JPS62162849U - - Google Patents
Info
- Publication number
- JPS62162849U JPS62162849U JP5000986U JP5000986U JPS62162849U JP S62162849 U JPS62162849 U JP S62162849U JP 5000986 U JP5000986 U JP 5000986U JP 5000986 U JP5000986 U JP 5000986U JP S62162849 U JPS62162849 U JP S62162849U
- Authority
- JP
- Japan
- Prior art keywords
- terminal
- printed circuit
- thickness
- circuit board
- leg portion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005476 soldering Methods 0.000 claims description 2
- 210000004899 c-terminal region Anatomy 0.000 claims 1
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Lead Frames For Integrated Circuits (AREA)
Description
第１図と第２図は本考案の端子構造を用いたフ
ラツトタイプハイブリツトＩＣの断面図、第３図
は従来使われている端子構造を用いた、フラツト
タイプハイブリツトＩＣの断面図である。
１……端子、２……ベース基板、３……はさみ
込み部分、４……半田付部、４′……脚部、５…
…プリント基板、５′……配線パターン、６……
ＩＣチツプ、７……カバーキヤツプ。
Figures 1 and 2 are cross-sectional views of a flat type hybrid IC using the terminal structure of the present invention, and Figure 3 is a cross-sectional view of a flat type hybrid IC using the conventional terminal structure. It is. 1... Terminal, 2... Base board, 3... Sandwiching part, 4... Soldering part, 4'... Leg part, 5...
...Printed circuit board, 5'...Wiring pattern, 6...
IC chip, 7...Cover cap.
Claims (1)
板をはさみ込んで取り付けられた外部接続用の端
子において、この端子が前記ベース基板をはさみ
込む部分の下面とこの端子がプリント基板上に半
田付する半田付部の下面との間が少なくともプリ
ント基板面上のプリント配線の厚さより大きくな
る脚部を有することを特徴とするハイブリツトＩ
Ｃの端子構造。 In a terminal for external connection that is attached by sandwiching the base board of a flat type hybrid IC, the bottom surface of the part where this terminal sandwiches the base board, and the bottom surface of the soldering part where this terminal is soldered onto the printed circuit board. A hybrid I characterized in that the leg portion has a leg portion between which the thickness is larger than at least the thickness of the printed wiring on the printed circuit board surface.
C terminal structure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5000986U JPS62162849U (en) | 1986-04-02 | 1986-04-02 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5000986U JPS62162849U (en) | 1986-04-02 | 1986-04-02 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62162849U true JPS62162849U (en) | 1987-10-16 |
Family
ID=30872976
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5000986U Pending JPS62162849U (en) | 1986-04-02 | 1986-04-02 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62162849U (en) |
-
1986
- 1986-04-02 JP JP5000986U patent/JPS62162849U/ja active Pending