JP2001344587A - Printed wiring board and module for ic card using the same and method for manufacturing the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a printed wiring board to be preferentially used for improving the reliability of an IC card and a module for an IC card using the printed wiring board. SOLUTION: This module 10 for an IC card is provided with a printed wiring board 11 on whose upper face wiring 12 is printed, a semiconductor device 13 mounted on the printed wiring board 11, a wire 14 for connecting the wiring 12 with the semiconductor device 13, a chip component 15 such as a resistor or a capacitor, and resin 16 for sealing the semiconductor device 13 and the wiring 14. In this case, the semiconductor device 13 and a terminal 18 are arranged at separate positions on a base material 17. Thus, at the time of connecting the IC card manufactured by using the module 10 for the IC card with external equipment equipped with an IC card slot, it is not necessary to insert the semiconductor device 13 into the slot when the terminal 18 is inserted into the slot. Thus it is possible to manufacture the IC card in which the semiconductor device 13 can be prevented from being affected by any mechanical stress from the outside part or heat from the outside equipment.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a printed wiring board and an IC card module using the same, and more particularly to an improvement in the reliability of an IC card.

[0002]

2. Description of the Related Art Recently, in order to reduce the size of IC cards, reduce the number of components, improve bending strength, and reduce costs, semiconductor devices are directly mounted on printed wiring boards and the semiconductor devices are sealed with resin. An IC card module has been proposed.

Hereinafter, a conventional IC card module will be described with reference to FIG. FIG. 12A is a top view of a conventional IC card module, and FIG.
FIG. 13 is a sectional view taken along line XX of FIG.

A conventional IC card module 110 is
Substrate 111 and semiconductor device 1 mounted on substrate 111
13, a terminal 118 provided on the lower surface of the substrate 111,
A connection hole (not shown) penetrating the substrate 111 to reach the terminal 118, a connection land (not shown) formed on the substrate 111 and connected to the terminal 118 through the connection hole,
A wire 114 for connecting the connection land and the semiconductor device 113 to each other, and a resin 11 for sealing the semiconductor device 113
6. The wire 114 is a conductive wire made of a metal such as gold or aluminum.

[0005] Resin 116 encapsulating semiconductor device 113
Are molded by a transfer molding method using a thermosetting resin, a potting method, a printing method, an injection molding method using a thermoplastic resin, or the like.

The above-described IC card module 110 is
The IC card is formed by exposing the terminal 118 and attaching it to a case or the like.

[0007]

As described above, the conventional IC card module 110 has the terminal 118 provided on the opposite side of the semiconductor device 113 with the substrate 111 interposed therebetween. Therefore, for example, when connecting an external device having an IC card slot to an IC card, the semiconductor device 113 is inserted into the slot when the terminal 118 is inserted into the slot. Therefore, the semiconductor device 113
May be affected by external mechanical stress and heat from external devices.

SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned problems, and it is an object of the present invention to provide a printed wiring board suitably used for improving the reliability of an IC card and an IC card module using the same. Aim.

[0009]

According to the present invention, there is provided an IC card module comprising: a resin sealing region; a clamp region of a peripheral portion of the resin sealing region which is clamped by a sealing mold; A base material having an unclamped region that is not clamped among the peripheral portions of the region, a semiconductor device mounted on the upper surface of the base material, and a terminal for external connection provided on the upper surface of the base material; A wiring provided on an upper surface of the base material for connecting the semiconductor device and the terminal to each other; and a resin for sealing the semiconductor device. The terminal includes the resin sealing region and the clamp. Region and the non-clamp region.

[0010] Thus, the semiconductor device and the terminal are provided at positions separated from each other on the base material. Therefore, IC
An IC card manufactured using the card module;
In a case where external devices having an IC card slot are connected to each other, the terminal can be inserted into the slot without inserting the semiconductor device into the slot. Therefore, an IC card having a structure in which the semiconductor device is not affected by external mechanical stress, heat from external devices, and the like can be manufactured. That is, according to the present invention, an IC card having extremely high reliability can be obtained.

Preferably, the wiring is provided on the upper surface of the base via a non-clamped area.

As a result, damage to the wiring caused by clamping with a sealing mold is suppressed and prevented. Therefore,
An IC card module with reduced disconnection and short circuit is obtained. In addition, since the wiring is arranged so as not to be clamped by the sealing mold, if a solder resist is provided on the printed wiring board, the surface to be clamped by the sealing mold has a wavy surface. There is no solder resist. Therefore, an IC card module that is accurately sealed with resin without causing resin leakage can be obtained.

[0013] The unclamped area on the upper surface of the substrate is
It may be a region corresponding to the resin injection gate portion or the air vent portion of the sealing mold.

[0014] At least one inner layer wiring and an insulating layer thereon are provided on the upper surface of the base material. The semiconductor device is provided on the insulating layer. It is preferable that the portion located at the peripheral portion is an inner layer wiring.

As a result, the wiring of the inner layer wiring is vertically sandwiched by the base material and is in a state of being mechanically protected. That is, it is possible to reduce the damage to the wiring due to the bending of the portion that is not resin-sealed when the IC card module is bent by an external force.

It is preferable that a solid pattern is provided in a region of the peripheral portion of the resin sealing region where no wiring is provided.

As a result, the bending of the peripheral portion of the resin sealing region is reduced, and the damage to the wiring and the base material can be further reduced.

It is preferable that the upper surface of the solid pattern is located at a height higher than the upper surface of the wiring.

This prevents the wiring from being clamped by the sealing mold at the periphery of the resin sealing region. Therefore, it is possible to prevent damage to the wiring at the time of clamping.

Preferably, the solid pattern functions as a power supply wiring or a ground wiring.

Thus, the voltage of the power supply can be stabilized.

Another semiconductor device provided on the lower surface of the base material, wiring for connecting the other semiconductor device to the terminal, and resin for sealing the another semiconductor device are provided. Is preferred.

By adopting such a double-sided structure, it is possible to increase the number of semiconductor devices that can be mounted on the base material, or to reduce the accommodation volume when mounting the semiconductor devices. That is, an IC card module on which a semiconductor device is mounted with a high degree of integration can be obtained.

The printed wiring board of the present invention has a resin sealing region, a clamp region of a peripheral portion of the resin sealing region which is clamped by a sealing die, and a clamp of a peripheral portion of the resin sealing region. A base having a non-clamped area not to be provided, a connection land provided on the upper surface of the base, and a connection land to which a semiconductor device is connected, and a terminal for external connection provided on the upper surface of the base. A wiring provided on the upper surface of the base material for connecting the connection land and the terminal to each other, wherein the terminal is formed of a resin sealing region, the clamp region, and a region other than the non-clamp region. And the wiring is provided on the upper surface of the base material via a non-clamped region.

As a result, damage to the wiring caused by clamping with a sealing mold is suppressed or prevented. Therefore,
A printed wiring board suitable for use in an IC card module with reduced disconnection and short-circuit is obtained. Also,
Since the wiring is arranged so as not to be clamped by the sealing mold, if a solder resist is provided on the printed wiring board, the solder clamped by the sealing mold has a wavy surface. There is no resist. Therefore, there is no resin leakage, and the resin is sealed with high precision.
A printed wiring board suitably used for a card module is obtained.

The unclamped area on the upper surface of the substrate is
It may be a region corresponding to the resin injection gate portion or the air vent portion of the sealing mold.

It is preferable that a solid pattern is provided in a region of the peripheral portion of the resin sealing region where no wiring is provided.

Thus, the bending of the peripheral portion of the resin sealing region is reduced, and the damage to the wiring and the base material can be further reduced.

It is preferable that the upper surface of the solid pattern is located at a height higher than the upper surface of the wiring.

This prevents the wiring from being clamped by the sealing mold at the peripheral portion of the resin sealing region. Therefore, it is possible to prevent damage to the wiring at the time of clamping.

At least one inner layer wiring and an insulating layer thereon are provided on the upper surface of the base material. The semiconductor device is provided on the insulating layer, and It is preferable that the portion located at the peripheral portion is an inner layer wiring.

As a result, the wiring of the inner layer wiring is sandwiched between the base material and the insulating layer and is in a state of being mechanically protected. That is, it is possible to reduce the damage to the wiring due to the bending of the portion that is not sealed with the resin when the printed wiring board is bent by the external force.

According to the method of manufacturing an IC card module of the present invention, there are provided a resin sealing region, a clamp region of a peripheral portion of the resin sealing region which is clamped by a sealing mold, and a peripheral portion of the resin sealing region. A base having an unclamped region that is not clamped among the portions, a connection land provided on the upper surface of the base and connected to the semiconductor device, and an external connection provided on the upper surface of the base. And a wiring provided on the upper surface of the base material and connecting the connection land and the terminal to each other. The terminal includes the resin sealing region, the clamp region, and the non- A step (a) of providing a printed wiring board provided in a region other than the clamp region and provided via a non-clamp region on the upper surface of the base material; Lumber (B) mounting the semiconductor device and the connection land to each other by a conductor member, and (c) connecting the printed wiring board with a sealing mold. Clamping (d) sealing the semiconductor device with resin.

Thus, damage to the wiring caused by clamping with a mold is suppressed and prevented. Therefore, an IC card module with reduced disconnection and short circuit can be obtained.

In the step (a), a printed wiring board may be prepared in which the non-clamped area on the upper surface of the base material corresponds to a resin injection gate portion or an air vent portion of a sealing mold.

[0036]

Embodiments of the present invention will be described below with reference to the drawings. For the sake of simplicity, components common to the embodiments are denoted by the same reference numerals.

(Embodiment 1) The IC card module 10 of Embodiment 1 will be described with reference to FIGS. 1, 2 and 3. FIG. FIG. 1A is a top view of an IC card module 10 of the present embodiment, and FIG.
FIG. 2A is a cross-sectional view along the line II. FIG. 2 is a top view of the printed wiring board 11 used in the IC card module 10 of the present embodiment. FIG. 3A is a top view of an IC card including the IC card module 10 of the present embodiment, and FIG. 3B is a cross-sectional view along the line III-III of FIG.

As shown in FIGS. 1A and 1B, the IC card module 10 of this embodiment has a wiring 12
Printed wiring board 11, semiconductor device 13 mounted on printed wiring board 11, and wires 14 connecting wiring 12 and semiconductor device 13 to each other.
And a chip component 15 such as a resistor and a capacitor, and a resin 16 in which the semiconductor device 13 and the wire 14 are sealed. The semiconductor device 13, the wires 14, the chip components 15, and the resin 16 are all printed wiring boards 1.
One wiring 12 is provided on the printed surface.

Next, the structure of the printed wiring board 11 will be described below.

As shown in FIG. 2, a printed wiring board 11 used in the IC card module 10 includes a base 17 formed of an insulating material such as a resin, and a wiring 12 printed on the base 17. A terminal 18 provided at an end of the upper surface of the base 17 and a mounting land 19 for mounting the chip component 15 such as a resistor and a capacitor on the base 17.
And a connection land 20 provided at a peripheral portion of the semiconductor device 13 to be mounted. In the printed wiring board 11 of the present embodiment, the terminals 18 and the mounting lands 1
9 and the connection lands 20 are all provided on the surface of the printed wiring board 11 on which the wirings 12 are printed, and are connected to each other by the wirings 12 made of a printed conductive material (such as copper).

The terminals 18 and the mounting lands 19 are provided outside the region C, the resin injection gate region 21 and the air vent region 22 which are clamped by the sealing mold on the base 17. The mounting lands 19 may be provided as needed, and the locations where the mounting lands 19 are provided are not limited.

The connection lands 20 are provided in the region R to be sealed with the resin, and are arranged around the region where the semiconductor device 13 is mounted.

Next, a method of manufacturing the IC card module 10 will be described.

First, a terminal 18, a mounting land 19, and a connection land 20 are provided on the upper surface of the base material 17.
8. A printed wiring board 11 having a wiring 12 for connecting the mounting land 19 and the connection land 20 mutually printed on the upper surface of the base material 17 is prepared. In this embodiment, the terminals 18 and the mounting lands 1 are provided on the upper surface of the printed wiring board 11.
9. Except for the connection lands 20, a solder resist (not shown) is provided. Note that the solder resist may be provided as needed, and may not be particularly provided.

Next, the semiconductor device 13 is fixed on the base material 17 with an adhesive or the like and mounted in the region R to be sealed with resin.

Next, the semiconductor device 13 and the connection lands 20 are connected to each other by wire bonding using the wires 14. In the present embodiment, the semiconductor device 13 is mounted on the printed wiring board 11 by wire bonding, but the BGA (Ball Grid Arr.)
A known method such as ay) may be used.

Next, the semiconductor device 13 mounted on the printed wiring board 11 is sealed with a resin 16. In the present embodiment, sealing is performed by a transfer molding method using a thermosetting resin. The resin may be sealed by a known molding method (a potting method, a printing method, an injection molding method using a thermoplastic resin, or the like). In particular, when the transfer molding method or the injection molding method is used, the resin sealing can be molded with high dimensional accuracy and small-sized cured resin.

In the transfer molding method, a sealing resin to be used is a thermosetting resin (for example, epoxy resin), and a sealing mold having a resin injection gate portion and an air vent portion is used. In the sealing step, the printed wiring board is strongly clamped using a sealing mold, and subsequently, the inside of the sealing mold is filled with a thermosetting resin. At this time, the resin is press-fitted from the resin injection gate portion of the sealing die corresponding to the resin injection gate region 21 on the base material 17 shown in FIG. Air vent area 22 on material 17
Is discharged from the air vent part of the sealing mold corresponding to. When the filling of the resin is completed, the resin is cured by heating the sealing mold to about 180 ° C. to seal the resin.

By mounting the IC card module 10 on the case 23 with the terminals 16 exposed,
The IC card 24 shown in FIGS. 3A and 3B can be configured. The case 23 is made of plastic or metal. Also, an IC card can be manufactured by providing a concave portion in a card-shaped thin plate made of plastic or metal and embedding the IC card module 10 in the concave portion.

The IC card module 10 of the present embodiment
The semiconductor device 13 and the terminal 18 are provided at positions separated from each other on the base 17. Therefore, when connecting the IC card 24 manufactured as described above using the IC card module 10 and an external device having an IC card slot to each other, when inserting the terminal 18 into the slot, The connection can be made without inserting the device 13 into the slot. That is, an IC card 24 having a structure in which the semiconductor device 13 is not affected by external mechanical stress, heat from an external device, or the like can be manufactured. Therefore, according to the present embodiment, I with very high reliability
C card is obtained.

(Embodiment 2) Next, an IC card module according to Embodiment 2 will be described with reference to FIGS. 4, 5 and 6. FIG. FIG. 4 is a top view showing the IC card module 40 of the present embodiment. FIG. 5 is a top view showing a printed wiring board 41 used in the IC card module 40 of the present embodiment. FIG. 6 is a partial cross-sectional view showing a state during clamping with a sealing mold in a resin sealing step when manufacturing the IC card module 40 using the printed wiring board 41.

As shown in FIG. 4, the IC card module 40 of the present embodiment includes all the same components as the IC card module 10 of the first embodiment, and
The cross section along the line VI is the same as that of the IC card module 10 of the first embodiment (see FIG. 1B). But,
The pattern of the wiring 42 printed on the printed wiring board 41 used is different.

Next, the pattern of the printed wiring 42 on the printed wiring board 41 will be described with reference to FIG.

As shown in FIG. 5, the printed wiring board 41 used in the IC card module 40 is made of a base material 17 made of an insulating material such as resin, similarly to the printed wiring board 11 of the first embodiment. And a wiring 42 printed on the base material 17, terminals 18 provided at an end of the upper surface of the base material 17, and mounting for mounting the chip component 15 such as a resistor and a capacitor on the base material 17. For land 19,
A connection land 20 provided so as to be arranged in a peripheral portion of the semiconductor device 13 to be mounted. In the printed wiring board 41 of the present embodiment, the terminals 18 and the mounting lands 1
9 and the connection lands 20 are all provided on the surface of the printed wiring board 41 on which the wiring 42 is printed,
The wiring 42 is printed on the base material 17 so as to pass through the resin injection gate region 21 and the air vent region 22 which are not clamped by the sealing mold.

The terminals 18 and the mounting lands 19 are provided outside the region C, the resin injection gate region 21 and the air vent region 22 which are clamped by the sealing mold on the base 17. The connection lands 20 are provided in the region R to be sealed with the resin, and are provided so as to be arranged around the semiconductor device 13 to be mounted. The terminals 18, the mounting lands 19, and the connection lands 20 are formed by wirings 42 made of a conductive material (such as copper) printed on the upper surface of the base 17.
Are connected by

Next, a method of manufacturing the IC card module 40 of the present embodiment will be described. Note that the IC card module 40 of the present embodiment includes the printed wiring board 4
Embodiment 1 up to the step of mounting the semiconductor device 13 on the first embodiment
It is manufactured by the same method as that of the IC card module 10 described above. Accordingly, here, the steps after the resin sealing step after the semiconductor device 13 is mounted on the printed wiring board 41 will be particularly described.

FIG. 6 is a diagram showing an example of the I using the printed wiring board 41.
FIG. 6 is a partial cross-sectional view showing a state at the time of clamping with a sealing mold in a resin sealing step when manufacturing the C-card module 40, and this cross-sectional view is a sectional view of the printed wiring board 41 shown in FIG. Corresponds to the cross section along the -V line.

As shown in FIG. 6, the semiconductor device 13 is fixed on the base material 17 of the printed wiring board 41 with an adhesive or the like.
The semiconductor device 13 and the connection lands 20 are connected by bonding wires 14. The terminals 18 and the mounting lands 19 are provided outside the region C to be clamped by the sealing mold, the resin injection gate region 21 and the air vent region 22. Terminal 18 or mounting land 19
The wiring 42 and the solder resist 25 for electrically connecting the chip component 15 mounted thereon and the semiconductor device 13
Means from the region R to be sealed with the resin to the resin injection gate region 2
1 and the air vent region 22. The solder resist 25 may be provided on the printed wiring board 41 as needed, and may not be particularly provided.

In the sealing step, the region C to be clamped by the sealing die is clamped by the upper die 26 and the lower die 27 of the sealing die, and the molten resin is injected into the resin injection gate region 21. Press-fit from the resin injection gate of the corresponding sealing mold. At this time, the air in the cavity K formed by the upper mold 26 and the lower mold 27 is discharged from the air vent portion of the sealing mold corresponding to the air vent region 22.

In the first embodiment, the wiring 12 is
7, the printed wiring board 41 according to the present embodiment is arranged on the region C which is clamped by the sealing mold.
Then, the wiring 42 is connected to the resin injection gate region 2 on the substrate 18.
1. It is provided via the air vent region 22, and is arranged so as not to be clamped by the sealing mold. For this reason, as shown in FIG. 6, the upper mold 26 does not contact the wiring 42 in the resin sealing step. With this feature, in addition to the effect of the first embodiment, damage to the wiring 42 caused by clamping with the sealing mold is suppressed and prevented. Therefore,
IC card module 4 with reduced disconnection and short circuit
0 is obtained.

In this embodiment, all the wirings 42 are routed through the resin injection gate region 21 and the air vent region 22. However, only the wiring in which disconnection or short-circuit with the adjacent wiring is particularly concerned is considered. 21 and the air vent region 22. Even in this case, the wiring via the resin injection gate region 21 and the air vent region 22 can be suppressed or prevented from being damaged by the clamp at the time of resin sealing, and a highly reliable IC card module can be obtained.

Further, according to the present embodiment, resin sealing can be performed with high accuracy. This will be described below.

When a solder resist is provided on a printed wiring board, the surface of the solder resist on the wiring becomes wavy. In the case where the solder resist is provided in the first embodiment, the wiring 12 is disposed on the region C on the base material 17 which is clamped by the sealing die. In the region C to be clamped by the mold, a gap is formed between the sealing mold and the solder resist having a wavy surface, and resin leakage may occur. However, in the present embodiment, when the solder resist 25 is provided on the printed wiring board 41, the wiring 42 is disposed so as not to be clamped by the sealing mold, and thus is clamped by the sealing mold. In the region C, there is no solder resist 25 having a wavy surface. Therefore, resin sealing can be performed with high precision without causing resin leakage.

The I of the present embodiment obtained as described above
By attaching the C card module 40 to a case or the like with the terminals 18 exposed, FIG.
(A) and (b) are the same as those of the IC card 24.
A C card can be configured. The case is made of plastic or metal. In addition, a concave portion is provided in a thin plate made of card-like plastic or metal,
By embedding the IC card module 10 in the recess, an IC card can be manufactured.

Embodiment 3 Next, an IC card module according to Embodiment 3 will be described with reference to FIG. FIG. 7 shows an IC card module 70 of the present embodiment.
FIG.

As shown in FIG. 7, the IC card module 70 of the present embodiment has all the same components as the IC card module 40 of the second embodiment on the upper surface of the printed wiring board 71. Printed wiring board 7
The semiconductor device 13 is also mounted on the lower surface of the printed wiring board 1, and the semiconductor device 13 is mounted on both the upper and lower surfaces of the printed wiring board 71. With such a double-sided structure, it is possible to increase the number of semiconductor devices 13 that can be mounted on the printed wiring board 71, or to reduce the accommodation volume when mounting the semiconductor devices.
That is, an IC card module on which a semiconductor device is mounted with a high degree of integration can be obtained.

Next, a method of manufacturing the IC card module 70 of the present embodiment will be described.

First, a terminal 18, a mounting land 19, a connection land 20, and a connection land (not shown) are further provided on the lower surface of the base 17, and the terminal 18, the mounting land 19, A printed wiring board 71 is prepared in which wiring (not shown) for connecting the connection land 20 and the connection land on the lower surface to each other is printed on the upper surface of the base material 17. Here, the connection lands on the lower surface are connected to the wiring on the upper surface by connection holes (not shown) penetrating the base material 17.

Next, each of the semiconductor devices 13 was
7 are fixed to the upper and lower surfaces with adhesives and are sealed with resin.
Mounted inside.

Next, the semiconductor device 13 and the connection lands 20 are connected to each other by wire bonding using the wires 14. In the present embodiment, the semiconductor device 13 is mounted on the printed wiring board 71 by wire bonding, but the BGA (Ball Grid Arr.)
A known method such as ay) may be used.

Next, the semiconductor device 13 mounted on the printed wiring board 11 is sealed with a resin 16. In the present embodiment, sealing is performed by a transfer molding method using a thermosetting resin. The resin may be sealed by a known molding method (a potting method, a printing method, an injection molding method using a thermoplastic resin, or the like).

The IC card module of this embodiment is
Compared with the IC card modules according to the first and second embodiments shown in FIGS. 1 and 4, the number of mountable semiconductor devices 13 can be increased, and the capability of the IC card can be improved. The base material 1 of the printed wiring board 71
By reducing the area of 7, it is also possible to manufacture a small IC card having the same performance as an IC card using a single-sided wiring board.

(Embodiment 4) Next, an IC card module according to Embodiment 4 will be described with reference to FIGS. FIG. 8 is a plan view showing a printed wiring board 81 used for the IC card module of the present embodiment, and FIG. 9 is a cross-sectional view taken along line VIII-VIII of FIG.

The IC card module of this embodiment is
Although the same components as those of the IC card module 40 of the second embodiment are provided, the pattern of the wiring 82 printed on the printed wiring board 81 used is different as shown in FIG.

As in the case of the printed wiring board 41 of the second embodiment, the printed wiring board 81 of the present embodiment includes a base 17 formed of an insulating material such as a resin and a wiring 82 printed on the base 17. A terminal 18 provided at an end of the upper surface of the base member 17; and a mounting land 19 for mounting the chip component 15 such as a resistor and a capacitor on the base member 17.
And a connection land 20 provided so as to be arranged in a peripheral portion of the semiconductor device 13 to be mounted. In the printed wiring board 81 of this embodiment, the terminals 18, the mounting lands 19, and the connection lands 20 are all provided on the surface of the printed wiring board 81 on which the wirings 82 are printed.

In this embodiment, the wiring 82 for electrically connecting the mounting lands 19 of the terminals 18 and the chip components 15 and the connection lands 20 is formed on the base material 17.
It is printed so as to pass through the resin injection gate region 21 and the air vent region 22. Further, the base 17 constituting the printed wiring board 81 is a four-layered multilayer wiring base, and the wiring 82 corresponding to the resin injection gate area 21 or the air vent area 22 is an inner wiring (FIG. 8). (Dashed line). The inner layer wiring and the outer layer wiring are connected to each other through a connection hole 83.

As shown in FIG. 9, the above-described four-layered multilayer wiring base has a double-sided wiring board 84 on both sides of which wirings 82 are printed, and a solid pattern 85. Solid pattern 8
5 is not particularly limited in material, but is preferably formed of a material having higher rigidity than the double-sided wiring board 84.
In the present embodiment, it is a foil-shaped metal plate and used as a power supply or ground wiring. The double-sided wiring board 84 and the solid pattern 85 are bonded to each other by an adhesive layer 86 formed of a prepreg using the same insulating material as the double-sided wiring board 84. The adhesive layer 86
Is not particularly limited as long as it is an insulating material. further,
A solder resist 87 is provided on the solid pattern 85.

When resin sealing is performed using the printed wiring board 81 of this embodiment, the wiring 82 passes through the resin injection gate region 21 and the air vent region 22 on the base material 17 as in the second embodiment. And is arranged so as not to be clamped by the sealing mold. Therefore, damage to the wiring 82 caused by clamping with the sealing mold is suppressed or prevented. Therefore, an IC card module with reduced disconnection and short circuit can be obtained.

In the present embodiment, all the wirings 82 are arranged so as to pass through the resin injection gate region 21 and the air vent region 22. However, only the wiring in which disconnection or short-circuit with an adjacent wiring is particularly concerned is considered. Area 2
1. The air vent region 22 may be used. Even in this case, the wiring via the resin injection gate region 21 and the air vent region 22 can be suppressed or prevented from being damaged by the clamp at the time of resin sealing, and a highly reliable IC card module can be obtained.

Further, in the present embodiment, FIGS.
As shown in the figure, the wiring 82 of the printed wiring board 81 via the resin injection gate region 21 and the air vent region 22 is an inner layer wiring.

In the case of the second embodiment in which the wiring 42 passing through the resin injection gate area 21 and the air vent area 22 is an outer wiring, when the IC card module is bent by an external force after the resin sealing step, In some cases, stress may concentrate on a portion of the wiring 42 having a different elastic modulus from that of the wiring 17 that is not sealed with the resin.

Therefore, the printed wiring board 8 of the present embodiment
When the IC card module 80 is manufactured by using 1, the wiring 82 of the inner layer wiring is vertically sandwiched between the adhesive layers 86 formed of a prepreg having a low elastic modulus, and is in a state of being mechanically protected. . That is, by using the printed wiring board 81 of the present embodiment, in addition to reducing the damage at the time of resin encapsulation, the printed wiring board 81 can be connected to the wiring 82 at the time of use of the IC card due to the fact that the unsealed portion bends. Damage can also be reduced.

Further, by providing the solid pattern 85 having high mechanical strength above and below the wiring 82 of the inner layer wiring, the mechanical protection function is enhanced. In particular, since the solid pattern 85 is wide and has higher rigidity than the double-sided wiring board 84, the solid pattern 85 is not easily deformed by stress. For this reason, the bending of the portion that is not resin-sealed when the IC card is used is reduced, and the damage to the wiring 82 can be further reduced.

Further, by forming the solid pattern 85 of metal and using it as a power supply or ground wiring, the voltage of the power supply can be stabilized.

Embodiment 5 Next, an IC card module according to Embodiment 5 will be described with reference to FIGS. FIG. 10 is a plan view showing a printed wiring board 91 used for the IC card module of the present embodiment, and FIG. 11 is a view showing a sealing process in a resin sealing step when manufacturing the IC card module of the present embodiment. It is a partial sectional view showing the state at the time of clamping by a metallic mold. FIG. 11 is a view showing IX-IX of the printed wiring board 91 shown in FIG.
Corresponds to the cross section along the line.

The printed wiring board 91 of the present embodiment is different from the structure of the second embodiment in that a region C which is clamped by a sealing Is provided with a solid pattern 88 having an upper surface. In the present embodiment, the solid pattern 88 is formed of a metal plate used for a power supply, a ground, and the like, but is not particularly limited as long as the material has high rigidity.

The following effects can be obtained by providing the solid pattern 88 having high mechanical strength in the region C to be clamped by the sealing mold.

The solid pattern 88 has a large width and a high rigidity, so that it is not easily deformed by stress. Therefore, the bending of the region C clamped by the sealing mold is reduced, and the damage to the wiring 42 and the base 17 can be further reduced.

Further, by providing a solid pattern 88 having an upper surface almost the same height as the upper surface of the wiring 42 in a region C to be clamped by a sealing mold on the printed wiring board 91, as shown in FIG. Thus, it is possible to reliably prevent the wiring 42 from being clamped. Of course, the height of the upper surface of the solid pattern may be higher than the height of the upper surface of the wiring 42.

FIG. 11 shows the case where the solder resist 25 is provided on the printed wiring board 41. However, even when the solder resist 25 is not provided, damage to the wiring 42 can be similarly prevented.

In the present embodiment, as shown in FIG. 10, the wiring 42 is arranged so as to avoid the region C which is clamped by the sealing mold. However, even when the wiring is arranged in a region to be clamped by the sealing mold, the same effect can be obtained by providing the solid pattern. In other words, a solid pattern having an upper surface almost as high as the upper surface of the wiring 12 is provided in a region other than the wiring 12 in the region C clamped by the sealing mold of the printed wiring board 11 of the first embodiment. This can prevent the wiring 12 from being clamped.

Further, by forming the solid pattern 88 of metal and using it as a power supply or ground wiring, the voltage of the power supply can be stabilized, and a significant effect can be exhibited. Further, the present embodiment can be applied to a case where an inner layer wiring is provided as in the above-described fourth embodiment.

[0093]

According to the present invention, it is possible to manufacture an IC card having a structure in which a semiconductor device is not affected by external mechanical stress or heat from an external device.

[Brief description of the drawings]

FIG. 1A is a top view of an IC card module 10 according to a first embodiment, and FIG. 1B is a cross-sectional view taken along line I- of FIG.
It is sectional drawing along the I line.

FIG. 2 is a top view of a printed wiring board 11 used in the IC card module 10 according to the first embodiment.

FIG. 3A is a top view of an IC card including the IC card module 10 according to the first embodiment, and FIG.
FIG. 3 is a sectional view taken along line III-III in FIG.

FIG. 4 is a top view illustrating an IC card module 40 according to a second embodiment.

FIG. 5 is a top view showing a printed wiring board 41 used for an IC card module 40 according to a second embodiment.

FIG. 6 is a partial cross-sectional view showing a state at the time of clamping with a sealing mold in a resin sealing step when manufacturing an IC card module 40 using a printed wiring board 41.

FIG. 7 is a sectional view showing an IC card module 70 according to a third embodiment.

FIG. 8 is a plan view showing a printed wiring board 81 used for an IC card module according to a fourth embodiment.

FIG. 9 is a sectional view taken along line VIII-VIII in FIG.

FIG. 10 is a plan view showing a printed wiring board 91 used for an IC card module according to a fifth embodiment.

FIG. 11 is a partial cross-sectional view showing a state during clamping with a sealing mold in a resin sealing step in manufacturing the IC card module of Embodiment 5.

12 (a) is a top view of a conventional IC card module, and FIG. 12 (b) is a cross-sectional view taken along line XX of FIG. 12 (a).

[Explanation of symbols]

 10, 40, 70, 110 IC card module 11, 41, 71, 81, 91 Printed wiring board 12, 42, 82, 112 Wiring 13, 113 Semiconductor device 14, 114 Wire 15, 115 Chip component 16, 116 Resin 17 Base material 18, 118 Terminal 19 Mounting land 20 Connection land 21 Resin injection gate area 22 Air vent area 23 Case 24 IC card 25, 87 Solder resist 26 Upper mold 27 Lower mold 83 Connection hole 84 Double-sided wiring board 85, 88 Solid pattern 86 Adhesive layer 111 Substrate

Continuation of front page (72) Inventor Hiroki Naraoka 1-1, Sachimachi, Takatsuki-shi, Osaka Matsushita Electronics Corporation (72) Inventor Futa Honma 1-1-1, Sachimachi, Takatsuki-shi, Osaka Matsushita Electronics Corporation (72) Inventor Shigeru Nonoyama 1-1, Yukicho, Takatsuki-shi, Osaka, Japan Matsushita Electronics Co., Ltd. (72) Inventor Yoshiyuki Arai 1-1, Yukicho, Takatsuki-shi, Osaka, Japan Matsushita Electronics Co., Ltd. (72) Inventor Yuichiro Yamada 1-1, Kochi-cho, Takatsuki-shi, Osaka Matsushita Electronics Co., Ltd. (72) Inventor Fumito Ito 1-1, Kochi-cho, Takatsuki-shi, Osaka Matsushita Electronics Co., Ltd. F-term (reference) 2C005 MA07 MA39 NA05 NB06 NB20 NB22 NB26 NB29 NB34 PA01 QC07 RA19 4M109 AA01 AA02 BA04 CA21 DA01 DB16 GA03 5B035 AA07 BB09 CA02 CA08

Claims (15)

[Claims] 1. A resin-sealed region, a clamp region of a peripheral portion of the resin-sealed region that is clamped by a sealing mold, and a non-clamped region of the peripheral portion of the resin-sealed region that is not clamped. A semiconductor device mounted on the top surface of the base material, a terminal for external connection provided on the top surface of the base material, and a semiconductor device mounted on the top surface of the base material; A wiring that connects the semiconductor device and the terminal to each other; and a resin that seals the semiconductor device. The terminal is provided in a region other than the resin sealing region, the clamp region, and the non-clamp region. A module for an IC card, comprising: 2. The IC card module according to claim 1, wherein the wiring is provided on a top surface of the base material through a non-clamped area. 3. The IC card module according to claim 2, wherein the non-clamped area on the upper surface of the base is an area corresponding to a resin injection gate or an air vent of a sealing mold. IC card module. 4. The IC card module according to claim 1, wherein at least one inner wiring layer and an insulating layer thereover are provided on the upper surface of the base material. Wherein the semiconductor device is provided on the insulating layer, and a portion of the wiring located at the peripheral portion is an inner layer wiring. 5. The IC card module according to claim 1, wherein a solid pattern is provided in a region of the peripheral portion of the resin sealing region where no wiring is provided. IC card module. 6. The IC card module according to claim 5, wherein an upper surface of the solid pattern is located at a height higher than an upper surface of the wiring. 7. The IC card module according to claim 6, wherein the solid pattern functions as a power supply wiring or a ground wiring. 8. The IC card module according to claim 1, wherein another semiconductor device provided on a lower surface of the base material, a wiring connecting the another semiconductor device to the terminal, A module for an IC card, comprising: a resin for sealing the another semiconductor device. 9. A resin sealing region, a clamp region clamped by a sealing mold in a peripheral portion of the resin sealing region, and an unclamped region not clamped in a peripheral portion of the resin sealing region. A base having: a connection land provided on the top surface of the base material and connected to the semiconductor device; a terminal for external connection provided on the top surface of the base material; and a top surface of the base material And a wiring that connects the connection land and the terminal to each other. The terminal is provided in a region other than the resin sealing region, the clamp region, and the non-clamp region, The printed wiring board, wherein the wiring is provided on the upper surface of the base material via a non-clamped area. 10. The printed wiring board according to claim 9, wherein the non-clamped area on the upper surface of the base is an area corresponding to a resin injection gate or an air vent of a sealing mold. Printed wiring board. 11. The printed wiring board according to claim 9, wherein a solid pattern is provided in a region of the peripheral portion of the resin sealing region where no wiring is provided. Printed wiring board. 12. The printed wiring board according to claim 11, wherein an upper surface of the solid pattern is located at a height higher than an upper surface of the wiring. 13. The printed wiring board according to claim 9, wherein at least one inner wiring layer and an insulating layer thereover are provided on the upper surface of the base material. Wherein the semiconductor device is provided on the insulating layer, and a portion of the wiring located at the peripheral portion is an inner layer wiring. 14. A resin-encapsulated region, a clamp region of a peripheral portion of the resin-encapsulated region that is clamped by a sealing mold, and a non-clamped region of the peripheral portion of the resin-encapsulated region that is not clamped. A base having, a connection land provided on the top surface of the base material and connected to the semiconductor device, a terminal for external connection provided on the top surface of the base material, and a top surface of the base material And a wiring for connecting the connection land and the terminal to each other, wherein the terminal is provided in an area other than the resin sealing area, the clamp area, and the non-clamp area, Step (a) of preparing a printed wiring board in which the wiring is provided via an unclamped area on the upper surface of the base material
(B) fixing the semiconductor device on the base material and mounting the semiconductor device in the resin sealing region; and (c) connecting the semiconductor device and the connection land with a conductor member. (C) clamping the printed wiring board with a sealing mold and sealing the semiconductor device with a resin. 15. The method for manufacturing an IC card module according to claim 14, wherein in the step (a), the non-clamped area on the upper surface of the base material is formed by a resin injection gate portion or an air vent of a sealing mold. A method for manufacturing an IC card module, comprising preparing a printed wiring board which is an area corresponding to a part.