JPH0221772U - - Google Patents
Info
- Publication number
- JPH0221772U JPH0221772U JP10026788U JP10026788U JPH0221772U JP H0221772 U JPH0221772 U JP H0221772U JP 10026788 U JP10026788 U JP 10026788U JP 10026788 U JP10026788 U JP 10026788U JP H0221772 U JPH0221772 U JP H0221772U
- Authority
- JP
- Japan
- Prior art keywords
- metal plate
- insulating substrate
- convex portion
- mounting
- circuits
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims description 6
- 239000002184 metal Substances 0.000 claims description 5
- 229910052751 metal Inorganic materials 0.000 claims description 5
- 239000004065 semiconductor Substances 0.000 claims description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims 1
- 229910052802 copper Inorganic materials 0.000 claims 1
- 239000010949 copper Substances 0.000 claims 1
Description
第１図は本考案による半導体素子搭載用絶縁基
板の外観を示し、ａは斜視図。ｂは正面図。第２
図は従来の半導体素子搭載用絶縁基板の外観を示
し、ａは斜視図。ｂは正面図。第３図は本考案の
他の実施例を示す正面図。
１，７，１１…絶縁基板、２，２１，３，３１
，４，４１，８，９，１０…金属板よりなる回路
、５，５１…金属ベース、６…段差、１２…凸部
、１３…金属板ベース、Ｌ…回路間の距離。
FIG. 1 shows the appearance of an insulating substrate for mounting semiconductor elements according to the present invention, and a is a perspective view. b is a front view. Second
The figure shows the appearance of a conventional insulating substrate for mounting semiconductor elements, and a is a perspective view. b is a front view. FIG. 3 is a front view showing another embodiment of the present invention. 1, 7, 11...Insulating substrate, 2, 21, 3, 31
, 4, 41, 8, 9, 10...Circuit made of metal plate, 5, 51...Metal base, 6...Step, 12...Convex portion, 13...Metal plate base, L...Distance between circuits.
Claims (1)
基板に於て、外部電極を導出するために使用する
銅等の金属板より成る回路が形成された該基板上
で、隣接する回路間の絶縁基板面に段差、または
凸部を設け、隣接する金属板回路相互間の沿面距
離を増大することを特徴とする半導体素子搭載用
絶縁基板。 In a substrate for mounting semiconductor elements constituting a semiconductor module, on which a circuit made of a metal plate such as copper used for leading out external electrodes is formed, there is a step on the surface of the insulating substrate between adjacent circuits. An insulating substrate for mounting a semiconductor element, characterized in that the creepage distance between adjacent metal plate circuits is increased by providing a convex portion or a convex portion.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10026788U JPH0221772U (en) | 1988-07-27 | 1988-07-27 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10026788U JPH0221772U (en) | 1988-07-27 | 1988-07-27 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0221772U true JPH0221772U (en) | 1990-02-14 |
Family
ID=31328197
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10026788U Pending JPH0221772U (en) | 1988-07-27 | 1988-07-27 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0221772U (en) |
-
1988
- 1988-07-27 JP JP10026788U patent/JPH0221772U/ja active Pending