JPS61190176U - - Google Patents
Info
- Publication number
- JPS61190176U JPS61190176U JP7353985U JP7353985U JPS61190176U JP S61190176 U JPS61190176 U JP S61190176U JP 7353985 U JP7353985 U JP 7353985U JP 7353985 U JP7353985 U JP 7353985U JP S61190176 U JPS61190176 U JP S61190176U
- Authority
- JP
- Japan
- Prior art keywords
- solder
- conductor
- mounted components
- overglass
- conductor pattern
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 claims description 19
- 239000004020 conductor Substances 0.000 claims description 7
- 238000005476 soldering Methods 0.000 claims 1
- 239000000758 substrate Substances 0.000 claims 1
- 239000000839 emulsion Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
Description
第１図は本考案の搭載部品の半田接続部の断面
図、第２図は本考案の半田セツト前の状態を示す
斜視図、第３図は本考案の半田セツト状態を示す
部分斜視図、第４図は従来の半田セツト前の状態
を示す斜視図、第５図は従来の半田セツト状態を
示す部分斜視図、第６図は従来の搭載部品の半田
接続部の断面図、第７図は本考案の他の実施例の
半田セツト状態を示す部分斜視図である。
７……基板、８……導体パツド、９……導体パ
ターン、１０……半田スクリーン版、１０ａ……
半田スクリーン版の開口、１０ｂ……半田スクリ
ーン版のエマルジヨン、１１，１４……半田、１
２，１５……オーバガラス、１３……搭載部品。
FIG. 1 is a cross-sectional view of the solder connection part of the mounted component of the present invention, FIG. 2 is a perspective view showing the state before solder setting of the present invention, and FIG. 3 is a partial perspective view showing the solder set state of the present invention. Fig. 4 is a perspective view showing the conventional solder setting state, Fig. 5 is a partial perspective view showing the conventional solder setting state, Fig. 6 is a sectional view of the solder connection part of the conventional mounting component, and Fig. 7. FIG. 3 is a partial perspective view showing a solder set state of another embodiment of the present invention. 7... Board, 8... Conductor pad, 9... Conductor pattern, 10... Solder screen plate, 10a...
Opening of solder screen plate, 10b... Emulsion of solder screen plate, 11, 14... Solder, 1
2, 15...Over glass, 13...Mounted parts.
補正 昭６１．８．１４
図面の簡単な説明を次のように補正する。
明細書第９頁第１行及び第９頁第３行の「半田
セツト前の状態」を「半田印刷前の状態」と補正
する。
明細書第９頁第２行、第９頁第４行及び第９頁
第７行の「半田セツト状態」を「半田印刷後の状
態」と補正する。Amendment August 14, 1981 The brief description of the drawing is amended as follows. The "state before solder setting" in the first line of page 9 and the third line of page 9 of the specification is corrected to "state before solder printing.""Solder set state" on page 9, line 2, page 9, line 4, and page 9, line 7 of the specification are corrected to "state after solder printing."
Claims (1)
ターンを形成し、該導体パターンの導体パツド上
に半田を配置し、該半田上に搭載部品の電極を対
応させて搭載部品を半田接続するものにおいて、
前記導体パツドの中央部にはオーバガラスを塗布
し、該オーバガラスの塗布部分を除く導体パツド
上に半田を配置するようにしたことを特徴とする
搭載部品の半田接続構造。 A conductor pattern is formed on a substrate on which a thick film hybrid integrated circuit is formed, solder is placed on the conductor pads of the conductor pattern, and the electrodes of the mounted components are made to correspond to the solder to connect the mounted components by soldering. In,
A solder connection structure for mounted components, characterized in that an overglass is applied to the center portion of the conductor pad, and solder is placed on the conductor pad except for the area where the overglass is applied.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7353985U JPS61190176U (en) | 1985-05-20 | 1985-05-20 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7353985U JPS61190176U (en) | 1985-05-20 | 1985-05-20 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS61190176U true JPS61190176U (en) | 1986-11-27 |
Family
ID=30613003
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7353985U Pending JPS61190176U (en) | 1985-05-20 | 1985-05-20 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61190176U (en) |
-
1985
- 1985-05-20 JP JP7353985U patent/JPS61190176U/ja active Pending