JPH0436123Y2 - - Google Patents

Description

[Detailed Description of the Invention] (a) Industrial Application Field The present invention relates to a hybrid integrated circuit, and in particular to adhesion of a hybrid integrated circuit board to a frame.

(b) Conventional technology As shown in FIG. 2, in a conventional hybrid integrated circuit composed of two hybrid integrated circuit boards, a circuit element 13 that generates less heat is fixed to a first hybrid integrated circuit board 11, and A circuit element 14 that generates heat is fixed to the hybrid integrated circuit board 12 of No. 2. each first
The second hybrid integrated circuit boards 11 and 12 are supported and fixed at a distance by a frame 15 so that the circuit elements 13 and 14 face each other, and the side walls of the frame 15 and the first and second hybrid integrated circuit boards 11 and 12 The space formed by both end portions of the two ends was filled with a resin 16 such as epoxy resin, and the two ends were integrated.

The above-mentioned hybrid integrated circuit was developed in 1983.
It is described in Publication No. 8316.

(c) Problems that the invention aims to solve When using such a hybrid integrated circuit as an inverter IC with a high power supply voltage, when it is attached to a chassis etc., the second hybrid integrated circuit on the side attached to the chassis If the circuit board 12 were to be shot, there was a risk that the hybrid integrated circuit would be destroyed and a large current would flow through the chassis. In order to resolve this concern, an application was filed for an idea in which an insulating substrate 17 made of aluminum is closely fixed to the back surface of the second hybrid integrated circuit board 12, as shown in FIG. However, since the insulating substrate 17 and the second hybrid integrated circuit board 12 were bonded and fixed with an insulating adhesive, there was a problem in that heat dissipation deteriorated.

(d) Means for solving the problems The present invention has been made in view of the above-mentioned points, and as shown in FIG. . This problem is solved by fixing the second hybrid integrated circuit board 2 of the hybrid integrated circuit, which is equipped with a frame 4 that separates 1 and 2 by a predetermined distance, between the frame 4 and an insulating substrate 3.

(E) Effect As described above, by crimping and fixing the second hybrid integrated circuit board between the frame and the insulating substrate, an adhesive layer is provided between the second hybrid integrated circuit board and the insulating substrate. It can be fixed without being fixed.

(F) Embodiments Below, embodiments of the present invention will be described in detail based on the drawing shown in FIG. As shown in FIG. 1, the hybrid integrated circuit of the present invention includes first and second hybrid integrated circuit boards 1 and 2, an insulating substrate 3 provided closely to the second hybrid integrated circuit board 2, and a first and a frame 4 that supports the second hybrid integrated circuit boards 1 and 2 at a distance. As the first and second hybrid integrated circuit boards 1 and 2, aluminum boards having the same size and excellent thermal conductivity are used. Their respective substrates 1 and 2
An aluminum oxide film is provided on the surface by anodic oxidation. A conductive path of a desired shape is formed on each of the substrates 1 and 2, and a circuit element 5 that generates little heat, such as a transistor, a chip resistor, or a chip capacitor, is fixed to the first hybrid integrated circuit substrate 1. A heat generating circuit element 6 such as a power transistor is fixed to the hybrid integrated circuit board 2 . The first substrate 1 and the second substrate 2 are connected by a lead or the like, and are housed in a frame 4 apart from each other. An insulating substrate 3 is provided in close contact with the exposed surface of the second substrate 2 housed within the frame 4. The feature of the present invention is that the second substrate 2 is fixed by the insulating substrate 3 and the frame 4. The insulating substrate 3 is formed to be larger than the first and second substrates 1 and 2 and is made of an aluminum substrate, and its surface is anodized similarly to the first and second substrates 1 and 2. An insulating film is formed thereon to provide insulation from the second substrate 2. The frame body 4 has a first stepped portion 7 for housing the first substrate 1, a second stepped portion 8 for housing the second substrate 2, and a third stepped portion 9 for housing the insulating substrate 3. will be provided. The second stepped portion 8 on which the second substrate 2 is housed and bonded is stepped from the third stepped portion 9 by the thickness of the second substrate 2. The first substrate 1 is housed in the first stepped portion 7 of the frame 4 and bonded thereto, the second substrate 2 is housed in the second stepped portion 8, and the insulating substrate is placed in the third stepped portion 9. Glue 3. At this time, a paste is applied to the exposed surface of the second substrate 2 in order to improve its adhesion to the insulating substrate 3. Therefore, the second substrate 2 is crimped and fixed between the second stepped portion 8 and the insulating substrate 3. First and second substrates 1 and 2 and an insulating substrate 3 are disposed within the frame body 4.
After housing and bonding, the space formed by the frame 4, the first substrate 1, and the insulating substrate 3 is filled with resin.

As described above, by crimping and fixing the second substrate 2 between the second stepped portion 8 of the frame 4 and the insulating substrate 3,
Since an adhesive layer is not required at the interface between the second substrate 2 and the insulating substrate 3, there is an advantage that heat dissipation is improved.

(g) Effects of the invention As described above, according to the invention, by crimping and fixing the second substrate between the insulating substrate and the frame, the adhesive layer that adheres the insulating substrate and the second substrate is formed. Since this is unnecessary, it has the advantage of improving heat dissipation. Further, since the insulating substrate is adhesively fixed to the frame, the second substrate is sandwiched between the frame and the insulating substrate, so there is an advantage that an adhesive for bonding the second substrate is not required.

[Brief explanation of the drawing]

FIG. 1 is a sectional view showing an embodiment of the present invention, and FIGS. 2 and 3 are sectional views showing a conventional example. 1, 2...first and second hybrid integrated circuit boards,
3... Insulating substrate, 4... Frame, 5, 6... Circuit element, 7... First stepped portion, 8... Second stepped portion, 9... Third stepped portion.

Claims (1)

[Scope of utility model registration request] It consists of first and second hybrid integrated circuit boards provided with circuit elements, and a metal that is larger than the second hybrid integrated circuit board and is provided in close contact with the exposed surface of the second hybrid integrated circuit board. In a hybrid integrated circuit comprising an insulating substrate and a frame that separates the first and second hybrid integrated circuit boards by a predetermined distance, the second hybrid integrated circuit board is arranged between the frame and the insulating substrate. 1. A hybrid integrated circuit, wherein the insulating substrate is crimped and fixed in place, and the insulating substrate is bonded to the abutting surface of the frame.