路基板７０の略中心に押圧力Ｗ１が作用すると、この押圧力Ｗ１は、大略、接続部材３０の中間片３４により伝達される反力Ｗ２と釣り合う。このとき、押圧力Ｗ１と反力Ｗ２とが作用する位置がずれているため、曲げモーメントＭが発生する。この曲げモーメントＭは、接続部材３０の第２片３６と外部回路基板７０との間の接合部分や、接続部材３０の第１片３２と基板本体５０との間の接合部分に作用する。曲げモーメントＭの大きさは、対向する接続部材３０の中間片３４間の距離Ｌに略比例する。   Further, when the composite board is mounted on the external circuit board 70 or when an impact such as dropping is applied, a pressing force W1 is applied to the approximate center of the external circuit board 70 as shown in FIG. Then, this pressing force W1 is approximately balanced with the reaction force W2 transmitted by the intermediate piece 34 of the connecting member 30. At this time, since the position where the pressing force W1 and the reaction force W2 act is shifted, a bending moment M is generated. The bending moment M acts on a joint portion between the second piece 36 of the connection member 30 and the external circuit board 70 and a joint portion between the first piece 32 of the connection member 30 and the substrate body 50. The magnitude of the bending moment M is substantially proportional to the distance L between the intermediate pieces 34 of the connecting member 30 facing each other.

そのため、図１５（Ａ）の場合と同様に、中間片３４間の距離Ｌが小さくなる構成、すなわち、対向する接続部材３０の中間片３４が内側に配置される構成により、接合部分に作用する曲げモーメントＭを小さくして接合信頼性を高めることができる。   Therefore, similarly to the case of FIG. 15A, the structure in which the distance L between the intermediate pieces 34 is reduced, that is, the structure in which the intermediate pieces 34 of the connecting member 30 facing each other are arranged on the inner side acts on the joint portion. The bending moment M can be reduced to increase the joining reliability.

＜接続部材の構成２＞ 接合信頼性の向上という観点からは、図５（ｂ）に示した断面Ｚ字状の接続部材３０ａも好ましい。以下、図１６を参照しながら説明する。   <Configuration 2 of Connecting Member> From the viewpoint of improving the bonding reliability, the connecting member 30a having a Z-shaped cross section shown in FIG. 5B is also preferable. Hereinafter, a description will be given with reference to FIG.

一般に、基板本体１０と外部回路基板７０とは熱膨張率又は線膨張係数が異なるため、図１６（Ａ）に示すように、例えば複合基板を外部回路基板７０に接合するためのリフロー工程や、使用時の温度上昇によって、配置されている接続部材３０ａと基板本体１０や外部回路基板７０との間の接合部分に、せん断力Ｆｓや曲げモーメントＭｓが作用する。このとき、接続部材３０ａが弾性変形して、接続部材３０ａの第１片３２ａと基板本体１０との接合部分や、接続部材３０ａの第２片３６ａと外部回路基板７０との接合部分に作用する応力を緩和する。   In general, since the substrate body 10 and the external circuit board 70 have different thermal expansion coefficients or linear expansion coefficients, as shown in FIG. 16 (A), for example, a reflow process for bonding the composite board to the external circuit board 70, A shearing force Fs and a bending moment Ms act on a joint portion between the connecting member 30a and the board body 10 or the external circuit board 70 that are disposed due to a temperature rise during use. At this time, the connection member 30a is elastically deformed and acts on the joint portion between the first piece 32a of the connection member 30a and the substrate body 10 and the joint portion between the second piece 36a of the connection member 30a and the external circuit board 70. Relieve stress.

基板本体１０側の伸びδ１は、対向して配置された接続部材３０ａの第１屈曲部３３ａ間の距離Ｌ１と基板本体１０の線膨張係数α１との積となる。外部回路基板７０側の伸びδ２は、対向して配置された接続部材３０ａの第２屈曲部３５ａ間の距離Ｌ２と外部回路基板７０の線膨張係数α２との積となる。せん断力Ｆｓや曲げモーメントＭｓは、δ２−δ１＝α２×Ｌ２−α１×Ｌ１に比例する。一般に、セラミック等の基板本体１０の線膨張係数α１は、樹脂製のプリント配線基板等の外部回路基板７０の線膨張係数α２よりも小さく、α１＜α２であるため、δ２−δ１＝α２×Ｌ２−α１×Ｌ１は、Ｌ１＞Ｌ２の場合の方が、Ｌ１＜Ｌ２の場合よりも小さくなり、せん断力Ｆｓや曲げモーメントＭｓも小さくなる。したがって、対向する接続部材３０ａは、図１６に示したように、Ｌ１＞Ｌ２となるように配置とすると、接合部分に作用するせん断力Ｆｓや曲げモーメントＭｓが小さくなり、接合信頼性が向上するので、好ましい。The elongation δ 1 on the substrate body 10 side is the product of the distance L1 between the first bent portions 33a of the connecting members 30a arranged to face each other and the linear expansion coefficient α 1 of the substrate body 10. The extension δ 2 on the external circuit board 70 side is the product of the distance L2 between the second bent portions 35a of the connecting members 30a arranged opposite to each other and the linear expansion coefficient α 2 of the external circuit board 70. The shear force Fs and the bending moment Ms are proportional to δ 2 −δ 1 = α 2 × L 2 −α 1 × L 1 . In general, linear expansion coefficient alpha 1 of the substrate main body 10 of ceramic or the like is smaller than the linear expansion coefficient alpha 2 of the external circuit board 70 such as a resin of a printed wiring board, a α 1 <α 2, δ 2 - δ 1 = α 2 × L2−α 1 × L1 is smaller in the case of L1> L2 than in the case of L1 <L2, and the shearing force Fs and the bending moment Ms are also small. Therefore, as shown in FIG. 16, when the facing connection members 30a are arranged so that L1> L2, the shearing force Fs and the bending moment Ms acting on the joining portion are reduced, and the joining reliability is improved. Therefore, it is preferable.

なお、本発明は、Ｌ１＜Ｌ２の場合、すなわち、対向して配置された接続部材３０ａを図１６において左右を入れ替えて配置し、対向して配置された接続部材３０ａの第１の屈曲部３３ａ同士を内側に配置し、接続部材３０ａの第２の屈曲部３５ａ同士を外側に配置する場合や、対向する接続部材３０ａを非対称に配置する場合を排除するものではない。   In the present invention, in the case of L1 <L2, that is, the connecting members 30a arranged to face each other are arranged with their left and right sides reversed in FIG. 16, and the first bent portions 33a of the connecting members 30a arranged to face each other are arranged. It does not exclude the case where they are arranged inside and the second bent portions 35a of the connection members 30a are arranged outside, or the case where the opposing connection members 30a are arranged asymmetrically.

また、金属と樹脂は接着しにくいため、金属薄板を折り曲げ加工した接続部材３０ａは、樹脂層２４に埋設されていても、樹脂層２４に接着していなかったり、接着していても接着部分が簡単に剥離したりするので、容易に弾性変形することができる。   In addition, since the metal and the resin are difficult to bond, the connecting member 30a obtained by bending the metal thin plate is embedded in the resin layer 24, not bonded to the resin layer 24, or bonded even if bonded. Since it peels easily, it can be easily elastically deformed.

そのため、図１６（Ｂ）に示すように、外部回路基板７０の表面７１が凸状に湾曲した場合、接続部材３０ａは、第２片３６ａが大略第２の屈曲部３５ａを中心に回動し、樹脂層２４との間に隙間が形成されるように弾性変形する。これによって、接続部材３０ａの第２片３６ａと外部回路基板７０との間の接合部分に無理な力が作用しないようにして、接合信頼性を高めることができる。   Therefore, as shown in FIG. 16B, when the surface 71 of the external circuit board 70 is curved in a convex shape, the connection member 30a is such that the second piece 36a rotates about the second bent portion 35a. The resin layer 24 is elastically deformed so that a gap is formed between them. Thereby, it is possible to improve the bonding reliability by preventing an excessive force from acting on the bonding portion between the second piece 36a of the connection member 30a and the external circuit board 70.

また、接続部材３０ａの第１片３２ａと基板本体１０との接合部分については、接続部材３０ａの第１片３２ａ以外の部分が大略第１の屈曲部３３ａを中心に、基板本体１０を押圧する方向に回動しようとするが、樹脂層２４によって回動が阻止され、接続部材３０ａの第１片３２ａと基板本体１０との間の接合部分に無理な力が作用しないようにして、接合信頼性を高めることができる。   In addition, with respect to the joint portion between the first piece 32a of the connection member 30a and the substrate body 10, the portion other than the first piece 32a of the connection member 30a presses the substrate body 10 about the first bent portion 33a. The rotation is prevented by the resin layer 24, but the force is not applied to the bonding portion between the first piece 32a of the connection member 30a and the substrate body 10, so that the bonding reliability is ensured. Can increase the sex.

また、図１６（Ｃ）に示すように、外部回路基板７０の表面７１が凹状に湾曲した場合、樹脂層２４の弾性変形と接続部材３０ａの弾性変形とにより、接続部材３０ａの第２片３６ａと外部回路基板７０との間の接合部分と、接続部材３０ａの第１片３２ａと基板本体１０との間の接合部分に作用する力を緩和することができる。   As shown in FIG. 16C, when the surface 71 of the external circuit board 70 is concavely curved, the second piece 36a of the connecting member 30a is caused by the elastic deformation of the resin layer 24 and the elastic deformation of the connecting member 30a. The force acting on the joint portion between the external circuit board 70 and the joint portion between the first piece 32a of the connection member 30a and the substrate body 10 can be reduced.

接続部材３０ａの配置が図１６とは逆の場合、すなわち、対向する接続部材３０ａの第１の屈曲部３３ａが内側に配置され、第２の屈曲部３５ａが外側に配置された場合であっても、同様に、外部回路基板７０の表面７１の凸状又は凹状の湾曲に対する接合信頼性を高めることができる。すなわち、外部回路基板７０が凸状又は凹状に湾曲しても、接続部材３０ａは、接続部材３０ａの第２片３６ａが樹脂層２４から離れるように弾性変形し、第１片３２ａ又は第２片３６ａの回動が樹脂層２４によって阻止される。そのため、接合部分に無理な力が作用しないようにして、接合信頼性を高めることができる。   The arrangement of the connecting member 30a is opposite to that in FIG. 16, that is, the first bent portion 33a of the opposing connecting member 30a is arranged on the inner side and the second bent portion 35a is arranged on the outer side. Similarly, the bonding reliability with respect to the convex or concave curvature of the surface 71 of the external circuit board 70 can be enhanced. That is, even if the external circuit board 70 is curved in a convex shape or a concave shape, the connection member 30a is elastically deformed so that the second piece 36a of the connection member 30a is separated from the resin layer 24, and the first piece 32a or the second piece. The rotation of 36 a is prevented by the resin layer 24. Therefore, it is possible to improve the bonding reliability by preventing an excessive force from acting on the bonded portion.

また、複合基板を外部回路基板７０に実装するときや、落下等の衝撃が加わったとき、図１６（Ｄ）に示すように、複合基板の略中心に押圧力Ｗ１が作用すると、この押圧力Ｗ１は、大略、接続部材３０ａの中間片３４ａにより伝達される反力Ｗ２と釣り合う。押圧力Ｗ１と反力Ｗ２とが作用する位置がずれているため、曲げモーメントＭが発生する。   Further, when the composite board is mounted on the external circuit board 70 or when an impact such as dropping is applied, as shown in FIG. 16D, when the pressing force W1 acts on the approximate center of the composite board, this pressing force is applied. W1 is roughly balanced with the reaction force W2 transmitted by the intermediate piece 34a of the connecting member 30a. Since the position where the pressing force W1 and the reaction force W2 act is shifted, a bending moment M is generated.

この曲げモーメントＭにより、接続部材３０ａが第１の屈曲部３３ａや第２の屈曲部３５ａを中心に回動しようとする。このとき、接続部材３０ａの第１片３２ａは、樹脂層２４ａによって回動が阻止される。また、接続部材３０ａの第２片３６ａは、樹脂層２４との間に隙間が形成されるように弾性変形する。これにより、接合部分に無理な力が作用しないようにして、接合信頼性を高めることができる。   Due to this bending moment M, the connecting member 30a tries to rotate around the first bent portion 33a and the second bent portion 35a. At this time, the first piece 32a of the connection member 30a is prevented from rotating by the resin layer 24a. Further, the second piece 36 a of the connection member 30 a is elastically deformed so that a gap is formed between the second piece 36 a and the resin layer 24. Thereby, it is possible to increase the bonding reliability by preventing an excessive force from acting on the bonding portion.

押圧力Ｗ１が図示とは逆向きに作用した場合、接続部材３０ａの第１片３２ａや第２片３６ａの回動が樹脂層２４によって阻止され、接合部分に無理な力が作用しないようにして、接合信頼性を高めることができる。   When the pressing force W1 acts in the direction opposite to that shown in the drawing, the rotation of the first piece 32a and the second piece 36a of the connecting member 30a is prevented by the resin layer 24, so that excessive force does not act on the joint portion. In addition, the bonding reliability can be improved.

＜まとめ＞ 以上に説明したように、接続部材は、塑性変形するよう折り曲げられた連続する金属端子であるため、ＸＹＺ方向いずれにも弾性変形する。また、樹脂層と接続部材は基本的に接合しておらず、接続部材は樹脂塗布硬化後もＸＹＺ方向に自由に弾性変形する。そのため、複合基板を外部回路基板に実装する際のリフロー、その後のヒートサイクル時の熱による各部の線膨張率の差による熱応力を、接続部材の弾性変形によって吸収でき、接合信頼性が高い。また、落下衝撃時の衝撃応力に対する接合信頼性も高い。   <Summary> As described above, since the connection member is a continuous metal terminal bent so as to be plastically deformed, it is elastically deformed in any of the XYZ directions. Further, the resin layer and the connecting member are basically not joined, and the connecting member is elastically deformed freely in the XYZ directions even after the resin coating is cured. Therefore, reflow when the composite substrate is mounted on the external circuit substrate, and thermal stress due to the difference in linear expansion coefficient of each part due to heat during the subsequent heat cycle can be absorbed by elastic deformation of the connecting member, and the bonding reliability is high. In addition, the bonding reliability against impact stress at the time of drop impact is high.

樹脂層の形成により、接続部材の埋め込みとチップ状電子部品の封止とを同時に行うことができ、接続部材が埋め込まれるなどした別部材、すなわち基板本体と外部回路基板との間に間隔を確保するための別部材を基板本体の一方主面に接合する場合よりも構成が簡単であり、製造工程も簡単になる。   By forming the resin layer, it is possible to embed the connection member and seal the chip-like electronic component at the same time, ensuring a space between the separate member that is embedded in the connection member, that is, the board body and the external circuit board. Therefore, the configuration is simpler than the case of joining another member to the main surface of the substrate body, and the manufacturing process is also simplified.

さらに、接続部材が埋め込まれるなどした別部材を基板本体の一方主面に接合する場合よりも、複合基板を小型化することができる。接続部材が埋め込まれるなどした別部材の寸法のばらつきや基板本体への接合位置のばらつき等を考慮して寸法に余裕を持たせる必要がないからである。   Furthermore, the composite substrate can be made smaller than when another member in which the connection member is embedded is joined to one main surface of the substrate body. This is because it is not necessary to allow a sufficient dimension in consideration of variations in dimensions of other members in which the connection member is embedded, variations in the bonding position to the substrate body, and the like.

液状の封止樹脂を塗布し、硬化させて樹脂層を形成するとき、樹脂の硬化収縮率は高々０．５％以下でわずかであるので、樹脂層に埋設される接続部材を変形させない。接続部材は、金属薄板から形成すると、細く、薄く、多端子の場合でも端子変形や端子同士の接触不良がないため、めっき等で形成する場合に比べて優れている。また、接続部材を安価に製造することができ、接続部材のピッチを狭くすることも容易である。   When a liquid sealing resin is applied and cured to form a resin layer, the curing shrinkage of the resin is at most 0.5% or less, so that the connecting member embedded in the resin layer is not deformed. When the connection member is formed from a thin metal plate, the connection member is thin and thin, and even if it is a multi-terminal, there is no terminal deformation or poor contact between the terminals. Further, the connecting member can be manufactured at a low cost, and it is easy to reduce the pitch of the connecting member.

接続部材が埋め込まれるなどした別部材を基板本体の一方主面に接合する場合、別部材のねじれや反りにより基板本体との接合信頼性が低下するが、封止樹脂を流し込んで接続部材の埋め込みとチップ状電子部品の封止とを同時に行うと、そのような問題が発生しない。接続部材そのものは容易に弾性変形し、基板本体に沿って接合されるので、接合信頼性も高い。   When joining another member, such as a connection member embedded, to one main surface of the board body, the reliability of joining to the board body is reduced by twisting or warping of the other member, but the sealing resin is poured to embed the connection member. Such a problem does not occur when the chip-shaped electronic component is simultaneously sealed. Since the connection member itself is easily elastically deformed and joined along the substrate body, the joining reliability is also high.

樹脂に圧力を加え、インサート成形する場合には、折り曲げられた接続部材上にも樹脂が流れ込み、付着すると、はんだ付けができなくなり、他部材との接合信頼性が低下する。液状の封止樹脂を、圧力を加えずに流し込むことによって樹脂層を形成すると、そのような問題がない。   When insert molding is performed by applying pressure to the resin, if the resin also flows onto and adheres to the bent connection member, soldering cannot be performed, and joint reliability with other members decreases. When the resin layer is formed by pouring a liquid sealing resin without applying pressure, there is no such problem.

また、接続部材が埋め込まれるなどした別部材がないので、封止樹脂に簡単にスリットを入れることができる。スリットを入れることによって、封止樹脂の硬化収縮による基板反りがなくなり、良品率が向上する。   Further, since there is no separate member in which the connecting member is embedded, a slit can be easily formed in the sealing resin. By inserting the slit, the substrate warp due to the curing shrinkage of the sealing resin is eliminated, and the yield rate is improved.

また、接続部材を金属薄板の折り曲げ加工で形成し、それを被覆するように樹脂を流し込むと、工程が簡単になり、製造コストを低減することができる。   Further, when the connecting member is formed by bending a thin metal plate and the resin is poured so as to cover the connecting member, the process becomes simple and the manufacturing cost can be reduced.

また、金属薄板の折り曲げ加工で形成された接続部材で、基板本体と外部回路基板との間を接合することにより、金属の弾性変形で応力を吸収し、強度を向上させることができる。   Further, by joining the substrate body and the external circuit board with a connecting member formed by bending a thin metal plate, the stress can be absorbed by the elastic deformation of the metal and the strength can be improved.

また、接続部材を金属薄板の折り曲げ加工すると、接続部材に用いる金属薄板の材質は、めっきにより接続部材を形成する場合よりも、選択の自由度が高い。接続部材の金属と樹脂層とは、強固に接合されている必要はない。そのため、樹脂層に用いる樹脂の材質も、選択の自由度が高い。したがって、安価な材質、折り曲げやすい材質、成形しやすい材質を、高い自由度で選定することができ、工業上、有用である。   Further, when the connecting member is bent, the metal thin plate used for the connecting member has a higher degree of freedom in selection than when the connecting member is formed by plating. The metal of the connecting member and the resin layer do not need to be firmly joined. Therefore, the resin material used for the resin layer is also highly flexible. Therefore, an inexpensive material, a material that can be easily bent, and a material that can be easily molded can be selected with a high degree of freedom, which is industrially useful.

なお、本発明は、上記した実施の形態に限定されるものではなく、種々変更を加えて実施可能である。   The present invention is not limited to the above-described embodiment, and can be implemented with various modifications.

実施例では、基板本体が平板状の場合を図示しているが、基板本体の主面のいずれか一方又は両方に、キャビティ（凹部）が形成されていてもよい。   In the embodiment, the case where the substrate body is a flat plate is illustrated, but a cavity (concave portion) may be formed on one or both of the main surfaces of the substrate body.

Claims (7)

基板本体の一方主面に、金属薄板の折り曲げ加工により形成され中間片の両端にそれぞれ第１片と第２片とが連続する複数の接続部材のそれぞれの前記第１片を接合するとともに、前記基板本体の前記一方主面にチップ状電子部品を搭載する、第１の工程と、
前記チップ状電子部品の少なくとも一部と少なくとも前記接続部材のそれぞれの前記第１片とを覆い、かつ、少なくとも前記接続部材のそれぞれの前記第２片の前記基板本体とは反対側の面が露出するように、前記基板本体の前記一方主面に樹脂層を形成する、第２の工程と、
を備え、
前記第１の工程と前記第２の工程とを、複数個分の前記基板本体となる部分を含む集合基板の状態で、複数個分の前記複合基板についてまとめて行い、
前記第２の工程の後に、前記複合基板の分割線に沿って前記樹脂層にスリットを形成する工程を、さらに備えたことを特徴とする複合基板の製造方法。Bonding the first piece of each of the plurality of connecting members formed by bending a thin metal plate on one main surface of the substrate body and having the first piece and the second piece continuous to both ends of the intermediate piece, A first step of mounting a chip-like electronic component on the one main surface of the substrate body;
Covering at least a part of the chip-shaped electronic component and at least the first piece of each of the connection members, and exposing at least the surface of each of the connection members opposite to the substrate body. A second step of forming a resin layer on the one main surface of the substrate body,
Equipped with a,
The first step and the second step are collectively performed on a plurality of the composite substrates in a state of a collective substrate including a portion to be a plurality of the substrate main bodies,
A method of manufacturing a composite substrate , further comprising a step of forming a slit in the resin layer along a dividing line of the composite substrate after the second step . 前記第２の工程において、前記チップ状電子部品の少なくとも一部と少なくとも前記接続部材のそれぞれの前記第１片とを覆い、かつ、少なくとも前記接続部材のそれぞれの前記第２片の前記基板本体とは反対側の面が露出するように、前記基板本体の前記一方主面に液状の樹脂を塗布し、硬化させることにより、前記樹脂層を形成することを特徴とする、請求項１に記載の複合基板の製造方法。  In the second step, at least a part of the chip-shaped electronic component and at least the first piece of each of the connection members are covered, and at least the substrate body of each of the second pieces of the connection members; 2. The resin layer according to claim 1, wherein the resin layer is formed by applying and curing a liquid resin on the one main surface of the substrate body so that the opposite surface is exposed. A method of manufacturing a composite substrate. 前記基板本体の他方主面に他のチップ状電子部品を搭載する工程を、さらに備えることを特徴とする、請求項１又は２に記載の複合基板の製造方法。Wherein the step of mounting the other electronic chip parts on the other main surface of the substrate main body, characterized in that it comprises further method of producing a composite substrate according to claim 1 or 2. 前記基板本体は、１０５０℃以下で焼結する複数のセラミック層を積層してなる積層体の内部に導体パターンを有するセラミック多層基板であることを特徴とする、請求項１〜３のいずれか一項に記載の複合基板の製造方法。The said board | substrate main body is a ceramic multilayer substrate which has a conductor pattern inside the laminated body formed by laminating | stacking the several ceramic layer sintered at 1050 degrees C or less, The any one of Claims 1-3 characterized by the above-mentioned. The manufacturing method of the composite substrate as described in an item. 前記第１の工程において、前記接続部材は、
前記第１片及び前記第２片が前記中間片に関して同じ側に延在し、
前記中間片同士が対向し、かつ、前記第１片及び前記第２片が前記中間片同士の間よりも外側に延在するように、前記第１片が前記基板本体の前記一方主面に接合されることを特徴とする、請求項１〜４のいずれか一項に記載の複合基板の製造方法。In the first step, the connecting member is
The first piece and the second piece extend on the same side with respect to the intermediate piece;
The first piece is placed on the one main surface of the substrate body so that the intermediate pieces face each other and the first piece and the second piece extend outside the space between the intermediate pieces. characterized in that it is bonded, a composite substrate manufacturing method according to any one of claims 1-4. 前記第１の工程において、前記接続部材は
前記第１片及び前記第２片が前記中間片に関して互いに反対側に延在し、
前記中間片同士が対向し、かつ、前記第１片又は前記第２片の一方同士が前記中間片同士の間よりも外側に延在し、かつ、前記第１片又は前記第２片の他方同士が前記中間片同士の間に延在するように、前記第１片が前記基板本体の前記一方主面に接合されることを特徴とする、請求項１〜４のいずれか一項に記載の複合基板の製造方法。In the first step, the connection member includes the first piece and the second piece extending on opposite sides with respect to the intermediate piece,
The intermediate pieces are opposed to each other, and one of the first piece or the second piece extends outside the space between the intermediate pieces, and the other of the first piece or the second piece. as each other to extend between the adjacent said intermediate piece, the first piece is characterized in that it is joined to the one main surface of the substrate main body, according to any one of claims 1-4 A method for manufacturing a composite substrate. 前記接続部材は、前記第１片の面積が、前記第２片の面積よりも大きいことを特徴とする、請求項１〜６のいずれか一項に記載の複合基板の製造方法。Said connecting member, the area of the first piece is characterized in that said greater than the area of the second piece, a manufacturing method of a composite substrate according to any one of claims 1-6.
JP2008515459A 2006-05-17 2007-04-13 Manufacturing method of composite substrate Expired - Fee Related JP4725817B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2008515459A JP4725817B2 (en) 2006-05-17 2007-04-13 Manufacturing method of composite substrate

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2006138333 2006-05-17
JP2006138333 2006-05-17
JP2008515459A JP4725817B2 (en) 2006-05-17 2007-04-13 Manufacturing method of composite substrate
PCT/JP2007/058155 WO2007132612A1 (en) 2006-05-17 2007-04-13 Composite substrate and method for manufacturing same

Publications (2)

Publication Number Publication Date
JPWO2007132612A1 JPWO2007132612A1 (en) 2009-09-24
JP4725817B2 true JP4725817B2 (en) 2011-07-13

Family

ID=38693713

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2008515459A Expired - Fee Related JP4725817B2 (en) 2006-05-17 2007-04-13 Manufacturing method of composite substrate

Country Status (2)

Country Link
JP (1) JP4725817B2 (en)
WO (1) WO2007132612A1 (en)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5481680B2 (en) 2010-04-28 2014-04-23 三菱電機株式会社 Semiconductor device and manufacturing method of semiconductor device
JP2012147403A (en) * 2011-01-14 2012-08-02 Mitsumi Electric Co Ltd High-frequency module
JP2013069800A (en) * 2011-09-21 2013-04-18 Nec Corp Structure and method for mounting semiconductor device
WO2013054808A1 (en) * 2011-10-14 2013-04-18 株式会社村田製作所 Multilayer substrate, and module provided with multilayer substrate
CN104471707B (en) * 2012-07-26 2017-07-04 株式会社村田制作所 Semiconductor module
CN111566805B (en) 2018-01-11 2023-11-14 株式会社村田制作所 Component-embedded module and method for manufacturing same
WO2020218289A1 (en) 2019-04-26 2020-10-29 株式会社村田製作所 Module component, antenna module, and communication device

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01204379A (en) * 1987-12-08 1989-08-16 Rogers Corp Leadless ceramic chip-carrier socket
JPH02207559A (en) * 1989-02-07 1990-08-17 Fujitsu Ltd Two row parallel multi-terminal terminal hybrid integrated circuit device
JPH0742164U (en) * 1993-12-24 1995-07-21 富士通テン株式会社 Electronic component mounting circuit board
JPH07249733A (en) * 1994-03-14 1995-09-26 Fujitsu Ltd Semiconductor device
JPH11121897A (en) * 1997-10-14 1999-04-30 Fujitsu Ltd Structure and production of printed wiring board mounting a plurality of circuit elements
JP2003068968A (en) * 2001-08-29 2003-03-07 Pfu Ltd Semiconductor integrated circuit device
WO2006027888A1 (en) * 2004-09-08 2006-03-16 Murata Manufacturing Co., Ltd. Composite ceramic substrate

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01204379A (en) * 1987-12-08 1989-08-16 Rogers Corp Leadless ceramic chip-carrier socket
JPH02207559A (en) * 1989-02-07 1990-08-17 Fujitsu Ltd Two row parallel multi-terminal terminal hybrid integrated circuit device
JPH0742164U (en) * 1993-12-24 1995-07-21 富士通テン株式会社 Electronic component mounting circuit board
JPH07249733A (en) * 1994-03-14 1995-09-26 Fujitsu Ltd Semiconductor device
JPH11121897A (en) * 1997-10-14 1999-04-30 Fujitsu Ltd Structure and production of printed wiring board mounting a plurality of circuit elements
JP2003068968A (en) * 2001-08-29 2003-03-07 Pfu Ltd Semiconductor integrated circuit device
WO2006027888A1 (en) * 2004-09-08 2006-03-16 Murata Manufacturing Co., Ltd. Composite ceramic substrate

Also Published As

Publication number Publication date
WO2007132612A1 (en) 2007-11-22
JPWO2007132612A1 (en) 2009-09-24

Similar Documents

Publication Publication Date Title
JP4873005B2 (en) Composite substrate and method for manufacturing composite substrate
JP4821849B2 (en) Composite substrate and method for manufacturing composite substrate
JP4367414B2 (en) Component built-in module and manufacturing method thereof
JP4337822B2 (en) Manufacturing method of multilayer electronic component
JP4310467B2 (en) Composite multilayer substrate and manufacturing method thereof
JP4725817B2 (en) Manufacturing method of composite substrate
JP4957163B2 (en) Composite parts
US7450395B2 (en) Circuit module and circuit device including circuit module
WO2008001641A1 (en) Interconnect substrate and electronic circuit mounted structure
US7807510B2 (en) Method of manufacturing chip integrated substrate
KR20080040057A (en) Composite ceramic substrate
US20050263868A1 (en) Semiconductor device, method for manufacturing the same, circuit board, and electronic equipment
JP4752612B2 (en) Manufacturing method of circuit board with protruding electrode
JP5397012B2 (en) Component built-in wiring board, method of manufacturing component built-in wiring board
JP2005026573A (en) Manufacturing method of module with built-in component
JP4403820B2 (en) Multilayer electronic component and manufacturing method thereof
JP2005235807A (en) Stacked electronic component and its manufacturing method
WO2012165111A1 (en) Method for producing multi-layer substrate and multi-layer substrate
JP4788581B2 (en) Composite board
JP2002026244A (en) Multilayer module and its manufacturing method
JP5109361B2 (en) Composite board
WO2005071742A1 (en) Multilayer electronic component manufacturing method
JP2008135483A (en) Substrate incorporating electronic component and its manufacturing method

Legal Events

Date Code Title Description
A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20101228

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20110224

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20110317

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20110330

R150 Certificate of patent or registration of utility model

Ref document number: 4725817

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

Free format text: JAPANESE INTERMEDIATE CODE: R150

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20140422

Year of fee payment: 3

LAPS Cancellation because of no payment of annual fees