JPS6312840U - - Google Patents
Info
- Publication number
- JPS6312840U JPS6312840U JP9067286U JP9067286U JPS6312840U JP S6312840 U JPS6312840 U JP S6312840U JP 9067286 U JP9067286 U JP 9067286U JP 9067286 U JP9067286 U JP 9067286U JP S6312840 U JPS6312840 U JP S6312840U
- Authority
- JP
- Japan
- Prior art keywords
- integrated circuit
- hybrid integrated
- frame
- insulating substrate
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000758 substrate Substances 0.000 claims description 5
- 239000002184 metal Substances 0.000 claims 1
Landscapes
- Casings For Electric Apparatus (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Combinations Of Printed Boards (AREA)
- Mounting Of Printed Circuit Boards And The Like (AREA)
Description
第１図は本考案の実施例を示す断面図、第２図
及び第３図は従来例を示す断面図である。
１，２……第１及び第２の混成集積回路基板、
３……絶縁性基板、４……枠体、５，６……回路
素子、７……第１の段差部、８……第２の段差部
、９……第３の段差部。
FIG. 1 is a sectional view showing an embodiment of the present invention, and FIGS. 2 and 3 are sectional views showing a conventional example. 1, 2...first and second hybrid integrated circuit boards,
3... Insulating substrate, 4... Frame, 5, 6... Circuit element, 7... First step, 8... Second step, 9... Third step.
Claims (1)
回路基板と、該第２の混成集積回路基板より大き
く且つ前記第２の混成集積回路基板の基板露出面
に密着して設けられる金属から成る絶縁性基板と
、前記第１及び第２の混成集積回路基板を所定間
隔離間する枠体とを備えた混成集積回路において
、前記第２の混成集積回路基板は前記枠体と前記
絶縁性基板とで圧着固定され且つ前記絶縁性基板
は前記枠体の当接面で接着されていることを特徴
とする混成集積回路。 It consists of first and second hybrid integrated circuit boards provided with circuit elements, and a metal that is larger than the second hybrid integrated circuit board and is provided in close contact with the exposed surface of the second hybrid integrated circuit board. In a hybrid integrated circuit comprising an insulating substrate and a frame that separates the first and second hybrid integrated circuit boards by a predetermined distance, the second hybrid integrated circuit board is arranged between the frame and the insulating substrate. 1. A hybrid integrated circuit, characterized in that the insulating substrate is crimped and fixed by the frame, and the insulating substrate is bonded to the abutment surface of the frame.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9067286U JPH0436123Y2 (en) | 1986-06-13 | 1986-06-13 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9067286U JPH0436123Y2 (en) | 1986-06-13 | 1986-06-13 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6312840U true JPS6312840U (en) | 1988-01-27 |
| JPH0436123Y2 JPH0436123Y2 (en) | 1992-08-26 |
Family
ID=30950751
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9067286U Expired JPH0436123Y2 (en) | 1986-06-13 | 1986-06-13 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0436123Y2 (en) |
-
1986
- 1986-06-13 JP JP9067286U patent/JPH0436123Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0436123Y2 (en) | 1992-08-26 |