JPH0513624A - Semiconductor device - Google Patents

Abstract

PURPOSE:To provide a low-cost, thin semiconductor device widely using a general-purpose lead frame to facilitate the manufacturing. CONSTITUTION:An IC chip 1 is fixed with an insulating film 2 in such a manner that pad surfaces on it are flush with the surface of inner leads 4. The IC chip and inner leads are electrically connected by metal wire 5. The metal wire is laid along the film 2 to keep its loop as low as possible. The film serves to keep the wire insulated. Then, the chip is molded with resin 6.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a resin-sealed semiconductor device, and more particularly to a semiconductor chip mounting structure.

[0002]

2. Description of the Related Art FIG. 3 is a side sectional view of a conventional semiconductor device. In the figure, 1 is a semiconductor chip on which an integrated circuit is formed (hereinafter referred to as IC chip), 7 is a die pad for mounting and fixing the IC chip, 8 is an adhesive agent for fixing the IC chip 1 and the die pad 7, and 4 is a die pad. A plurality of inner leads arranged so as to surround 7 are thin metal wires for electrically connecting the IC chip 1 and the inner leads 4, and 6 are these IC chips 1, inner leads 4, thin metal wires 5 and die pad 7. Mold resin for resin sealing. The conventional semiconductor device has the above-mentioned structure, and the order of assembling will be described below. First, the IC chip 1 is fixed to the die pad 7 with an adhesive 8 such as solder. Next, the IC chip 1 and the inner lead 4 are electrically connected by a fine metal wire 5 such as gold. Finally, resin molding is performed with the mold resin 6.

[0003]

Since the conventional semiconductor device is constructed as described above, an extra thickness is required for securing the height of the thin metal wire and for reducing the thickness by the thickness of the die pad. There is. Further, the die pad must be submerged in order to optimize the sectional structure and facilitate the connection of the fine metal wires, which complicates the structure and requires extra processing time. Further, when the IC chip to be mounted changes, the lead frame must be changed correspondingly, which causes a problem of high cost. The present invention has been made in view of the above-mentioned conventional problems, and an object of the present invention is to support thinning,
A general purpose of the frame is to provide a semiconductor device which is easy to manufacture and inexpensive.

[0004]

To achieve this object, the present invention is a semiconductor device in which a semiconductor chip and an inner lead are electrically connected by a fine metal wire and resin-sealed, and the pad of the semiconductor chip is provided. The surface and the surface of the inner lead are connected by an insulating film.

[0005]

In the present invention, since the die pad is not required, the package thickness is reduced by the thickness of the die pad.
Further, the pad surface of the IC chip and the surface of the inner lead can be made to be on the same plane, and since the insulating layer is provided on the surface of the IC chip and the inner lead, the height of the thin metal wire can be reduced. It can be made even thinner. In addition, since there is an insulating layer on the surface of the IC chip and the inner lead, there is no accidental contact even if the metal thin wire is lengthened, so the degree of freedom of the frame is large and many types of IC chips can be mounted on one type of frame. it can.

[0006]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to the drawings. FIG. 1 is a plan view of the present invention, and FIG. 2 is a side sectional view of the same. In these figures, the components denoted by the same reference numerals as those in the prior art indicate the same configurations, and detailed description thereof will be omitted. A feature of the present invention is that a square thin insulating film 5 is used as a substitute for the die pad on which the IC chip is conventionally mounted and fixed. That is, the pad surface of the IC chip 1 is adhered and fixed to the back surface of the central portion of the film 2 via the adhesive 3, and the film 2
The back surface of the peripheral edge portion of is adhered and fixed to the tip portion of the inner lead 4 via the adhesive 3, whereby the IC chip 1 is fixed to a lead frame not shown. The four notches 2a formed in the film 2 corresponding to the peripheral edge of the IC chip 1 are for electrical connection between the thin metal wires 5 and the electrodes of the IC chip 1. A thermosetting resin or the like is used as the adhesive 3.

Next, the assembly sequence will be described. First, the upper surface of the inner lead 5 and the surface of the IC chip 1 on which the pad is located are flush with each other, and the insulating film 7 is fixed to the inner lead 4 and the IC chip 1 with the adhesive 3. Next, IC chip 1
And the inner lead 4 are electrically connected to each other with a thin metal wire 5. At this time, the metal fine wire 5 is made to crawl on the insulating film 2 so that the loop height of the metal fine wire 5 is made as low as possible. Finally, the resin is sealed with the mold resin 6. Since the insulation of the thin metal wire 5 is held by the film 2, the IC chip 1 is small and there is a distance to the inner lead 4. Even if it is necessary to lengthen the thin metal wire 5, there is no connection such as a short circuit. Multiple types of ICs with one lead frame
Can handle chips.

[0008]

As described above, according to the present invention, the pad surface of the semiconductor chip and the surface of the inner lead are connected by the insulating film. Therefore, compared with the case where the conventional die pad is used. The thickness of the package can be reduced, one lead frame can be used for various IC chips, the flexibility of the lead frame can be increased, the manufacturing can be facilitated, and an inexpensive device can be obtained.

[Brief description of drawings]

FIG. 1 is a plan view of the present invention.

FIG. 2 is a side sectional view of the present invention.

FIG. 3 is a conventional side sectional view.

[Explanation of symbols]

 1 IC chip 2 Insulating film 4 Inner lead 5 Metal wire 6 Mold resin

Claims (1)

Claims: 1. A semiconductor device in which a semiconductor chip and an inner lead are electrically connected by a thin metal wire and resin-sealed, and the pad surface of the semiconductor chip and the surface of the inner lead are electrically insulative. A semiconductor device characterized by being connected by a film.