JPS61280639A - Semiconductor device - Google Patents

Abstract

PURPOSE:To reduce the cost of a semiconductor product by a method wherein a circuit wiring is fused onto insulating glass coated with a metal case for the elimination of the need for an insulating substrate. CONSTITUTION:The metal case 1' of a semiconductor device of this design and a lead 2' to serve as an external terminal are fused together by using insulating glass 3'. The entirety of the case is plated with a metal and is further plated with Au. To the case, a semiconductor element 7 and passivation element 9' are bonded with Au pieces, epoxy resin, solder, or the like. Connection is established as necessary by a metal fine lead 8'. Employment of a case of this design for a semiconductor device eliminates the need for the construction of a circuit by using such an insulating material as alumina and the like. The number of processes and parts required for building is also reduced.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to the structure of a case for a semiconductor device.

[Conventional technology]

Conventionally, a semiconductor device using various semiconductor elements and passive elements on a metal case and having arbitrary characteristics has been constructed as shown in FIG. That is, a semiconductor device case is provided in which a metal case 1 and a lead 2 serving as an external terminal are fused together by reacting an insulating glass 3 in a high-temperature furnace. Mounted on this case is an alumina substrate 6 which is made of a piece of Au or epoxy resin 4 and has a conductive metal 5 on its surface with circuit wiring.

The semiconductor chip 7 is connected to circuit wiring on the substrate 6 using thin metal wires 8 . Passive elements 9 are further provided on the substrate 6.
are connected and tuned to have any characteristics. In order to protect the semiconductor element 7 and the metal wire [8, a metal cap (not shown) is placed over the semiconductor element 7 and the metal wire [8], and the metal case 6 and the metal cap are sealed by current welding.

[Problem that the invention seeks to solve]

Here, since the conventional semiconductor device case 1 is made of metal and is a conductor, it is not possible to directly mount the semiconductor element 7 or the passive element 9 thereon.
It was necessary to mount the circuit on an insulated substrate such as an alumina substrate 6 with circuit wiring. This results in higher product prices.

[Failure to solve the problem]

In the semiconductor device of the present invention, a metal case is covered with insulating glass, and circuit conductor wiring is fused onto the insulating glass. Therefore, semiconductor elements or passive elements can be directly mounted without mounting an insulating substrate such as an alumina substrate.

〔Example〕

Next, embodiments of the present invention will be described.

FIG. 1 shows a semiconductor device made with a semiconductor device case having a structure according to the present invention. As shown in Figure 2, a metal case 1', leads 2' that serve as external terminals, and circuit wiring 3' designed from an arbitrary circuit configuration are layered with insulating glass 4', and the entire case is plated with metal. The entire top is plated with gold. A semiconductor element 5' and a passive element 9' are bonded onto the case with Au pieces, epoxy resin, solder, etc., and these are connected between necessary wirings using thin metal wires 8', and the characteristics can be adjusted as desired. Semiconductor element 5'
In order to preserve the thin metal wire 9', a metal cap (not shown) is sealed in the metal case 1' by current welding.

〔Effect of the invention〕

As described above, by using a semiconductor device case having the structure of the present invention, there is no need to use an insulating material such as alumina for circuit wiring, and the assembly process and number of parts can be reduced.

[Brief explanation of drawings]

Figure 1 (5) and (B) are a plan view and a sectional view showing an embodiment of the present invention, and Figures 2 (5) and (B) are plan views showing a conventional example. FIG. 11.1'...Metal case, 2,2'...
...External terminal lead, 3.3'...Insulating glass, 5...Conductive material metal (plated)
, 4... Au piece or epoxy resin, 6...
...Alumina insulating substrate, 7,7'...Semiconductor chip, 8,8'...Metal thin wire, 9,9'...
...Passive element. Agent Patent Attorney Uchihara Otokyo 2 Diagram

Claims (1)

[Claims] 1. A semiconductor device characterized in that an external lead terminal is fused to a case with an insulating glass, a part of the case is covered, a circuit wiring conductor is formed directly on this part, and at least a semiconductor element is bonded.