JPS62163952U - - Google Patents
Info
- Publication number
- JPS62163952U JPS62163952U JP5173186U JP5173186U JPS62163952U JP S62163952 U JPS62163952 U JP S62163952U JP 5173186 U JP5173186 U JP 5173186U JP 5173186 U JP5173186 U JP 5173186U JP S62163952 U JPS62163952 U JP S62163952U
- Authority
- JP
- Japan
- Prior art keywords
- chip
- insulating layer
- fixed
- metal base
- circuit element
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002184 metal Substances 0.000 claims description 5
- 238000010897 surface acoustic wave method Methods 0.000 description 1
Landscapes
- Insulated Metal Substrates For Printed Circuits (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Description
第１図乃至第３図は本考案にかかる回路装置の
実施例で、第１図は第１実施例を示す一部切截の
斜視図、第２図は第２実施例を示す斜視図、第３
図は第３実施例を示す斜視図、第４図は従来の回
路装置を示す一部切截の斜視図である。
１，２１…金属ベース、４，２８…弾性表面波
素子、７，３２，３７，３８，３９…金属性キヤ
ツプ、８，２３…リード端子、１３，３５…ＩＣ
素子。
1 to 3 show embodiments of the circuit device according to the present invention, FIG. 1 is a partially cutaway perspective view showing the first embodiment, FIG. 2 is a perspective view showing the second embodiment, Third
This figure is a perspective view showing a third embodiment, and FIG. 4 is a partially cutaway perspective view showing a conventional circuit device. 1, 21... Metal base, 4, 28... Surface acoustic wave element, 7, 32, 37, 38, 39... Metal cap, 8, 23... Lead terminal, 13, 35... IC
element.
Claims (1)
を形成し、前記絶縁層上に回路配線を設けるとと
もにチツプ状の回路素子を固着し、前記チツプ状
の回路素子を封止する金属性キヤツプを前記金属
ベースに固定してなる構成の回路装置。 An insulating layer is formed on a metal base on which lead terminals are implanted, circuit wiring is provided on the insulating layer, a chip-shaped circuit element is fixed, and a metal cap is provided to seal the chip-shaped circuit element. A circuit device configured to be fixed to the metal base.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5173186U JPS62163952U (en) | 1986-04-07 | 1986-04-07 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5173186U JPS62163952U (en) | 1986-04-07 | 1986-04-07 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62163952U true JPS62163952U (en) | 1987-10-17 |
Family
ID=30876261
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5173186U Pending JPS62163952U (en) | 1986-04-07 | 1986-04-07 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62163952U (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61280639A (en) * | 1985-06-05 | 1986-12-11 | Nec Yamagata Ltd | Semiconductor device |
-
1986
- 1986-04-07 JP JP5173186U patent/JPS62163952U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61280639A (en) * | 1985-06-05 | 1986-12-11 | Nec Yamagata Ltd | Semiconductor device |
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