JPH0313739U - - Google Patents
Info
- Publication number
- JPH0313739U JPH0313739U JP1989075402U JP7540289U JPH0313739U JP H0313739 U JPH0313739 U JP H0313739U JP 1989075402 U JP1989075402 U JP 1989075402U JP 7540289 U JP7540289 U JP 7540289U JP H0313739 U JPH0313739 U JP H0313739U
- Authority
- JP
- Japan
- Prior art keywords
- hole
- inner lead
- small hole
- wall
- film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 4
- 239000008188 pellet Substances 0.000 claims description 2
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
Landscapes
- Wire Bonding (AREA)
Description
第1図は本考案の実施例を示す要部平面図、第
2図は第1図A−A断面図、第3図は本考案の多
の実施例を示す要部平面図、第4図及び第5図は
本考案の他の実施例と応用を示す要部側断面図を
示す。第6図及び第7図はTAB型半導体装置の
従来例を示す要部断面図及び概略平面図を示す。
1……絶縁フイルム、1a……透孔、2……導
電パターン、2a……インナリード、3……半導
体ペレツト、5……小孔(チエツク用透孔)、5
a……舌片。
Fig. 1 is a plan view of main parts showing an embodiment of the present invention, Fig. 2 is a sectional view taken along line A-A in Fig. 1, Fig. 3 is a plan view of main parts showing another embodiment of the invention, Fig. 4 and FIG. 5 shows a side sectional view of a main part showing other embodiments and applications of the present invention. FIGS. 6 and 7 show a sectional view and a schematic plan view of a main part of a conventional example of a TAB type semiconductor device. DESCRIPTION OF SYMBOLS 1... Insulating film, 1a... Through hole, 2... Conductive pattern, 2a... Inner lead, 3... Semiconductor pellet, 5... Small hole (through hole for check), 5
a... Tongue piece.
Claims (1)
ターンの一部を透孔内に延在させてインナリード
を形成し、このインナリードと半導体ペレツトの
電極とを電気的に接続したものにおいて、上記絶
縁フイルムの一部に小孔を設けかつこの小孔内壁
の一部から対向壁に向かつて舌片を突出させたこ
とを特徴とするTAB型半導体装置。 A portion of a conductive pattern laminated on an insulating film having a through hole is extended into the through hole to form an inner lead, and this inner lead is electrically connected to an electrode of a semiconductor pellet. A TAB type semiconductor device characterized in that a small hole is provided in a part of the film, and a tongue protrudes from a part of the inner wall of the small hole toward the opposite wall.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1989075402U JPH0313739U (en) | 1989-06-27 | 1989-06-27 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1989075402U JPH0313739U (en) | 1989-06-27 | 1989-06-27 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0313739U true JPH0313739U (en) | 1991-02-12 |
Family
ID=31615951
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1989075402U Pending JPH0313739U (en) | 1989-06-27 | 1989-06-27 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0313739U (en) |
-
1989
- 1989-06-27 JP JP1989075402U patent/JPH0313739U/ja active Pending