JPH0244375U - - Google Patents
Info
- Publication number
- JPH0244375U JPH0244375U JP12280888U JP12280888U JPH0244375U JP H0244375 U JPH0244375 U JP H0244375U JP 12280888 U JP12280888 U JP 12280888U JP 12280888 U JP12280888 U JP 12280888U JP H0244375 U JPH0244375 U JP H0244375U
- Authority
- JP
- Japan
- Prior art keywords
- chip component
- circuit board
- adhesive layer
- solder
- melting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000012790 adhesive layer Substances 0.000 claims description 3
- 229910000679 solder Inorganic materials 0.000 claims description 3
- 238000002844 melting Methods 0.000 claims 2
- 239000000463 material Substances 0.000 claims 1
- 230000008018 melting Effects 0.000 claims 1
- 239000006071 cream Substances 0.000 description 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Details Of Resistors (AREA)
Description
第１図は本考案に係るチツプ部品の構造を示す
斜視図、第２図ａ〜ｄは回路基板に対して本考案
のチツプ部品を実装する工程を示す断面図、第３
図は従来のチツプ部品の構造を示す斜視図、第４
図は従来のチツプ部品の実装例を示す断面図であ
る。
１……チツプ部品、４……電極、５……回路基
板、６……ランド、７……クリーム半田、１１…
…接着層。
FIG. 1 is a perspective view showing the structure of a chip component according to the present invention, FIGS. 2 a to d are sectional views showing the process of mounting the chip component of the present invention on a circuit board, and FIG.
The figure is a perspective view showing the structure of a conventional chip component.
The figure is a sectional view showing an example of mounting a conventional chip component. 1...Chip parts, 4...Electrode, 5...Circuit board, 6...Land, 7...Cream solder, 11...
...adhesive layer.
Claims (1)
プ部品の構造において、前記チツプ部品の両電極
間であつて前記回路基板に対向する部位に熱溶融
性を有する接着層を設け、この接着層は半田の融
点より低い融点をもつ材料によつて形成されてい
ることを特徴とするチツプ部品の構造。 In the structure of a chip component that is surface-mounted on a circuit board by solder, a heat-melting adhesive layer is provided between both electrodes of the chip component at a portion facing the circuit board, and this adhesive layer is A structure of a chip component characterized in that it is formed of a material having a melting point lower than that of solder.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12280888U JPH0244375U (en) | 1988-09-21 | 1988-09-21 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12280888U JPH0244375U (en) | 1988-09-21 | 1988-09-21 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0244375U true JPH0244375U (en) | 1990-03-27 |
Family
ID=31371082
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12280888U Pending JPH0244375U (en) | 1988-09-21 | 1988-09-21 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0244375U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH08172258A (en) * | 1994-12-16 | 1996-07-02 | Sony Chem Corp | Mounting method of electronic component |
-
1988
- 1988-09-21 JP JP12280888U patent/JPH0244375U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH08172258A (en) * | 1994-12-16 | 1996-07-02 | Sony Chem Corp | Mounting method of electronic component |