JPS63142822U - - Google Patents
Info
- Publication number
- JPS63142822U JPS63142822U JP1987035092U JP3509287U JPS63142822U JP S63142822 U JPS63142822 U JP S63142822U JP 1987035092 U JP1987035092 U JP 1987035092U JP 3509287 U JP3509287 U JP 3509287U JP S63142822 U JPS63142822 U JP S63142822U
- Authority
- JP
- Japan
- Prior art keywords
- electronic component
- lead terminal
- soldered part
- electrode
- conductive adhesive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000853 adhesive Substances 0.000 claims description 2
- 230000001070 adhesive effect Effects 0.000 claims description 2
- 238000005476 soldering Methods 0.000 claims description 2
- 239000000919 ceramic Substances 0.000 description 1
- 210000001503 joint Anatomy 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Landscapes
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Description
第１図は本考案に係る電子部品の一実施例を示
す斜視図、第２図はそのリード端子接合部分の断
面図である。第３図は従来の電子部品の斜視図で
ある。
１……セラミツク素子、２……電極、３……リ
ード端子、３ａ……半田付け部分、４……半田層
、５……導電性接着剤。
FIG. 1 is a perspective view showing one embodiment of an electronic component according to the present invention, and FIG. 2 is a sectional view of a lead terminal joint portion thereof. FIG. 3 is a perspective view of a conventional electronic component. DESCRIPTION OF SYMBOLS 1... Ceramic element, 2... Electrode, 3... Lead terminal, 3a... Soldering part, 4... Solder layer, 5... Conductive adhesive.
Claims (1)
ると共に、リード端子の半田付け部分を導電性接
着剤にて該半田付け部分よりも広い範囲で被覆・
固着したことを特徴とする電子部品。 While soldering the lead terminal to the electrode of the electronic component element, the soldered part of the lead terminal is covered with a conductive adhesive over a wider area than the soldered part.
An electronic component characterized by being fixed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987035092U JPS63142822U (en) | 1987-03-10 | 1987-03-10 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987035092U JPS63142822U (en) | 1987-03-10 | 1987-03-10 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63142822U true JPS63142822U (en) | 1988-09-20 |
Family
ID=30844265
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987035092U Pending JPS63142822U (en) | 1987-03-10 | 1987-03-10 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63142822U (en) |
-
1987
- 1987-03-10 JP JP1987035092U patent/JPS63142822U/ja active Pending
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